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ST7L19F1MB/XXXE

STMicroelectronics

ST7L19F1MB/XXXE by STMicroelectronics

ST7L19F1MB/XXXE microcontroller from STMicroelectronics features an 8-bit architecture, operates at a max voltage of 5.5V, and supports ADC and PWM channels. With a compact SO package, it's ideal for industrial applications requiring reliable performance in harsh environments. Its operating temp range is -40 °C to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,222 parts In-Stock

1+ parts

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4,222

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Anansix

USA . 2,405 parts In-Stock

1+ parts

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2,405

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Vyrian

USA . 1,139 parts In-Stock

1+ parts

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1,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,651 parts In-Stock

1+ parts

$33.379

100+ parts

-

1k+ parts

$30.041

10k+ parts

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1,651

$33.379

-

$30.041

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MKK Technologies

India . 560 parts In-Stock

1+ parts

$62.768

100+ parts

-

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560

$62.768

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DigiPath Technology Company

USA . 560 parts In-Stock

1+ parts

$62.768

100+ parts

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560

$62.768

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Corphita

USA . 3,682 parts In-Stock

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3,682

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Parana Technologies

USA . 821 parts In-Stock

1+ parts

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100+ parts

$39.910

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821

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$39.910

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Overview

Unlock the potential of your projects with the ST7L19F1MB/XXXE microcontroller from STMicroelectronics, renowned for its reliability and innovation. Designed for industrial applications, this robust 8-bit solution thrives in demanding environments, ensuring seamless performance from -40 °C to 105 °C. Experience enhanced control with versatile ADC and PWM channels, empowering you to create smarter, more efficient systems. Choose STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body enhances durability and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of board space, making assembly easier and cost-effective.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard power supply systems in various applications.

Package Shape: RECTANGULAR

Rectangular package shape optimizes layout on PCBs and improves cooling efficiency.

Bit Size: 8

8-bit architecture is suitable for a wide range of applications, providing a good balance between performance and resource efficiency.

No. of Terminals: 20

With 20 terminals, this microcontroller can support multiple I/O functions while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

Small outline package style enhances board density and is widely accepted in electronic designs.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows operation in lower power environments, ideal for battery-powered devices.

Maximum Operating Temperature: 105 °C

Operating at temperatures up to 105 °C makes this microcontroller suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

The ability to function at temperatures as low as -40 °C ensures reliability in extreme conditions, essential for outdoor applications.

ADC Channels: YES

Integrated ADC channels allow for direct sensor interfacing, enhancing the versatility of applications.

Terminal Position: DUAL

Dual terminal positions enhance flexibility in mounting and design for PCB layout.

Maximum Seated Height: 2.65 mm

A low maximum seated height contributes to a slim profile, ideal for space-constrained applications.

Width: 7.5 mm

The compact width allows for higher density designs without sacrificing performance.

Maximum Clock Frequency: 16 MHz

With a clock frequency of 16 MHz, this microcontroller can handle moderate processing tasks efficiently.

Length: 12.8 mm

Compact length streamlines designs, making it suitable for various embedded applications.

Temperature Grade: INDUSTRIAL

Industrial grade components ensure higher reliability for long-term use in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates essential functions that streamline electronic designs with minimal external components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering and reliability in electronic assembly.

Nominal Supply Voltage: 5 V

A nominal voltage of 5 V aligns well with common supply systems, simplifying power integration.

PWM Channels: YES

PWM channels enable efficient motor control and power regulation for a wide range of applications.

ROM Programmability: MROM

MROM programmability supports flexibility in applications, allowing for easy updates and modifications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch provides ease of handling and assembly, suitable for various manufacturing processes.

Speed: 8 rpm

At a speed of 8 rpm, this microcontroller can be effectively used in applications requiring controlled movements.

No. of I/O Lines: 17

Seventeen I/O lines facilitate extensive interfacing capabilities, supporting multiple peripherals and sensors.

Technical Specifications

Microcontrollers ST7L19F1MB/XXXE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L19F1MB/XXXE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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