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ST7L19F1MAE

STMicroelectronics

ST7L19F1MAE by STMicroelectronics

ST7L19F1MAE microcontroller from STMicroelectronics operates at a max voltage of 5.5V and features 20 terminals with an 8-bit architecture. It supports ADC and PWM channels, making it ideal for industrial applications in harsh environments (-40 °C to 85 °C). With a compact size and low power consumption, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,455 parts In-Stock

1+ parts

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2,455

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Vyrian

USA . 2,166 parts In-Stock

1+ parts

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1k+ parts

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2,166

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Anansix

USA . 882 parts In-Stock

1+ parts

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882

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 523 parts In-Stock

1+ parts

$29.692

100+ parts

-

1k+ parts

$26.723

10k+ parts

-

523

$29.692

-

$26.723

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MKK Technologies

India . 1,038 parts In-Stock

1+ parts

$55.834

100+ parts

-

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-

10k+ parts

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1,038

$55.834

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DigiPath Technology Company

USA . 1,038 parts In-Stock

1+ parts

$55.834

100+ parts

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1,038

$55.834

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Corphita

USA . 3,676 parts In-Stock

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3,676

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Parana Technologies

USA . 430 parts In-Stock

1+ parts

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100+ parts

$35.501

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430

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$35.501

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Overview

Unlock the power of innovation with the ST7L19F1MAE microcontroller from STMicroelectronics, a trusted leader in semiconductor technology. Designed for versatility and reliability, this 8-bit gem excels in industrial applications, offering robust performance in demanding environments. With a compact footprint and features like ADC and PWM channels, it delivers exceptional value, ensuring your projects achieve peak efficiency while maintaining low power consumption. Experience quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and simplifies assembly, making this microcontroller ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options, making it compatible with various systems.

Package Shape: RECTANGULAR

The rectangular shape optimizes board layout and improves soldering efficiency for high-density applications.

Bit Size: 8

An 8-bit architecture strikes a balance between performance and simplicity, making it suitable for many embedded applications.

Power Supplies (V): 3.3/5

Support for both 3.3 V and 5 V supply voltages enhances design versatility and integration into various systems.

No. of Terminals: 20

A sufficient number of terminals enables multiple functionalities, making the microcontroller capable of handling various input/output requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves PCB space, ideal for compact electronic devices.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V provides operational flexibility and energy efficiency, beneficial for battery-powered applications.

Maximum Operating Temperature: 85 °C

This high operating temperature rating ensures reliability in demanding environments, suitable for industrial applications.

CPU Family: ST7

The ST7 family provides a robust and well-supported architecture, ensuring ease of development and a variety of available resources.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this microcontroller suitable for extreme environments and rugged applications.

ADC Channels: YES

Integrated ADC channels facilitate real-time analog signal processing, expanding the range of applications.

Terminal Position: DUAL

Dual terminal positioning enhances versatility in PCB design, allowing for efficient layouts.

ROM Words: 4096

With 4096 ROM words, applications can store ample code, allowing complex functionality in embedded systems.

Maximum Seated Height: 2.65 mm

A low seated height aids in compact designs, making it ideal for slim electronic devices.

Width: 7.5 mm

A narrow width allows for efficient use of PCB space, which is critical in miniaturized electronic applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient processing speed for many embedded applications.

Length: 12.8 mm

The compact length further minimizes space requirements, enhancing design efficiency.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures the microcontroller performs reliably in harsh conditions.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller allows this IC to handle both processing and control functions seamlessly.

RAM Bytes: 256

With 256 bytes of RAM, it can handle multiple tasks and data requirements effectively, suitable for various applications.

Technology: CMOS

CMOS technology offers low power consumption, making this microcontroller energy-efficient for prolonged usage.

Terminal Form: GULL WING

Gull wing terminals provide stable soldering and improved thermal performance, ensuring reliability and durability.

Maximum Supply Current: 9 mA

A low maximum supply current of 9 mA contributes to the microcontroller's energy efficiency, advantageous for battery-operated devices.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V is common in many applications, ensuring easy integration with existing components.

PWM Channels: YES

Integrated PWM channels allow for precise control of motors and other actuators, expanding the range of applications.

ROM Programmability: MROM

MROM programming allows for efficient use of memory resources, making it easier to update and modify applications when needed.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports more compact board designs while ensuring reliable solder connections.

Speed: 8 rpm

The specified speed can effectively support low-speed applications, making it suitable for control tasks.

No. of I/O Lines: 17

Having 17 I/O lines enables extensive interfacing capabilities, allowing the microcontroller to connect with multiple devices.

Technical Specifications

Microcontrollers ST7L19F1MAE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L19F1MAE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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