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ST7L34F2MAE/XXX

STMicroelectronics

ST7L34F2MAE/XXX by STMicroelectronics

ST7L34F2MAE/XXX microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, supporting supply voltages from 3 to 5.5 V. It includes 7 ADC channels and operates in industrial temperatures (-40 °C to 85 °C). Ideal for embedded applications, it offers robust connectivity and peripherals like timers and PWM.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,041 parts In-Stock

1+ parts

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100+ parts

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3,041

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Vyrian

USA . 2,107 parts In-Stock

1+ parts

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1k+ parts

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2,107

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Anansix

USA . 320 parts In-Stock

1+ parts

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320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,066 parts In-Stock

1+ parts

$53.238

100+ parts

-

1k+ parts

$47.914

10k+ parts

-

2,066

$53.238

-

$47.914

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MKK Technologies

India . 2,278 parts In-Stock

1+ parts

$100.110

100+ parts

-

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2,278

$100.110

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DigiPath Technology Company

USA . 2,278 parts In-Stock

1+ parts

$100.110

100+ parts

-

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-

10k+ parts

-

2,278

$100.110

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-

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Parana Technologies

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

$63.654

1k+ parts

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1,600

-

$63.654

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Corphita

USA . 1,543 parts In-Stock

1+ parts

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1,543

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Overview

Unlock endless possibilities with the ST7L34F2MAE/XXX microcontroller from STMicroelectronics, a trusted leader in innovative semiconductor solutions. Designed for precision and efficiency, this 8-bit powerhouse is perfect for industrial applications where reliability and performance are key. With low power consumption and versatile connectivity options, it enables seamless integration into your next project, ensuring you stay ahead of the competition while maximizing value and minimizing costs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, making it easier to integrate into compact electronic designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for powering the device with commonly available power supplies.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to organized PCB layout, facilitating better signal integrity and thermal performance.

Bit Size: 8

An 8-bit architecture is suitable for a variety of applications, particularly in control and data processing tasks that do not require extensive computational power.

Power Supplies (V): 3.3/5

Support for both 3.3 V and 5 V power supplies expands application versatility, allowing for easier integration into existing systems.

No. of Terminals: 20

Having 20 terminals provides adequate connectivity options for interfacing with various devices and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style is optimized for space-saving designs, ideal for compact applications.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3 V, it can operate efficiently in low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

An operating temperature limit of 85 °C allows the microcontroller to function reliably in high-temperature environments.

CPU Family: ST72

Part of the ST72 family, this microcontroller benefits from established technology with a supportive ecosystem for development.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes the device suitable for industrial applications and harsh environments.

Terminal Finish: TIN

TIN terminal finishing promotes good solderability and enhances the longevity of connections on PCBs.

ADC Channels: YES

Integrated ADC channels provide the capability to read analog signals, enhancing the versatility of the device in various applications.

Terminal Position: DUAL

Dual terminal positioning allows for efficient layout and assembly processes, simplifying integration with other components.

ROM Words: 8192

With 8192 ROM words, it can store considerable program data, facilitating complex applications.

Maximum Seated Height: 2.65 mm

A low seated height allows for more compact designs, making the microcontroller a fit for slimmer applications.

Width: 7.5 mm

Its narrow width aids in fitting into tight spaces on PCBs, enhancing layout flexibility.

Peripherals: TIMER(5)

The inclusion of 5 timers is advantageous for time-based control processes, making it well-suited for automation tasks.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz balances processing speed and power consumption, suitable for a wide range of applications.

Length: 12.8 mm

Compact dimensions support space-efficient design, making the product ideal for both portable and embedded applications.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this microcontroller is reliable in demanding environments, ensuring long-term performance.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functionalities, reducing the need for additional components and complexity.

RAM Bytes: 384

With 384 bytes of RAM, it supports sufficient data handling for most embedded applications.

Technology: CMOS

CMOS technology offers low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form factor is widely recognized for ease of soldering and robust mechanical support.

Analog To Digital Convertors: 7-Ch 10-Bit

7-channel 10-bit ADC capability enables detailed analog signal processing, crucial for sensor applications.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA allows for the operation of more power-intensive peripherals connected to the microcontroller.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is becoming the standard, ensuring compatibility with many modern components.

PWM Channels: YES

PWM capabilities enable control of motors and other devices, making it versatile for control applications.

Connectivity: SPI

Supported SPI connectivity facilitates fast and reliable communication with other devices, enhancing system integration.

ROM Programmability: MROM

MROM programmability allows for easy updates and modifications to the firmware, improving adaptability.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch optimizes compatibility with many PCB designs, ensuring easier integration.

Speed: 8 rpm

Supporting operational speeds of 8 rpm is suitable for low-speed applications where precision is important.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides sufficient data handling capabilities for most embedded systems.

No. of I/O Lines: 15

Fifteen I/O lines allow for a good number of interfaces, enabling interaction with various sensors and devices.

Technical Specifications

Microcontrollers ST7L34F2MAE/XXX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7L34F2MAE/XXX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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