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ST7L19F1MC/XXXE

STMicroelectronics

ST7L19F1MC/XXXE by STMicroelectronics

ST7L19F1MC/XXXE microcontroller from STMicroelectronics features an 8-bit architecture, operates at a max voltage of 5.5V, and supports ADC & PWM channels. With a temp range of -40 °C to 125°C, it's ideal for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,752 parts In-Stock

1+ parts

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2,752

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Vyrian

USA . 2,274 parts In-Stock

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2,274

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Anansix

USA . 414 parts In-Stock

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414

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 35 parts In-Stock

1+ parts

$62.728

100+ parts

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1k+ parts

$56.456

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35

$62.728

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$56.456

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MKK Technologies

India . 2,288 parts In-Stock

1+ parts

$117.957

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2,288

$117.957

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DigiPath Technology Company

USA . 2,288 parts In-Stock

1+ parts

$117.957

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2,288

$117.957

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Corphita

USA . 768 parts In-Stock

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768

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Parana Technologies

USA . 543 parts In-Stock

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$75.001

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543

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$75.001

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Overview

Unlock your innovation potential with the ST7L19F1MC/XXXE microcontroller from STMicroelectronics, a trusted name in cutting-edge technology. Designed for automotive applications, this robust microcontroller delivers exceptional performance with low power consumption, ensuring reliability in even the most demanding environments. Experience seamless integration and versatility for your projects, backed by STMicroelectronics' commitment to quality and excellence. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction offers protection against environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, facilitating compact design.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in various power supply scenarios.

Package Shape: RECTANGULAR

The rectangular package shape enhances compatibility with standard mounting systems, simplifying integration.

Bit Size: 8

An 8-bit architecture is suitable for a wide range of applications, allowing for efficient processing of data.

No. of Terminals: 20

With 20 terminals, this microcontroller offers ample connectivity for various peripheral devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density designs in compact electronic devices.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows for low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, this microcontroller is ideal for automotive and demanding environments.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 °C ensures reliable performance in extreme conditions.

ADC Channels: YES

Having ADC channels enables the microcontroller to read analog signals, broadening its application scope.

Terminal Position: DUAL

Dual terminal positioning supports better routing and helps in optimized PCB layout.

Maximum Seated Height: 2.65 mm

The low seated height allows for compact designs but maintains a reliable connection to the board.

Width: 7.5 mm

A width of 7.5 mm contributes to a slim profile, ideal for space-constrained designs.

Maximum Clock Frequency: 16 MHz

The 16 MHz clock frequency allows for efficient processing and performance in a variety of applications.

Length: 12.8 mm

A manageable length of 12.8 mm permits integration into tight spaces within devices.

Temperature Grade: AUTOMOTIVE

Specifically graded for automotive applications, ensuring reliability in challenging conditions.

Peripheral IC Type: MICROCONTROLLER

Versatility as a microcontroller makes it suitable for multiple applications including control systems.

Technology: CMOS

CMOS technology provides low power consumption, crucial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering during assembly, enhancing manufacturability.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, it is compatible with many standard electronics.

PWM Channels: YES

Presence of PWM channels enables efficient motor control and signal modulation applications.

ROM Programmability: MROM

MROM programmability allows for reliable storage of firmware, essential for embedded applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers compatibility with a wide range of PCB layouts.

Speed: 8 rpm

At 8 rpm, it provides sufficient processing capabilities for numerous control tasks.

No. of I/O Lines: 17

17 I/O lines allow flexible interfacing with various sensors, actuators, and other components.

Technical Specifications

Microcontrollers ST7L19F1MC/XXXE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L19F1MC/XXXE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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