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ST72C215G2M6

STMicroelectronics

ST72C215G2M6 by STMicroelectronics

ST72C215G2M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C and 85°C. It supports up to 22 I/O lines and includes ADC/PWM channels for versatile applications. Ideal for industrial control systems, it operates on a supply voltage of 3.3/5 V.

Median Price

$4.827

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Freelance Electronics

USA . 509 parts In-Stock

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$4.827

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$5.068

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Vyrian

USA . 2,559 parts In-Stock

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Anansix

USA . 1,887 parts In-Stock

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J2 Sourcing AB

Sweden . 1,120 parts In-Stock

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Digiode

USA . 884 parts In-Stock

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ComSIT Distribution GmbH

Germany . 148 parts In-Stock

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Inventory MP

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Bristol Electronics

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Microchip USA

USA . 279 parts In-Stock

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$4.136

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AZTECH Wire

Italy . 115 parts In-Stock

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$18.650

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$18.650

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IDEA Electronic Components Group

UK . 1,936 parts In-Stock

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$78.638

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$70.774

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MKK Technologies

India . 1,902 parts In-Stock

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$147.873

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DigiPath Technology Company

USA . 1,902 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,694 parts In-Stock

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GreenTree Electronics

Israel . 12,500 parts In-Stock

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Metaverse IC Inc.

Canada . 11,944 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,394 parts In-Stock

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Perfect Parts

USA . 3,643 parts In-Stock

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Vigor

Singapore . 2,400 parts In-Stock

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Authorized Procurement Solutions

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Parana Technologies

USA . 2,009 parts In-Stock

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Kepictronics

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Corphita

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Overview

Elevate your projects with the ST72C215G2M6 microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for reliability and precision, this 8-bit powerhouse excels in diverse applications from industrial automation to consumer electronics. With its robust performance and intuitive integration, it ensures seamless operation in challenging environments. Unlock unparalleled efficiency and quality—experience the difference with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides excellent thermal insulation, making it suitable for varied applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration in modern electronic circuit boards.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage ensures compatibility with a wide range of power sources commonly used in electronics.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space on PCBs while maintaining efficient performance.

Bit Size: 8

An 8-bit microcontroller provides a good balance of simplicity and capability for various applications.

Power Supplies (V): 3.3/5

Dual supply voltage options offer flexibility in system design and better compatibility with different components.

No. of Terminals: 28

With 28 terminals, this microcontroller offers ample connectivity options for I/O, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE

A small outline package style minimizes space usage on the circuit board, ideal for compact applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage allows resilience in performance with slightly lower than nominal voltages.

Maximum Operating Temperature: 85 °C

The high operating temperature rating makes this microcontroller suitable for industrial applications.

CPU Family: ST72

Renowned for low power consumption, the ST72 family provides solid performance for embedded systems.

Minimum Operating Temperature: -40 °C

Low temperature tolerance makes it reliable for operation in harsh conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures better connectivity and resistance to corrosion, enhancing longevity.

ADC Channels: YES

Built-in ADC channels allow for analog-to-digital conversions, enabling versatile sensor integration.

Terminal Position: DUAL

Dual terminal positioning facilitates better PCB design and allows for straightforward soldering.

ROM Words: 8192

8192 ROM words provide ample memory for program storage, supporting complex applications.

Maximum Seated Height: 2.65 mm

Low seated height boosts design flexibility in compact electronic devices.

Width: 7.5 mm

The compact width is advantageous for space-constrained designs, allowing more functionality in less space.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz balances speed and power consumption effectively.

Maximum Time At Peak Reflow Temperature (s): 30

Capability to withstand peak reflow temperature for sufficient time assures robust soldering without damage.

Peak Reflow Temperature °C: 250

Resilience to high reflow temperatures makes it suitable for modern assembly techniques.

Length: 17.9 mm

The manageable length allows for easy integration into various applications while maintaining compactness.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability in demanding applications, such as automation and control.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller type peripheral IC, it offers an integrated solution for control tasks in embedded systems.

RAM Bytes: 256

256 bytes of RAM provide sufficient memory for general-purpose data handling in embedded applications.

Technology: CMOS

CMOS technology ensures low power consumption, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and provide secure connections during operation.

Maximum Supply Current: 9 mA

Low maximum supply current contributes to power-efficient designs, extending device battery life.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard, ensuring compatibility with many existing systems.

PWM Channels: YES

PWM channels enable the microcontroller to effectively control motors and other devices requiring variable power.

ROM Programmability: FLASH

Flash ROM allows for easy and versatile program updates, ensuring adaptability in various applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard in many designs, allowing reliable spacing for soldering.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate level of moisture sensitivity, suitable for most production environments.

Speed: 8 rpm

An operational speed of 8 rpm indicates adequacy for many low-speed control applications.

No. of I/O Lines: 22

With 22 I/O lines, it allows extensive interfacing options, enhancing its versatility in design.

Technical Specifications

Microcontrollers ST72C215G2M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES FROM 3.2 TO 5.5V SUUPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

22

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST72C215G2M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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