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STGP10NC60S

STMicroelectronics

STGP10NC60S by STMicroelectronics

STGP10NC60S from STMicroelectronics is an N-channel IGBT ideal for motor control applications. It features a max collector-emitter voltage of 600V, a power dissipation of 62.5W, and operates at up to 150 °C. Its fast switching times enhance efficiency in various circuits.

Median Price

$1.850

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 891 parts In-Stock

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$1.014

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891

$1.014

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Chip1Stop

Japan . 894 parts In-Stock

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$1.850

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894

$1.850

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DigiKey

USA . 876 parts In-Stock

1+ parts

$3.440

100+ parts

$1.562

1k+ parts

$1.271

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-

876

$3.440

$1.562

$1.271

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Verical

USA . 891 parts In-Stock

1+ parts

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891

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Digiode

USA . 4,555 parts In-Stock

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$0.952

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4,555

$0.952

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Anansix

USA . 2,622 parts In-Stock

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2,622

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Vyrian

USA . 2,447 parts In-Stock

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2,447

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,004 parts In-Stock

1+ parts

$0.544

100+ parts

-

1k+ parts

$0.489

10k+ parts

-

2,004

$0.544

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$0.489

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Corphita

USA . 3,718 parts In-Stock

1+ parts

$0.902

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3,718

$0.902

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MKK Technologies

India . 2,013 parts In-Stock

1+ parts

$1.022

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2,013

$1.022

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DigiPath Technology Company

USA . 2,013 parts In-Stock

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$1.022

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2,013

$1.022

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Microchip USA

USA . 434 parts In-Stock

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$16.900

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434

$16.900

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Parana Technologies

USA . 2,156 parts In-Stock

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$0.650

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2,156

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$0.650

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Perfect Parts

USA . 1,076 parts In-Stock

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1,076

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Overview

Unlock unrivaled efficiency and reliability with the STGP10NC60S IGBT from STMicroelectronics. Engineered for excellence, this high-performance component excels in motor control applications, ensuring optimal power management in your designs. STMicroelectronics is renowned for its commitment to innovation and quality, delivering robust products that empower engineers to create cutting-edge solutions. Elevate your projects with the precision and durability that only ST can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the IGBT reliable in various conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer better electron mobility and efficiency, making this IGBT suitable for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode simplifies circuits and improves performance in applications such as motor control.

Transistor Application: MOTOR CONTROL

Designed specifically for motor control applications, this IGBT effectively handles voltage and current requirements in such systems.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into compact electronic designs and effective heat dissipation.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust mechanical stability and reliability during soldering, making assembly easier.

Nominal Turn Off Time (toff): 560 ns

A nominal turn-off time of 560 ns enables rapid switching, improving efficiency in high-frequency applications.

No. of Terminals: 3

With three terminals, this IGBT provides a straightforward configuration that simplifies circuit design.

Maximum Power Dissipation (Abs): 62.5 W

The ability to dissipate up to 62.5 W ensures that this IGBT can handle significant power loads without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for better heat management and mechanical mounting, enhancing reliability.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C permits operation in demanding environments without compromising performance.

Maximum Collector-Emitter Voltage: 600 V

A maximum voltage rating of 600 V makes this IGBT versatile for various high-voltage applications.

Transistor Element Material: SILICON

Silicon as the element material ensures good conductivity and efficiency, making it ideal for power electronic applications.

Maximum Gate-Emitter Voltage: 20 V

The 20 V gate-emitter voltage rating allows for compatibility with common gate drive circuitry, enhancing versatility.

Maximum Collector Current (IC): 21 A

With a collector current capacity of 21 A, this IGBT is suitable for driving substantial loads in various applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A threshold voltage of 5.75 V allows for efficient gate control, optimizing performance in switching applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish improves solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: SINGLE

Single terminal positioning simplifies layout and design, making integration into circuits straightforward.

Nominal Turn On Time (ton): 22.5 ns

A fast nominal turn-on time of 22.5 ns enables high-speed switching, resulting in improved overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP10NC60S attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

560 ns

Nominal Turn On Time (ton):

22.5 ns

Trade Compliance

STGP10NC60S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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