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ST7L15F1MB/XXXRE

STMicroelectronics

ST7L15F1MB/XXXRE by STMicroelectronics

ST7L15F1MB/XXXRE microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C and 105 °C. It supports ADC and PWM channels, making it ideal for industrial applications. With a compact SO package, it ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,269 parts In-Stock

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2,269

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Anansix

USA . 1,010 parts In-Stock

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1,010

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Digiode

USA . 907 parts In-Stock

1+ parts

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907

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,698 parts In-Stock

1+ parts

$69.308

100+ parts

-

1k+ parts

$62.377

10k+ parts

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1,698

$69.308

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$62.377

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MKK Technologies

India . 1,071 parts In-Stock

1+ parts

$130.330

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1,071

$130.330

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DigiPath Technology Company

USA . 1,071 parts In-Stock

1+ parts

$130.330

100+ parts

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1,071

$130.330

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Corphita

USA . 4,370 parts In-Stock

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4,370

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Parana Technologies

USA . 2,280 parts In-Stock

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$82.868

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2,280

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$82.868

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Overview

Unlock the potential of your next project with the ST7L15F1MB/XXXRE microcontroller from STMicroelectronics! Renowned for its reliability and innovation, STMicroelectronics delivers exceptional quality and performance. This versatile 8-bit microcontroller is perfect for a range of applications, from industrial automation to consumer electronics. Enjoy efficient power management, robust design, and ease of integration, enhancing your development process while ensuring long-term value. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern circuit boards, enhancing versatility in applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply selection, catering to various project requirements.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating better layout options.

Bit Size: 8

An 8-bit architecture is sufficient for a wide range of applications, striking a good balance between computational power and simplicity.

Power Supplies (V): 5

Operating on a standard 5 V power supply simplifies design and implementation, ensuring compatibility with other components.

No. of Terminals: 20

With 20 terminals, it provides sufficient connectivity for multiple input/output operations, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for space-efficient designs while maintaining performance and functionality.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures versatility in operation, accommodating various powering conditions.

Maximum Operating Temperature: 105 °C

Ability to operate at 105 °C makes it suitable for industrial applications, ensuring reliability under high-temperature conditions.

CPU Family: ST72

Belonging to the ST72 family allows for a proven and reliable platform, with extensive documentation and support.

Minimum Operating Temperature: -40 °C

The extended temperature range (-40 °C) indicates suitability for extreme environmental conditions, hence ideal for outdoor or challenging conditions.

ADC Channels: YES

Integrated ADC channels provide the ability to interface with analog sensors, expanding application potential in automation and control systems.

Terminal Position: DUAL

Dual terminal positioning allows for easier connectivity options in circuit design, enhancing the integration process.

ROM Words: 4096

With 4096 ROM words, it offers sufficient memory for program storage, allowing for complex algorithms and control processes.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a more compact design, facilitating slim profile products.

Width: 7.5 mm

A compact width allows for applications in space-constrained environments.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, it provides reliable performance for a variety of microcontroller tasks.

Length: 12.8 mm

The small length further emphasizes the compact design, making it a suitable choice for portable applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in extreme conditions, suitable for harsh environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates processing capabilities with peripheral functionalities, reducing component count.

RAM Bytes: 256

256 bytes of RAM provide ample space for temporary data storage during operations, supporting more complex processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, making it ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve reliability, simplifying the assembly process in manufacturing.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA makes it energy-efficient, especially important for battery-operated devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with common electronic components, ensuring seamless integration.

PWM Channels: YES

PWM channels allow for control of motors and other devices, expanding its utility in automation and robotics.

ROM Programmability: MROM

MROM programmability allows for easy updates to the firmware, ensuring the microcontroller can adapt to changes over time.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm fits well with industry-standard components, ensuring compatibility and ease of connection.

Speed: 8 rpm

A speed of 8 rpm in control applications signifies stability and precision in output drive systems.

No. of I/O Lines: 17

With 17 I/O lines, it provides ample input and output options for interfacing with a variety of sensors and actuators.

Technical Specifications

Microcontrollers ST7L15F1MB/XXXRE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L15F1MB/XXXRE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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