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STGW35NC120HD

STMicroelectronics

STGW35NC120HD by STMicroelectronics

STGW35NC120HD from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 1200 V, 60 A collector current, and a turn-off time of just 928 ns. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,344 parts In-Stock

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4,344

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Digiode

USA . 1,681 parts In-Stock

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1,681

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Anansix

USA . 136 parts In-Stock

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136

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Bristol Electronics

USA . 31 parts In-Stock

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31

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 899 parts In-Stock

1+ parts

$0.803

100+ parts

-

1k+ parts

$0.723

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899

$0.803

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$0.723

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MKK Technologies

India . 1,793 parts In-Stock

1+ parts

$1.510

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1,793

$1.510

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DigiPath Technology Company

USA . 1,793 parts In-Stock

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$1.510

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1,793

$1.510

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.889

100+ parts

$1.719

1k+ parts

$1.549

10k+ parts

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1,000

$1.889

$1.719

$1.549

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AZTECH Wire

Italy . 987 parts In-Stock

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$20.330

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987

$20.330

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Component Stockers USA

USA . 205 parts In-Stock

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$99.990

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205

$99.990

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Corphita

USA . 1,636 parts In-Stock

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1,636

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Parana Technologies

USA . 1,047 parts In-Stock

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$0.960

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1,047

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$0.960

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Perfect Parts

USA . 377 parts In-Stock

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377

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Overview

Unlock the power of innovation with the STGW35NC120HD from STMicroelectronics, a leader in high-performance semiconductor solutions. This robust N-channel IGBT excels in power control applications, delivering superior efficiency and reliability. Designed for demanding environments, its exceptional thermal management ensures peak performance while minimizing downtime. Trust STMicroelectronics to provide unmatched quality and support, empowering your projects to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a good balance between durability and weight, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer better performance characteristics, such as lower on-state resistance and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for enhanced reverse recovery and reduced component count, simplifying circuit design.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in power management systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs while facilitating better thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections and facilitated soldering in high-reliability applications.

Nominal Turn Off Time (toff): 928 ns

A nominal turn-off time of 928 ns enables efficient switching operations, reducing power losses during commutation.

No. of Terminals: 3

Having three terminals simplifies the circuit design and interfacing with other components.

Maximum Power Dissipation (Abs): 220 W

With a high power dissipation capability of 220 W, this IGBT can handle substantial power loads, making it ideal for heavy-duty applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide enhanced thermal performance and ease of installation in variety of systems.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for high-temperature applications, ensuring reliability in demanding environments.

Maximum Collector-Emitter Voltage: 1200 V

The capability to handle up to 1200 V makes this IGBT suitable for high-voltage applications such as industrial drives and power supplies.

Transistor Element Material: SILICON

Silicon material is widely used and provides good thermal and electrical performance, ensuring overall reliability.

Maximum Gate-Emitter Voltage: 25 V

A maximum gate-emitter voltage of 25 V ensures compatibility with standard drive circuits, simplifying system integration.

Maximum Collector Current (IC): 60 A

With a collector current rating of 60 A, this IGBT can effectively manage significant loads in various power applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A threshold voltage of 5.75 V provides better control in switching applications, ensuring predictable performance.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout and reduces the complexity of the design.

Nominal Turn On Time (ton): 41 ns

A nominal turn-on time of 41 ns enhances the device's speed, making it suitable for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW35NC120HD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

25 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

928 ns

Nominal Turn On Time (ton):

41 ns

Trade Compliance

STGW35NC120HD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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