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ST7L15F1MB/XXXE

STMicroelectronics

ST7L15F1MB/XXXE by STMicroelectronics

ST7L15F1MB/XXXE microcontroller from STMicroelectronics features an 8-bit architecture, operates at a max voltage of 5.5V, and supports up to 16 MHz clock frequency. With industrial-grade temp range (-40 °C to 105 °C), it's ideal for robust applications. Its dual terminal design includes ADC and PWM channels for versatile control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,347 parts In-Stock

1+ parts

-

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1,347

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Anansix

USA . 1,123 parts In-Stock

1+ parts

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1k+ parts

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1,123

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Vyrian

USA . 753 parts In-Stock

1+ parts

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753

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,937 parts In-Stock

1+ parts

$14.159

100+ parts

-

1k+ parts

$12.743

10k+ parts

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1,937

$14.159

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$12.743

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MKK Technologies

India . 399 parts In-Stock

1+ parts

$26.625

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-

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399

$26.625

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DigiPath Technology Company

USA . 399 parts In-Stock

1+ parts

$26.625

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399

$26.625

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Corphita

USA . 4,495 parts In-Stock

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4,495

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Parana Technologies

USA . 385 parts In-Stock

1+ parts

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$16.929

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385

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$16.929

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Overview

Unlock a world of innovation with the ST7L15F1MB/XXXE microcontroller from STMicroelectronics, renowned for its commitment to quality and reliability. This versatile chip is perfect for applications ranging from industrial automation to consumer electronics, delivering outstanding performance in harsh environments. With its compact design and low power consumption, it offers exceptional value, empowering your projects with efficiency and precision. Choose STMicroelectronics for trusted technology that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for long-term applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and easier integration into compact designs.

Maximum Supply Voltage: 5.5 V

This voltage range allows for flexibility in various applications without the risk of damage to the microcontroller.

Package Shape: RECTANGULAR

Rectangular packages provide efficient space utilization on printed circuit boards, allowing for optimal layout.

Bit Size: 8

An 8-bit architecture is ideal for simple control applications, providing a balance of performance and complexity.

No. of Terminals: 20

With 20 terminals, the microcontroller offers sufficient I/O options for moderate complexity projects.

Package Style (Meter): SMALL OUTLINE

Small outline packages are space-efficient, making them perfect for handheld and compact devices.

Minimum Supply Voltage: 3 V

A low minimum supply voltage allows for energy-efficient operation in battery-powered applications.

Maximum Operating Temperature: 105 °C

The high temperature tolerance ensures reliability and operability in harsh industrial environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, this microcontroller is suitable for outdoor and extreme environment applications.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface directly with analog sensors, broadening its application range.

Terminal Position: DUAL

Dual terminal positioning simplifies board layout and soldering processes, improving production efficiency.

Maximum Seated Height: 2.65 mm

A low seated height allows for compact designs and reduces the overall profile of the electronic assembly.

Width: 7.5 mm

A slim width contributes to space savings in crowded circuits, ideal for modern electronics.

Maximum Clock Frequency: 16 MHz

Supporting a decent clock frequency enhances computational speed, allowing for responsive application performance.

Length: 12.8 mm

Its compact length enhances miniaturization potential in product design, meeting the needs of space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating guarantees performance stability and longevity under challenging conditions.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller tasks, ensuring optimal performance in control applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and connection in automated assembly processes.

Nominal Supply Voltage: 5 V

Operating at a common nominal voltage simplifies power supply design and integration into existing systems.

PWM Channels: YES

The inclusion of PWM channels allows for efficient control of motors and lights, expanding its use in automation.

ROM Programmability: MROM

MROM (Mask ROM) provides a reliable solution for fixed-function applications where reprogramming is not required.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch strikes a balance between ease of soldering and minimizing space requirements on PCBs.

Speed: 8 rpm

Operating at 8 rpm may be suitable for specific lower-speed applications, providing energy efficiency.

No. of I/O Lines: 17

Having 17 I/O lines provides ample connectivity options for interfacing with various peripherals and components.

Technical Specifications

Microcontrollers ST7L15F1MB/XXXE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L15F1MB/XXXE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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