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ST72F321AR9T6

STMicroelectronics

ST72F321AR9T6 by STMicroelectronics

ST72F321AR9T6 by STMicroelectronics is an 8-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 2048 bytes of RAM, 61440 ROM words, and 16 ADC channels. Ideal for industrial applications requiring PWM control, I2C/SCI/SPI connectivity, and on-chip FLASH programmability.

Median Price

$6.468

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 320 parts In-Stock

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$4.940

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320

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$4.940

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Verical

USA . 320 parts In-Stock

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$7.996

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320

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$7.996

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$6.413

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10

$6.413

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Vyrian

USA . 11,303 parts In-Stock

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Chip Stock

USA . 5,340 parts In-Stock

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Digiode

USA . 1,105 parts In-Stock

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Anansix

USA . 707 parts In-Stock

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707

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ACDS - Activité Composants Distribution Service

France . 320 parts In-Stock

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320

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ComSIT Distribution GmbH

Germany . 28 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 658 parts In-Stock

1+ parts

$5.346

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-

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658

$5.346

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Continental Prestige Electronics

USA . 5,476 parts In-Stock

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$6.413

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$6.285

5,476

$6.413

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$6.285

Netroflash

USA . 2,000 parts In-Stock

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$6.413

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$6.285

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$6.413

$6.285

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Ampacity Inc.

Singapore . 84 parts In-Stock

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$9.140

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$9.140

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Vigor

Singapore . 7,850 parts In-Stock

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$10.700

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7,850

$10.700

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Microchip USA

USA . 323 parts In-Stock

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$29.779

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323

$29.779

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IDEA Electronic Components Group

UK . 329 parts In-Stock

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$30.718

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$27.646

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$30.718

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MKK Technologies

India . 1,733 parts In-Stock

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$57.763

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$57.763

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DigiPath Technology Company

USA . 1,733 parts In-Stock

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$57.763

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Lixinc

USA . 16,687 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,360 parts In-Stock

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Argo Parts USA

USA . 2,971 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Perfect Parts

USA . 2,509 parts In-Stock

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Parana Technologies

USA . 1,529 parts In-Stock

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$36.728

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$36.728

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Kepictronics

USA . 830 parts In-Stock

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830

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Corphita

USA . 750 parts In-Stock

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Overview

Unlock the power of innovation with the ST72F321AR9T6 microcontroller by STMicroelectronics. Crafted with precision and expertise, this versatile device offers a wide range of applications in various industries. From automotive to consumer electronics, this microcontroller delivers exceptional performance and reliability. With its advanced features and cutting-edge technology, the ST72F321AR9T6 ensures seamless connectivity, efficient power management, and unparalleled functionality. Elevate your projects with the quality and value that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount design allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape helps in efficient utilization of space on the PCB, enabling compact and space-saving designs.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost-effectiveness for general purpose microcontroller applications.

No. of Terminals: 64

Having 64 terminals offers plenty of connectivity options for interfacing with external devices and peripherals.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh industrial environments.

ADC Channels: YES

Built-in Analog to Digital Converters offer the capability to interface with analog sensors and signals, expanding the application possibilities.

ROM Words: 61440

Large ROM size allows for storing a significant amount of program data for complex applications.

RAM Bytes: 2048

Adequate RAM size enables efficient data processing and manipulation during program execution.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates multiple peripherals on a single chip, reducing component count and overall system complexity.

Connectivity: I2C, SCI, SPI

Multiple connectivity options like I2C, SCI, and SPI facilitate easy communication with other devices and enable versatile system integration.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, supporting rapid development and debugging cycles.

Technical Specifications

Microcontrollers ST72F321AR9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

POR, TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321AR9T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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