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STGW40NC60WD

STMicroelectronics

STGW40NC60WD by STMicroelectronics

STGW40NC60WD by STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, 70 A collector current, and a fast turn-off time of 280 ns. Ideal for high-performance switching in industrial systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,456 parts In-Stock

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Vyrian

USA . 2,621 parts In-Stock

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Anansix

USA . 1,648 parts In-Stock

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A&K Electronics

USA . 56 parts In-Stock

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Rotakorn

Sweden . 56 parts In-Stock

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56

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Bristol Electronics

USA . 56 parts In-Stock

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EZ Electronic Parts

Israel . 15 parts In-Stock

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ComSIT Distribution GmbH

Germany . 9 parts In-Stock

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IDEA Electronic Components Group

UK . 2,254 parts In-Stock

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$1.532

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$1.379

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$1.532

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$1.379

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MKK Technologies

India . 1,164 parts In-Stock

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$2.880

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$2.880

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DigiPath Technology Company

USA . 1,164 parts In-Stock

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$2.880

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$2.880

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AZTECH Wire

Italy . 581 parts In-Stock

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$10.130

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Ampacity Inc.

Singapore . 1,482 parts In-Stock

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$27.050

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QUARKTWIN TECHNOLOGY LTD

USA . 10,700 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,103 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Parana Technologies

USA . 1,529 parts In-Stock

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Perfect Parts

USA . 825 parts In-Stock

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Metaverse IC Inc.

Canada . 739 parts In-Stock

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RC Electronics

USA . 605 parts In-Stock

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Corphita

USA . 122 parts In-Stock

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Overview

Unlock the potential of your power control projects with the STGW40NC60WD from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel Insulated Gate Bipolar Transistor (IGBT) combines robust performance and reliability, making it ideal for demanding applications like motor drives and renewable energy systems. With superior thermal management and efficient switching capabilities, this component not only enhances system efficiency but also minimizes downtime, giving you the competitive edge you need!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to moisture, which enhances the reliability of the IGBT in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are generally preferred for power applications due to their higher efficiency and better performance characteristics, making this product ideal for high-power tasks.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode in a single configuration simplifies circuit design and enhances performance, making it suitable for applications requiring quick switching.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT can handle high voltages and currents, making it perfect for power electronics systems.

Package Shape: RECTANGULAR

The rectangular package shape provides effective heat dissipation and optimized space utilization in circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures robust mechanical connections and better handling of high power levels, suitable for industrial applications.

Nominal Turn Off Time (toff): 280 ns

With a turn-off time of 280 ns, this IGBT provides fast switching capabilities, allowing for higher efficiency in pulse-width modulation applications.

No. of Terminals: 3

The 3-terminal design allows for straightforward integration into various circuit configurations while providing reliable electrical connections.

Maximum Power Dissipation (Abs): 250 W

A maximum power dissipation rating of 250 W indicates that this IGBT can handle significant power levels, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design offers enhanced thermal management and mechanical stability, important for high-power applications.

Maximum Operating Temperature: 150 °C

Operating at up to 150 °C allows this IGBT to function effectively in high-temperature environments, expanding its application range.

Maximum Collector-Emitter Voltage: 600 V

With a collector-emitter voltage rating of 600 V, it is suitable for high-voltage applications, providing versatility across various projects.

Transistor Element Material: SILICON

Silicon-based IGBTs are well-established in the industry, offering reliable performance and cost-effectiveness.

Maximum Gate-Emitter Voltage: 20 V

A gate-emitter voltage up to 20 V allows for simple drive circuitry and compatibility with various control devices.

Maximum Collector Current (IC): 70 A

The high collector current rating of 70 A makes this IGBT ideal for heavy-duty loads and applications requiring significant power handling.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

The threshold voltage of 5.75 V is low enough to facilitate easy triggering, enhancing the efficiency of the switching process.

Terminal Finish: TIN

A tin terminal finish promotes good solderability and reliable connections, further ensuring operational stability.

Terminal Position: SINGLE

Single terminal positioning simplifies installation and integration into existing systems, making it user-friendly.

Nominal Turn On Time (ton): 46 ns

A nominal turn-on time of 46 ns indicates quick response times, beneficial for applications requiring fast switching and high frequency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW40NC60WD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

280 ns

Nominal Turn On Time (ton):

46 ns

Trade Compliance

STGW40NC60WD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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