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ST7L15F1MC/XXXE

STMicroelectronics

ST7L15F1MC/XXXE by STMicroelectronics

ST7L15F1MC/XXXE microcontroller from STMicroelectronics operates at 3-5.5 V with a max clock frequency of 16 MHz, featuring 17 I/O lines and ADC channels. Its automotive-grade design ensures reliability in extreme temperatures (-40 °C to 125°C). Ideal for embedded applications requiring compact, efficient control solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,331 parts In-Stock

1+ parts

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3,331

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Anansix

USA . 1,875 parts In-Stock

1+ parts

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1,875

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Vyrian

USA . 1,528 parts In-Stock

1+ parts

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1,528

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,877 parts In-Stock

1+ parts

$28.104

100+ parts

-

1k+ parts

$25.294

10k+ parts

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1,877

$28.104

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$25.294

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MKK Technologies

India . 1,242 parts In-Stock

1+ parts

$52.848

100+ parts

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1,242

$52.848

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DigiPath Technology Company

USA . 1,242 parts In-Stock

1+ parts

$52.848

100+ parts

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1,242

$52.848

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Corphita

USA . 1,077 parts In-Stock

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1,077

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Parana Technologies

USA . 938 parts In-Stock

1+ parts

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100+ parts

$33.603

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938

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$33.603

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Overview

Unlock your project's potential with the ST7L15F1MC/XXXE microcontroller from STMicroelectronics, a trusted leader in innovative semiconductor solutions. Designed for versatility and reliability, this 8-bit marvel excels in automotive applications, ensuring robust performance under extreme conditions. With efficient power consumption and integrated ADC channels, it empowers your designs to achieve optimal functionality, providing unmatched value and seamless integration in every application. Choose quality; choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount design allows for compact assembly and efficient use of PCB space, which is advantageous in modern electronics.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely in various applications without risking damage from overvoltage.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient layout and routing on PCBs, helping to streamline design processes.

Bit Size: 8

The 8-bit architecture is versatile for a range of applications where cost-effective processing is required.

No. of Terminals: 20

With 20 terminals, this microcontroller offers sufficient I/O options for various peripheral device connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for reduced space on circuit boards, ideal for compact designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with battery-operated devices, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

Operational capability up to 125 °C makes it suitable for high-temperature environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

Rated for operation at -40 °C ensures reliability in extreme conditions, crucial for automotive and industrial applications.

ADC Channels: YES

Integrated ADC channels facilitate easy analog signal processing, increasing functionality in sensor applications.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility by allowing for various PCB layouts and configurations.

Maximum Seated Height: 2.65 mm

The low seated height supports slim designs, contributing to lighter, more compact electronic devices.

Width: 7.5 mm

The moderate width makes it suitable for space-constrained applications while maintaining necessary connections.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate processing speed for many control and automation tasks.

Length: 12.8 mm

Compact length contributes to a smaller overall footprint, further supporting efficient design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability and longevity in vehicle electronics, where temperatures can vary widely.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and I/O functions, making it a versatile choice for embedded solutions.

Technology: CMOS

CMOS technology allows for low power consumption, which is ideal for battery-powered and portable devices.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and enhances reliability in mounting, which improves manufacturing processes.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard in many applications, ensuring compatibility with existing designs and devices.

PWM Channels: YES

Presence of PWM channels allows for controlling motor speeds and other applications requiring variable control, enhancing its versatility.

ROM Programmability: MROM

MROM programmability permits easy software updates and modifications, ensuring that the microcontroller can adapt to evolving requirements.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard layout that allows for easy integration into existing circuit designs.

Speed: 8 rpm

Though speed is less typical for microcontrollers, this specification indicates specific control applications, providing added versatility.

No. of I/O Lines: 17

Having 17 I/O lines allows for flexible interfacing with multiple devices and sensors, making it an effective choice for complex applications.

Technical Specifications

Microcontrollers ST7L15F1MC/XXXE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L15F1MC/XXXE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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