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STG3699BVTR

STMicroelectronics

STG3699BVTR by STMicroelectronics

STG3699BVTR by STMicroelectronics is a CMOS SPDT switch with 4 functions, ideal for low-voltage applications. It operates b/w 1.65V and 4.3V, features a max on-state resistance of 1.5Ω, and withstands temperatures from -55 °C to 125 °C. Its compact design suits military-grade electronics efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Netsource Technology, Inc.

USA . 3,000 parts In-Stock

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3,000

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Vyrian

USA . 2,268 parts In-Stock

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2,268

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Flip Electronics

USA . 1,800 parts In-Stock

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Anansix

USA . 1,388 parts In-Stock

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Digiode

USA . 696 parts In-Stock

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696

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Distributors (Availability)

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Microchip USA

USA . 163 parts In-Stock

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$2.377

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163

$2.377

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AZTECH Wire

Italy . 1,060 parts In-Stock

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$8.500

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$8.500

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IDEA Electronic Components Group

UK . 2,004 parts In-Stock

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$11.286

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$10.157

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2,004

$11.286

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$10.157

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MKK Technologies

India . 762 parts In-Stock

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$21.222

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DigiPath Technology Company

USA . 762 parts In-Stock

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$21.222

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762

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Component Stockers USA

USA . 265 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 18,000 parts In-Stock

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Kepictronics

USA . 5,880 parts In-Stock

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Perfect Parts

USA . 4,947 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,225 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,764 parts In-Stock

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GreenTree Electronics

Israel . 1,610 parts In-Stock

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Parana Technologies

USA . 1,238 parts In-Stock

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$13.494

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 105 parts In-Stock

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Overview

Unlock unparalleled performance with the STG3699BVTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality multiplexer excels in various applications, offering seamless integration in compact designs. Its robust 1.8V nominal supply voltage ensures energy efficiency, while exceptional on-state resistance and rapid switching times enhance system reliability. Experience unmatched quality and versatility that elevate your projects to the next level!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for a compact footprint, making it suitable for high-density applications.

No. of Functions: 4

Having four functions provides versatility, allowing the device to perform multiple switching operations efficiently.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage on PCBs, enhancing design flexibility.

Nominal Supply Voltage (Vsup): 1.8 V

A nominal supply voltage of 1.8 V is ideal for low-power applications, prolonging battery life in portable devices.

Power Supplies (V): 1.8/4

This dual voltage capability allows flexibility in various circuit designs, catering to different operating conditions.

No. of Terminals: 16

The availability of 16 terminals enables multiple connections, ensuring compatibility with complex systems.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile of the chip carrier allows for stacking or high-density mounting, ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and performance in harsh environments.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes it suitable for applications in extreme conditions, such as aerospace.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhanced electrical performance.

Terminal Position: QUAD

Quad terminal positioning aids in easy integration into circuit boards, simplifying layout designs.

Output (V): SEPARATE OUTPUT

Separate outputs facilitate independent signal processing, enhancing overall circuit functionality.

Maximum Seated Height: 0.6 mm

The low seated height minimizes the profile of the device, contributing to a sleek overall design.

Width: 1.8 mm

A narrow width increases design flexibility in tight spaces, ideal for miniaturized applications.

Other IC type: SPDT

SPDT (Single Pole, Double Throw) functionality allows for effective switching and routing of signals.

Minimum Supply Voltage (Vsup): 1.65 V

The flexibility to operate at a lower voltage allows for compatibility with a range of low-voltage systems.

Maximum On-state Resistance (Ron): 1.5 ohm

A low on-state resistance ensures minimal power loss and heat generation during operation, enhancing efficiency.

Maximum Switch-on Time: 55 ns

Fast switch-on times improve overall circuit responsiveness, ideal for high-speed applications.

Length: 2.6 mm

A short length maximizes space efficiency on the PCB, which is crucial for compact device designs.

Maximum Switch-off Time: 30 ns

Quick switch-off times contribute to reducing delays in circuit operations, essential for high-performance devices.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability for critical applications in challenging environments.

Technology: CMOS

CMOS technology allows for low power consumption, leading to greater energy efficiency in devices.

Terminal Form: NO LEAD

The no-lead design contributes to a smaller package size while ensuring excellent thermal management.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for tighter layout and denser packing on PCBs, making it suitable for modern electronics.

Maximum Supply Voltage (Vsup): 4.3 V

The capability to handle a maximum supply voltage of 4.3 V offers design flexibility across various applications.

Nominal Off-state Isolation: 64 dB

High off-state isolation reduces crosstalk and improves signal integrity in multi-channel applications.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching characteristic prevents short circuits, ensuring safe operation.

Nominal On-state Resistance Match: 0.15 ohm

Low on-state resistance match promotes consistent signal performance across multiple channels, enhancing reliability.

Technical Specifications

Multiplexers & Switches STG3699BVTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

64 dB

Nominal On-state Resistance Match:

.15 ohm

Maximum On-state Resistance (Ron):

1.5 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.07X.1,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

1.8/4

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

55 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width (mm):

1.8 mm

Trade Compliance

STG3699BVTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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