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ST7L19F1MA/XXXRE

STMicroelectronics

ST7L19F1MA/XXXRE by STMicroelectronics

ST7L19F1MA/XXXRE by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates b/w -40 °C to 85°C. It features 4096 ROM words, 256 RAM bytes, and supports ADC/PWM channels. Ideal for industrial applications requiring compact design and reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,504

-

-

-

-

Anansix

USA . 675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

675

-

-

-

-

Digiode

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

125

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,106 parts In-Stock

1+ parts

$37.158

100+ parts

-

1k+ parts

$33.442

10k+ parts

-

1,106

$37.158

-

$33.442

-

MKK Technologies

India . 2,329 parts In-Stock

1+ parts

$69.873

100+ parts

-

1k+ parts

-

10k+ parts

-

2,329

$69.873

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-

-

DigiPath Technology Company

USA . 2,329 parts In-Stock

1+ parts

$69.873

100+ parts

-

1k+ parts

-

10k+ parts

-

2,329

$69.873

-

-

-

Corphita

USA . 2,405 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,405

-

-

-

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Parana Technologies

USA . 125 parts In-Stock

1+ parts

-

100+ parts

$44.428

1k+ parts

-

10k+ parts

-

125

-

$44.428

-

-

Overview

Elevate your projects with the ST7L19F1MA/XXXRE microcontroller from STMicroelectronics, a trusted leader in innovation. Engineered for reliability and versatility, this 8-bit powerhouse excels in industrial applications, offering robust performance across various environments. With its compact design and superior power efficiency, it ensures seamless integration and optimal functionality. Experience unparalleled quality and exceptional value that empowers your designs to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures good protection and reliability for the microcontroller in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

The capability of handling a maximum supply voltage of 5.5 V makes it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and facilitates easier placement alongside other components.

Bit Size: 8

Being an 8-bit microcontroller, it is suitable for a wide range of simple to moderately complex embedded applications.

Power Supplies (V): 5

Operating at a standard 5V supply makes it compatible with a variety of power sources and devices.

No. of Terminals: 20

With 20 terminals, it offers ample connectivity options for I/O lines, peripherals, and other interfaces.

Package Style (Meter): SMALL OUTLINE

The small outline packaging allows for space-efficient designs, making it ideal for compact devices.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum supply voltage of 3V enhances its versatility for battery-operated applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in moderately high-temperature environments.

CPU Family: ST72

The ST72 CPU family is known for its efficiency in various industrial applications, providing a robust performance.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold, down to -40 °C, makes this microcontroller suitable for harsh environmental conditions.

ADC Channels: YES

With ADC channels included, it can process analog signals, making it suitable for sensor interfacing.

Terminal Position: DUAL

The dual terminal position provides flexible mounting options and improves accessibility for connections.

ROM Words: 4096

With 4096 ROM words, it offers sufficient memory for moderately complex programs and applications.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a compact design, making it ideal for space-constrained applications.

Width: 7.5 mm

The compact width enables efficient layouts in modern electronic assemblies.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz allows for decent processing speed and responsiveness in embedded systems.

Length: 12.8 mm

The length is optimized for design efficiency, fitting well in small form-factor devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges, it ensures reliability in demanding industrial applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and peripherals, reducing component count and complexity.

RAM Bytes: 256

With 256 bytes of RAM, it provides sufficient space for simple data processing and temporary storage.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, contributing to energy efficiency.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and excellent mechanical stability.

Maximum Supply Current: 9 mA

A low maximum supply current helps in conserving battery life, making it suitable for portable applications.

Nominal Supply Voltage: 5 V

Operating at a standard nominal supply voltage of 5V simplifies design and power supply considerations.

PWM Channels: YES

PWM channels facilitate control over motors and other devices, enhancing its utility in various applications.

ROM Programmability: MROM

MROM programmability allows for re-programming, providing flexibility in development and deployment.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enhances compatibility with standard PCB design while maintaining a compact form factor.

Speed: 8 rpm

A specified speed of 8 rpm indicates suitability for low-speed applications, ensuring precise control.

No. of I/O Lines: 17

Having 17 I/O lines provides ample interfacing options for sensors, actuators, and other devices, increasing versatility.

Technical Specifications

Microcontrollers ST7L19F1MA/XXXRE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L19F1MA/XXXRE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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