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STF20NF06L

STMicroelectronics

STF20NF06L by STMicroelectronics

STF20NF06L by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 20 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,384 parts In-Stock

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5,384

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Digiode

USA . 2,965 parts In-Stock

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2,965

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ACDS - Activité Composants Distribution Service

France . 2,787 parts In-Stock

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2,787

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Anansix

USA . 1,504 parts In-Stock

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1,504

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$0.671

100+ parts

-

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$0.604

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431

$0.671

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$0.604

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MKK Technologies

India . 2,099 parts In-Stock

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$1.261

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2,099

$1.261

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DigiPath Technology Company

USA . 2,099 parts In-Stock

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$1.261

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2,099

$1.261

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AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$8.640

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619

$8.640

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Perfect Parts

USA . 42,083 parts In-Stock

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42,083

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Cyclops Electronics Ltd (Excess)

UK . 18,787 parts In-Stock

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18,787

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QUARKTWIN TECHNOLOGY LTD

USA . 8,830 parts In-Stock

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8,830

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,437 parts In-Stock

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3,437

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A-Z Elektronik GmbH

Germany . 3,375 parts In-Stock

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3,375

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Corphita

USA . 3,352 parts In-Stock

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3,352

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Parana Technologies

USA . 2,143 parts In-Stock

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$0.802

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2,143

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$0.802

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Overview

Unlock the power of efficiency with the STF20NF06L from STMicroelectronics! Renowned for its exceptional quality and reliability, this N-channel power FET elevates your switching applications to new heights. With a robust design optimized for performance, it delivers impressive energy savings and superior durability. Ideal for diverse sectors, from automotive to industrial, this transistor guarantees optimal operation, empowering you to achieve innovative solutions with unmatched confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides excellent durability and resistance to environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and can offer lower on-resistance, resulting in better performance for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection and simplifies circuit design, making it convenient for use in various electronic systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast response times, making it ideal for power management and control circuits.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60V ensures the FET can handle substantial voltages, increasing its versatility in high-voltage circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows efficient use of space on PCBs, maximizing design flexibility.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and facilitate easy soldering, enhancing overall reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient control of current flow, leading to better energy management in applications.

Maximum Pulsed Drain Current (IDM): 80 A

With a maximum pulsed drain current of 80A, this FET can handle high surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 120 mJ

A high avalanche energy rating indicates reliability in transient conditions, vital for protection circuits.

Maximum Drain Current (Abs) (ID): 20 A

This allows substantial current flow, providing the ability to handle significant power loads efficiently.

No. of Terminals: 3

The three-terminal design simplifies connections and offers flexibility in circuit layout.

Maximum Power Dissipation (Abs): 28 W

A maximum power dissipation of 28W means it can handle high power levels without overheating, ensuring stable performance.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging secures the FET onto heat sinks easily, enabling efficient thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology is known for low power consumption and high-speed operation, improving overall efficiency in circuits.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature makes it suitable for use in extreme conditions, enhancing application flexibility.

Transistor Element Material: SILICON

Silicon-based elements offer great stability and reliability, ensuring consistent performance over time.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the long-term reliability of connections.

Maximum Drain Current (ID): 20 A

Provides the capability to drive substantial loads, crucial for power-intensive applications.

Maximum Drain-Source On Resistance: 0.085 ohm

A low on-resistance minimizes power loss and improves efficiency, making this FET an excellent choice for energy-sensitive designs.

Terminal Position: SINGLE

Single terminal positioning fosters simpler circuit designs and reduces space requirements on PCB layouts.

Case Connection: ISOLATED

An isolated case connection prevents unintentional short circuits and enhances safety during operation.

Technical Specifications

Power Field Effect Transistors (FET) STF20NF06L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF20NF06L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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