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STF20N20

STMicroelectronics

STF20N20 by STMicroelectronics

STF20N20 by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 200V breakdown voltage and max drain current of 18A. It has a low on-resistance of 0.125Ω and operates at up to 150 °C. This versatile transistor is suitable for various power management tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,020 parts In-Stock

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Digiode

USA . 4,612 parts In-Stock

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Anansix

USA . 363 parts In-Stock

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363

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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IDEA Electronic Components Group

UK . 188 parts In-Stock

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$1.365

100+ parts

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$1.229

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188

$1.365

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$1.229

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MKK Technologies

India . 1,110 parts In-Stock

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$2.567

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$2.567

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DigiPath Technology Company

USA . 1,110 parts In-Stock

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$2.567

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$2.567

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AZTECH Wire

Italy . 409 parts In-Stock

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$21.090

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409

$21.090

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Corphita

USA . 4,384 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,052 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 366 parts In-Stock

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$1.632

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Overview

Unlock the power of efficiency with the STF20N20 from STMicroelectronics. Renowned for its exceptional quality and reliability, this N-channel Power FET excels in demanding applications, ensuring seamless switching performance. With robust design features and a commitment to innovation, STMicroelectronics delivers unparalleled value. Elevate your projects with a component that enhances reliability and minimizes energy loss—perfect for automotive, industrial, and consumer electronics. Experience the advantages today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides good thermal stability and reliability, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance in terms of conductivity and efficiency, making them an ideal choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration into circuits and improves surge capabilities, enhancing overall circuit protection.

Transistor Application: SWITCHING

Optimized for switching applications, this FET ensures efficient on/off operation suitable for various electronic devices.

Minimum DS Breakdown Voltage: 200 V

The high breakdown voltage provides increased reliability in high-voltage applications, allowing for safe operation in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape enhances ease of mounting and ensures a compact design that is beneficial for space-constrained applications.

Terminal Form: THROUGH-HOLE

Through-hole technology provides robust mechanical connection and ease of soldering, enhancing the reliability of the component in hardware systems.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for low power consumption in idle states, making it energy-efficient for battery-powered devices.

Maximum Pulsed Drain Current (IDM): 72 A

A high pulsed drain current capability allows for handling of significant surges, making this FET ideal for high-power applications.

Avalanche Energy Rating (EAS): 110 mJ

With a substantial avalanche energy rating, this FET can withstand transient events, ensuring additional safety and reliability.

Maximum Drain Current (Abs) (ID): 18 A

The specification for maximum drain current ensures that the FET can reliably manage high currents, making it suitable for heavy-duty applications.

No. of Terminals: 3

With three terminals, this FET is designed for basic applications while ensuring simplicity in circuit design.

Maximum Power Dissipation (Abs): 25 W

A power dissipation of 25 W enables the device to operate efficiently without excessive overheating, crucial for performance and longevity.

Package Style (Meter): FLANGE MOUNT

Flange mounting allows for easier assembly and stable placement, contributing to enhanced mechanical stability in applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using MOS technology results in high input impedance and low power consumption, making it ideal for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability in demanding environments, making this FET suitable for industrial applications.

Transistor Element Material: SILICON

Silicon is a well-established material for FETs, providing excellent electrical properties and stability under varying environmental conditions.

Terminal Finish: TIN

Tin plating improves solderability and resistance to corrosion, contributing to the durability and reliability of the connections.

Maximum Drain Current (ID): 18 A

This reiteration of the maximum drain current specification highlights the suitability for high-current demand applications.

Maximum Drain-Source On Resistance: 0.125 ohm

Low on-resistance values reduce power losses during operation, increasing efficiency and operational performance across various applications.

Terminal Position: SINGLE

Single terminal positioning facilitates straightforward PCB layout and simplifies the design process in electronic circuits.

Case Connection: ISOLATED

Isolated case connection improves safety by reducing the risk of unwanted electrical connections, ideal for sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF20N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF20N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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