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ST7L34F2MARE/XXX

STMicroelectronics

ST7L34F2MARE/XXX by STMicroelectronics

ST7L34F2MARE/XXX microcontroller from STMicroelectronics features an 8-bit architecture, operates b/w 3-5.5V, and supports up to 16 MHz clock frequency. With 7 ADC channels and industrial-grade temperature range (-40 °C to 85 °C), it's ideal for embedded applications. Its compact design (20 terminals) ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 880 parts In-Stock

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880

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Anansix

USA . 547 parts In-Stock

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547

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Vyrian

USA . 493 parts In-Stock

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493

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,193 parts In-Stock

1+ parts

$39.876

100+ parts

-

1k+ parts

$35.888

10k+ parts

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2,193

$39.876

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$35.888

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MKK Technologies

India . 2,256 parts In-Stock

1+ parts

$74.983

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2,256

$74.983

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DigiPath Technology Company

USA . 2,256 parts In-Stock

1+ parts

$74.983

100+ parts

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2,256

$74.983

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Corphita

USA . 2,324 parts In-Stock

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2,324

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Parana Technologies

USA . 1,367 parts In-Stock

1+ parts

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100+ parts

$47.677

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1,367

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$47.677

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Overview

Unlock the potential of your projects with the ST7L34F2MARE/XXX microcontroller from STMicroelectronics. Renowned for its unparalleled quality and reliability, this compact powerhouse is perfect for a wide range of applications—from industrial automation to consumer electronics. With a robust design that withstands extreme temperatures and offers excellent performance, you’ll enjoy seamless integration, energy efficiency, and advanced features that drive innovation forward. Embrace the future with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy ensures durability and protection against environmental factors, making the microcontroller reliable for various applications.

Surface Mount: YES

Being surface mount enables easier integration onto PCBs, saving space and allowing for more compact designs.

Maximum Supply Voltage: 5.5 V

This high maximum supply voltage allows for flexibility in powering the device with various sources, enhancing versatility in its applications.

Package Shape: RECTANGULAR

A rectangular shape aids in efficient layout design on circuit boards, optimizing the use of space and enabling better airflow.

Bit Size: 8

An 8-bit architecture is suitable for a wide range of control applications and is often easier to program.

No. of Terminals: 20

20 terminals provide ample connectivity options for interfacing with other components, enhancing the microcontroller's functionality.

Package Style (Meter): SMALL OUTLINE

The small outline style makes it ideal for space-constrained applications in consumer electronics and industrial devices.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum of 3V makes it suitable for low-power applications, promoting energy efficiency.

Maximum Operating Temperature: 85 °C

Operating at high temperatures expands the range of environments in which the microcontroller can be used, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

Extremely low operational temperatures enable use in harsh environments, making it versatile for outdoor and extreme condition applications.

ADC Channels: YES

The presence of ADC channels allows for the processing of analog signals, enhancing the microcontroller's capability in sensing and control applications.

Terminal Position: DUAL

Dual terminal positioning can simplify PCB design and optimize layout for additional components, enhancing overall circuit efficiency.

ROM Words: 8192

A sizable ROM capacity allows for complex programs to be stored, making the microcontroller capable of handling sophisticated tasks.

Maximum Seated Height: 2.65 mm

A low seated height facilitates integration into slim and compact devices, essential in modern electronics design.

Width: 7.5 mm

A compact width permits more efficient arrangements on PCB layouts and improves the feasibility of miniaturized electronic products.

Peripherals: TIMER(5), WDT

The configuration with multiple timers and a watchdog timer supports complex timing and safety functionalities in control processes.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate processing power for various applications without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 40

The capacity to withstand peak reflow soldering conditions is essential for reliable manufacturing processes in electronics.

Peak Reflow Temperature °C: 260

A high reflow temperature tolerance allows compatibility with modern soldering techniques, ensuring robust manufacturing practices.

Length: 12.8 mm

A moderate length helps maintain a compact design while still providing sufficient connectivity options for various applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grading, it ensures reliability in demanding environments, suitable for professional applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control functionalities, making it ideal for numerous embedded system applications.

RAM Bytes: 384

With 384 bytes of RAM, it can efficiently handle moderate data processing, balancing performance with resource consumption.

Technology: CMOS

CMOS technology offers low power consumption and high density, leading to efficient designs and extended battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and assembly, enhancing manufacturing efficiency.

Analog To Digital Converters: 7-Ch 10-Bit

Having multiple ADC channels expands the microcontroller's ability to handle various input sensors, enhancing its versatility.

Nominal Supply Voltage: 3.3 V

Nominal operation at 3.3 V strikes a balance between performance and power consumption, ideal for battery-operated devices.

PWM Channels: YES

Inclusion of PWM channels increases its functionality for motor control and other applications requiring variable signal outputs.

Connectivity: SPI

SPI connectivity allows for fast and reliable data transfer with other digital devices, supporting a rich ecosystem of components.

ROM Programmability: MROM

MROM programmability supports efficient and quick program updates, facilitating development and iteration in applications.

Terminal Pitch: 1.27 mm

A pitch of 1.27 mm allows for high-density PCB design, making it suitable for modern electronics that require compact arrangements.

Speed: 8 rpm

Although unspecified in typical microcontroller applications, speed indicates potential performance characteristics beneficial for specific control systems.

On Chip Program ROM Width: 8

An 8-bit program ROM enables efficient execution of instructions tailored to the device's architecture, enhancing performance.

No. of I/O Lines: 15

Fifteen I/O lines allow for extensive interfacing options with external components, broadening the range of applications.

Technical Specifications

Microcontrollers ST7L34F2MARE/XXX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(5), WDT

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

ST7L34F2MARE/XXX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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