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ST7L15F1MC/XXXRE

STMicroelectronics

ST7L15F1MC/XXXRE by STMicroelectronics

ST7L15F1MC/XXXRE microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 125°C. It supports up to 17 I/O lines and includes ADC and PWM channels. Ideal for automotive applications, it operates on a supply voltage of 3-5.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,779 parts In-Stock

1+ parts

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4,779

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Digiode

USA . 2,911 parts In-Stock

1+ parts

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1k+ parts

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2,911

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Anansix

USA . 275 parts In-Stock

1+ parts

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100+ parts

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275

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,383 parts In-Stock

1+ parts

$55.068

100+ parts

-

1k+ parts

$49.562

10k+ parts

-

1,383

$55.068

-

$49.562

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MKK Technologies

India . 1,684 parts In-Stock

1+ parts

$103.553

100+ parts

-

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-

10k+ parts

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1,684

$103.553

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DigiPath Technology Company

USA . 1,684 parts In-Stock

1+ parts

$103.553

100+ parts

-

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10k+ parts

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1,684

$103.553

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-

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Corphita

USA . 2,317 parts In-Stock

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2,317

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Parana Technologies

USA . 1,271 parts In-Stock

1+ parts

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100+ parts

$65.843

1k+ parts

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1,271

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$65.843

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Overview

Unlock your project's potential with the ST7L15F1MC/XXXRE microcontroller from STMicroelectronics, a trusted leader in innovative technology. Designed for automotive applications, this versatile 8-bit MCU combines reliability with powerful performance, enabling precision control and efficiency in diverse uses. Benefit from its low power consumption and robust temperature range, ensuring optimal functionality even in demanding environments. Empower your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a range of applications.

Surface Mount: YES

Surface mount technology allows for compact design and improved space efficiency on circuit boards.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller is versatile for various low-power applications.

Package Shape: RECTANGULAR

The rectangular package shape is beneficial for standardized PCB design and efficient space utilization.

Bit Size: 8

An 8-bit architecture makes it suitable for a wide array of control applications, balancing performance and cost.

Power Supplies (V): 5

Designed to operate at 5 V, this microcontroller is compatible with many existing systems and power supplies.

No. of Terminals: 20

Having 20 terminals allows for sufficient I/O connections, enabling more complex functionalities and interfacing.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this microcontroller ideal for compact designs and embedded systems.

Minimum Supply Voltage: 3 V

Operability at a minimum supply voltage of 3 V provides flexibility in various battery-powered applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this microcontroller suitable for automotive and industrial environments.

CPU Family: ST72

Being part of the ST72 family means this microcontroller benefits from robust performance and broad development support.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in harsh conditions, ideal for automotive use.

ADC Channels: YES

Having integrated ADC channels increases the versatility of the microcontroller for sensor interfacing.

Terminal Position: DUAL

Dual terminal positioning allows for easier manufacturing and assembly processes, improving overall production efficiency.

ROM Words: 4096

With 4096 ROM words, this microcontroller offers ample program storage for complex applications.

Maximum Seated Height: 2.65 mm

The low seated height facilitates space-saving designs, crucial in applications where every millimeter counts.

Width: 7.5 mm

A compact width complements its small outline package, allowing for dense circuit layouts.

Maximum Clock Frequency: 16 MHz

Operating at a clock frequency of 16 MHz, this microcontroller supports efficient processing for various tasks.

Length: 12.8 mm

Its length is optimized for compact PCB designs, ensuring it fits well in constrained spaces.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this microcontroller adheres to strict reliability standards necessary for critical systems.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates various functionalities in a single chip, minimizing system complexity.

RAM Bytes: 256

With 256 bytes of RAM, it can handle small to medium-sized applications effectively.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate reliable soldering during assembly, ensuring good electrical connections.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA contributes to low power consumption, ideal for energy-sensitive applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns well with many digital systems, providing convenience in integration.

PWM Channels: YES

PWM capability allows for versatile control of motors and other devices, expanding the microcontroller's application scope.

ROM Programmability: MROM

MROM programmability offers a cost-effective solution for applications that do not require frequent updates.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides a balance between ease of soldering and compactness, making design and assembly straightforward.

Speed: 8 rpm

With an operational speed of 8 rpm, this microcontroller suits low-speed applications, emphasizing control over high speed.

No. of I/O Lines: 17

17 I/O lines offer diverse interfacing options for sensors and actuators, promoting design flexibility.

Technical Specifications

Microcontrollers ST7L15F1MC/XXXRE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3/e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7L15F1MC/XXXRE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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