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STF23NM60N

STMicroelectronics

STF23NM60N by STMicroelectronics

STF23NM60N by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 76A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,236 parts In-Stock

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Digiode

USA . 3,400 parts In-Stock

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3,400

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Anansix

USA . 2,259 parts In-Stock

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2,259

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 767 parts In-Stock

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$1.626

100+ parts

-

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$1.463

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767

$1.626

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$1.463

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MKK Technologies

India . 259 parts In-Stock

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$3.057

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259

$3.057

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DigiPath Technology Company

USA . 259 parts In-Stock

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$3.057

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259

$3.057

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AZTECH Wire

Italy . 1,017 parts In-Stock

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$16.410

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$16.410

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A-Z Elektronik GmbH

Germany . 6,926 parts In-Stock

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6,926

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Alle Elektronik GmbH

Germany . 3,845 parts In-Stock

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Corphita

USA . 1,200 parts In-Stock

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1,200

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Parana Technologies

USA . 538 parts In-Stock

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$1.944

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538

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$1.944

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Elevate your designs with the STF23NM60N from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This powerful N-channel FET is engineered for superior switching performance, making it ideal for industrial applications and energy-efficient systems. With robust reliability and a built-in diode, it offers exceptional value, ensuring longevity and efficiency in your projects. Choose STF23NM60N for unparalleled quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable construction provides good thermal stability and protection against environmental factors, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility, resulting in better efficiency and performance for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode aids in fast switching and provides protection against reverse polarity, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control power and signal with minimal loss.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage makes this FET suitable for high-voltage applications, ensuring it can handle demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape is conducive for easy mounting and heat dissipation, contributing to effective thermal management.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical support and ease of handling in assembly, ideal for various PCB designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low on-resistance and efficient power conversion, making it preferable in modern electronics.

Maximum Pulsed Drain Current (IDM): 76 A

A high pulsed drain current rating indicates the ability to handle transient loads, making it ideal for applications requiring surge capacity.

Avalanche Energy Rating (EAS): 700 mJ

This rating indicates the FET’s capability to withstand energy spikes, providing reliability in unpredictable electrical environments.

Maximum Drain Current (Abs) (ID): 19 A

With a maximum drain current of 19 A, this FET can efficiently manage significant loads, making it suitable for power-sensitive applications.

No. of Terminals: 3

The three-terminal design allows for straightforward connections, facilitating easy integration into various circuit designs.

Maximum Power Dissipation (Abs): 35 W

A power dissipation capability of 35 W enhances thermal performance and reliability, reducing the risk of overheating in high-load conditions.

Package Style (Meter): FLANGE MOUNT

Flange mounting ensures a secure fit and enhances heat dissipation, making it suitable for robust applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency and fast switching performance, essential for modern power management solutions.

Maximum Operating Temperature: 150 °C

The high operating temperature limit expands the potential application range, making it compatible with demanding environments.

Transistor Element Material: SILICON

Silicon as the base material ensures reliability and widespread compatibility with existing electronic systems and applications.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, ensuring longevity in various applications.

Maximum Drain Current (ID): 19 A

Reinforcing performance consistency, this current rating allows for reliable operation in high-demand scenarios.

Maximum Drain-Source On Resistance: 0.18 ohm

Low on-resistance contributes to reduced power losses during operation, enhancing efficiency and thermal management.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and layout, optimizing space within compact electronic assemblies.

Case Connection: ISOLATED

Isolated case connection improves safety by preventing unintentional circuit interactions, enhancing overall device reliability.

Technical Specifications

Power Field Effect Transistors (FET) STF23NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF23NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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