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STF21N65M5

STMicroelectronics

STF21N65M5 by STMicroelectronics

STF21N65M5 from STMicroelectronics is a robust N-channel MOSFET designed for efficient switching applications. It features a 650V breakdown voltage, 68A pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

$5.480

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 900 parts In-Stock

1+ parts

$2.780

100+ parts

$2.599

1k+ parts

$2.337

10k+ parts

-

900

$2.780

$2.599

$2.337

-

Chip1Stop

Japan . 900 parts In-Stock

1+ parts

$5.480

100+ parts

$2.770

1k+ parts

$2.460

10k+ parts

-

900

$5.480

$2.770

$2.460

-

Mouser Electronics

USA . 909 parts In-Stock

1+ parts

$5.900

100+ parts

$2.840

1k+ parts

$2.230

10k+ parts

-

909

$5.900

$2.840

$2.230

-

DigiKey

USA . 304 parts In-Stock

1+ parts

$6.000

100+ parts

$2.873

1k+ parts

$2.236

10k+ parts

$2.135

304

$6.000

$2.873

$2.236

$2.135

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$2.522

1k+ parts

$2.268

10k+ parts

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900

-

$2.522

$2.268

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EBV Elektronik

Germany . 400 parts In-Stock

1+ parts

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400

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Avnet

USA . 350 parts In-Stock

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350

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Distributors (In-Stock)

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Digiode

USA . 196 parts In-Stock

1+ parts

$4.294

100+ parts

-

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-

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196

$4.294

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Vyrian

USA . 4,408 parts In-Stock

1+ parts

$4.520

100+ parts

-

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-

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4,408

$4.520

-

-

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TME

Poland . 37 parts In-Stock

1+ parts

$5.490

100+ parts

$3.260

1k+ parts

-

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37

$5.490

$3.260

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

1+ parts

-

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6,000

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NexGen Digital

USA . 5,411 parts In-Stock

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5,411

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Anansix

USA . 1,819 parts In-Stock

1+ parts

-

100+ parts

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1,819

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-

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ComSIT Distribution GmbH

Germany . 900 parts In-Stock

1+ parts

-

100+ parts

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900

-

-

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PC Components Company LLC

USA . 20 parts In-Stock

1+ parts

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20

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 4,312 parts In-Stock

1+ parts

$1.250

100+ parts

$1.180

1k+ parts

$1.150

10k+ parts

-

4,312

$1.250

$1.180

$1.150

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IDEA Electronic Components Group

UK . 530 parts In-Stock

1+ parts

$1.735

100+ parts

-

1k+ parts

$1.562

10k+ parts

-

530

$1.735

-

$1.562

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MKK Technologies

India . 1,059 parts In-Stock

1+ parts

$3.263

100+ parts

-

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1,059

$3.263

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DigiPath Technology Company

USA . 1,059 parts In-Stock

1+ parts

$3.263

100+ parts

-

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-

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1,059

$3.263

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-

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Corphita

USA . 1,862 parts In-Stock

1+ parts

$4.068

100+ parts

-

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1,862

$4.068

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Andel Nordic

Denmark . 3,806 parts In-Stock

1+ parts

$6.396

100+ parts

-

1k+ parts

$6.140

10k+ parts

$6.140

3,806

$6.396

-

$6.140

$6.140

Microchip USA

USA . 2,966 parts In-Stock

1+ parts

$31.850

100+ parts

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2,966

$31.850

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RC Electronics

USA . 15,350 parts In-Stock

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15,350

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S.R.D Solutions

India . 15,000 parts In-Stock

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Perfect Parts

USA . 8,166 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,575 parts In-Stock

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4,575

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Epart123

USA . 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,958 parts In-Stock

1+ parts

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$2.075

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1,958

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$2.075

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Eastek

USA . 950 parts In-Stock

1+ parts

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950

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Overview

Elevate your designs with the STF21N65M5 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This N-channel Power FET delivers exceptional performance for switching applications, ensuring efficient operation with robust reliability. Its versatile design makes it ideal for various industrial and consumer electronics. Experience reduced energy consumption and enhanced thermal management, empowering your projects with quality that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material ensures durability and reliability, protecting the transistor from environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically faster and offer lower on-resistance, making them ideal for high-efficiency switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse polarity and flyback voltage spikes, improving the overall reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET optimizes performance in power electronic systems.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage allows this transistor to handle high voltage applications without failure, providing versatility in design.

Package Shape: RECTANGULAR

The rectangular shape can facilitate more compact circuit designs, making it easier to integrate into dense layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and make the transistor easy to mount on PCBs, enhancing reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption in the off state, making it suitable for energy-efficient designs.

Maximum Pulsed Drain Current (IDM): 68 A

A high pulsed drain current can accommodate demanding transient conditions in circuits, making the FET robust in high-power applications.

Avalanche Energy Rating (EAS): 400 mJ

This rating indicates the ability to withstand transient energy spikes, enhancing the reliability of the device under fault conditions.

Maximum Drain Current (Abs) (ID): 17 A

The maximum drain current rating supports higher loads, making the FET ideal for handling substantial currents in various applications.

No. of Terminals: 3

With three terminals, this FET allows for straightforward integration into circuits while maintaining a compact footprint.

Maximum Power Dissipation (Abs): 30 W

The ability to dissipate significant power ensures the FET can operate efficiently without overheating in most applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide additional stability and support for mounting, which is beneficial in high-vibration environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers fast switching speeds and good thermal performance, making this transistor suitable for modern power applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature expands the operational range, ensuring reliability in extreme environments.

Transistor Element Material: SILICON

Silicon-based transistors are well-established with reliable performance characteristics and are widely used in various applications.

Terminal Finish: MATTE TIN

A matte tin finish provides excellent solderability and corrosion resistance, ensuring long-term performance of the connections.

Maximum Drain Current (ID): 17 A

The dual mention of maximum drain current reinforces the transistor's capability to handle substantial load currents consistently.

Maximum Drain-Source On Resistance: 0.19 ohm

Low on-resistance contributes to high efficiency by minimizing power loss during operation, crucial for power-sensitive applications.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and layout, enabling easier assembly and maintenance.

Case Connection: ISOLATED

Isolated case connections provide enhanced safety and protection against undesired current paths, essential in many applications.

Technical Specifications

Power Field Effect Transistors (FET) STF21N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF21N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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