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ST7L19F1MB/XXXRE

STMicroelectronics

ST7L19F1MB/XXXRE by STMicroelectronics

ST7L19F1MB/XXXRE microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 105 °C. It supports ADC and PWM channels, making it ideal for industrial applications. With a compact SO package and low power consumption, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,545 parts In-Stock

1+ parts

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4,545

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Digiode

USA . 3,463 parts In-Stock

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3,463

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Anansix

USA . 2,782 parts In-Stock

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2,782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 419 parts In-Stock

1+ parts

$72.723

100+ parts

-

1k+ parts

$65.451

10k+ parts

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419

$72.723

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$65.451

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MKK Technologies

India . 1,803 parts In-Stock

1+ parts

$136.751

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1,803

$136.751

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DigiPath Technology Company

USA . 1,803 parts In-Stock

1+ parts

$136.751

100+ parts

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1,803

$136.751

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Corphita

USA . 4,891 parts In-Stock

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4,891

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Parana Technologies

USA . 155 parts In-Stock

1+ parts

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$86.952

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155

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$86.952

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Overview

Unlock the potential of your projects with the ST7L19F1MB/XXXRE microcontroller from STMicroelectronics, a leader in semiconductor innovation. Designed for versatility, this robust 8-bit MCU excels in industrial applications, ensuring reliable performance in challenging environments. Benefit from low power consumption, extensive I/O options, and built-in ADC capabilities, making it perfect for automation and control systems. Elevate your designs with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, ideal for modern electronic devices.

Maximum Supply Voltage: 5.5 V

Operating at a maximum of 5.5 V ensures compatibility with a wide range of power supply options.

Package Shape: RECTANGULAR

The rectangular shape provides a standard footprint, making it easy to integrate into existing designs.

Bit Size: 8

The 8-bit architecture is well-suited for a variety of tasks, especially in embedded applications where simplicity and efficiency are key.

Power Supplies (V): 5

Designed for 5V power supply systems, making it a common choice for various embedded and consumer electronics.

No. of Terminals: 20

With 20 terminals, this microcontroller offers multiple connectivity options while remaining compact.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications with space constraints.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V enhances flexibility in battery-powered applications.

Maximum Operating Temperature: 105 °C

The high operating temperature provides reliability in industrial applications where heat resistance is crucial.

CPU Family: ST72

Belonging to the ST72 family, this microcontroller benefits from a proven track record and wide industry support.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is suitable for harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, which is essential for many sensor applications.

Terminal Position: DUAL

Dual terminal position enhances flexibility in circuit design and layout.

ROM Words: 4096

With 4096 ROM words, it provides ample memory for code storage, suitable for complex applications.

Maximum Seated Height: 2.65 mm

The low profile makes it suitable for compact systems where height is a limiting factor.

Width: 7.5 mm

A width of 7.5 mm allows for versatile placements on PCBs without taking excessive space.

Maximum Clock Frequency: 16 MHz

The 16 MHz clock frequency enables faster processing and responsiveness in applications.

Length: 12.8 mm

Short length accommodates tight layouts while providing necessary functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grades signify robustness and reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates CPU, memory, and I/O in a single chip, optimizing design efficiency.

RAM Bytes: 256

256 bytes of RAM allow for efficient data storage during processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption, making this microcontroller suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and stable connections to the PCB.

Maximum Supply Current: 9 mA

With a low maximum supply current, this microcontroller is energy efficient, enhancing battery life.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V simplifies power supply design and compatibility.

PWM Channels: YES

PWM channels support motor control and other applications, enhancing the microcontroller's versatility.

ROM Programmability: MROM

MROM programming allows customization, making it suitable for various applications and user-specific requirements.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm facilitates compact designs while still allowing for manual or automated soldering.

Speed: 8 rpm

The specified speed parameters indicate its suitability for control applications, giving users efficient processing capabilities.

No. of I/O Lines: 17

With 17 I/O lines, it supports a variety of peripherals, expanding its application potential.

Technical Specifications

Microcontrollers ST7L19F1MB/XXXRE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L19F1MB/XXXRE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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