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STF20NF20

STMicroelectronics

STF20NF20 by STMicroelectronics

STF20NF20 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 200V breakdown voltage, 72A max pulsed drain current, and operates at up to 175 °C. Ideal for power management in various electronic devices.

Median Price

$2.100

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 474 parts In-Stock

1+ parts

$2.100

100+ parts

$0.892

1k+ parts

$0.837

10k+ parts

-

474

$2.100

$0.892

$0.837

-

Mouser Electronics

USA . 4,177 parts In-Stock

1+ parts

$2.110

100+ parts

$0.911

1k+ parts

$0.640

10k+ parts

$0.604

4,177

$2.110

$0.911

$0.640

$0.604

DigiKey

USA . 972 parts In-Stock

1+ parts

$2.140

100+ parts

$0.929

1k+ parts

$0.679

10k+ parts

$0.577

972

$2.140

$0.929

$0.679

$0.577

Arrow

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.539

10k+ parts

$0.525

4,000

-

-

$0.539

$0.525

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.525

10k+ parts

-

4,000

-

-

$0.525

-

Avnet

USA . 1,150 parts In-Stock

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-

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1,150

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,458 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

3,458

$0.999

-

-

-

Digiode

USA . 2,603 parts In-Stock

1+ parts

$1.586

100+ parts

-

1k+ parts

-

10k+ parts

-

2,603

$1.586

-

-

-

TME

Poland . 160 parts In-Stock

1+ parts

$1.930

100+ parts

$1.020

1k+ parts

-

10k+ parts

-

160

$1.930

$1.020

-

-

ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

-

ComSIT USA

USA . 1,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,350

-

-

-

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Cyclops Electronics Ltd

UK . 800 parts In-Stock

1+ parts

-

100+ parts

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800

-

-

-

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Anansix

USA . 766 parts In-Stock

1+ parts

-

100+ parts

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766

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Prism Electronics

USA . 74 parts In-Stock

1+ parts

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74

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LittleDiode

UK . 6 parts In-Stock

1+ parts

-

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-

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,200 parts In-Stock

1+ parts

$1.214

100+ parts

-

1k+ parts

$1.093

10k+ parts

-

1,200

$1.214

-

$1.093

-

Component Stockers USA

USA . 12,379 parts In-Stock

1+ parts

$1.340

100+ parts

$1.090

1k+ parts

$0.850

10k+ parts

-

12,379

$1.340

$1.090

$0.850

-

Corphita

USA . 1,100 parts In-Stock

1+ parts

$1.503

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

$1.503

-

-

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MKK Technologies

India . 1,592 parts In-Stock

1+ parts

$2.284

100+ parts

-

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-

10k+ parts

-

1,592

$2.284

-

-

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DigiPath Technology Company

USA . 1,592 parts In-Stock

1+ parts

$2.284

100+ parts

-

1k+ parts

-

10k+ parts

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1,592

$2.284

-

-

-

Microchip USA

USA . 9,235 parts In-Stock

1+ parts

$12.870

100+ parts

-

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9,235

$12.870

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Kepictronics

USA . 13,000 parts In-Stock

1+ parts

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13,000

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A-Z Elektronik GmbH

Germany . 6,314 parts In-Stock

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6,314

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Perfect Parts

USA . 5,312 parts In-Stock

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5,312

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Epart123

USA . 900 parts In-Stock

1+ parts

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900

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GreenTree Electronics

Israel . 850 parts In-Stock

1+ parts

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850

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Parana Technologies

USA . 696 parts In-Stock

1+ parts

-

100+ parts

$1.452

1k+ parts

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696

-

$1.452

-

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Assy Fe

Spain . 40 parts In-Stock

1+ parts

-

100+ parts

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40

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Overview

Elevate your applications with the STF20NF20 from STMicroelectronics, a leader in innovative solutions. This high-performance N-channel Power FET delivers exceptional reliability and efficiency, ideal for switching applications ranging from industrial to consumer electronics. With robust thermal performance and built-in diode features, it ensures seamless operation even in demanding environments. Trust in ST's commitment to quality and engineering excellence to power your next project with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides durability and protection against environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient and have better performance characteristics than P-channel devices, making this product an excellent choice for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy integration in circuits, offering protection against back EMF in inductive load applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on-off cycles, making it ideal for power supplies and motor control circuits.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage ensures reliability and stability under high voltage conditions, suitable for various power electronics.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on PCBs, optimizing design layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing the reliability of the product in demanding applications.

Operating Mode: ENHANCEMENT MODE

An enhancement mode FET offers lower ON resistance and higher efficiency, making it a preferred choice in many modern applications.

Maximum Pulsed Drain Current (IDM): 72 A

The ability to handle high pulsed drain current allows for effective performance in applications that experience rapid current changes.

Avalanche Energy Rating (EAS): 110 mJ

A high avalanche energy rating helps protect the FET from damage due to voltage transients, enhancing longevity in circuit applications.

Maximum Drain Current (Abs) (ID): 18 A

With a maximum drain current of 18 A, this FET is well-suited for applications requiring substantial current handling.

No. of Terminals: 3

The three-terminal design simplifies circuit integration and allows for versatile configuration in various electronic designs.

Maximum Power Dissipation (Abs): 25 W

A high power dissipation capacity means this FET can operate efficiently in high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design enhances heat dissipation and provides secure mounting, making it suitable for high-performance applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for high-speed operation and low power consumption, making it ideal for contemporary electronic devices.

Maximum Operating Temperature: 175 °C

With a high operating temperature rating, this FET can function effectively in harsh environmental conditions, increasing its application range.

Transistor Element Material: SILICON

Silicon-based transistors provide good thermal stability and are widely used, ensuring compatibility with existing technologies.

Terminal Finish: MATTE TIN

Matte tin finishing enhances solderability and reduces the risk of oxidation, contributing to reliable long-term performance.

Maximum Drain Current (ID): 18 A

The consistent maximum drain current capability underscores reliability in performance across various applications.

Maximum Drain-Source On Resistance: 0.125 ohm

Low on-resistance translates to higher efficiency and lower heat generation, making it ideal for power management in circuits.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and layout, allowing for easier integration into existing circuits.

Case Connection: ISOLATED

An isolated case connection minimizes the risk of short circuits and enhances safety in design applications.

Technical Specifications

Power Field Effect Transistors (FET) STF20NF20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF20NF20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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