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ST72101G2B6/XXX

STMicroelectronics

ST72101G2B6/XXX by STMicroelectronics

ST72101G2B6/XXX by STMicroelectronics is an 8-bit microcontroller with 256 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring a CPU family of ST72. The microcontroller has 22 I/O lines, PWM channels, and a supply voltage range of 3.5-5.5 V, making it ideal for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,660 parts In-Stock

1+ parts

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4,660

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Digiode

USA . 4,502 parts In-Stock

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4,502

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Anansix

USA . 2,599 parts In-Stock

1+ parts

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2,599

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,094 parts In-Stock

1+ parts

$69.833

100+ parts

-

1k+ parts

$62.849

10k+ parts

-

1,094

$69.833

-

$62.849

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MKK Technologies

India . 238 parts In-Stock

1+ parts

$131.316

100+ parts

-

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238

$131.316

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DigiPath Technology Company

USA . 238 parts In-Stock

1+ parts

$131.316

100+ parts

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238

$131.316

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Corphita

USA . 1,670 parts In-Stock

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1,670

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Parana Technologies

USA . 166 parts In-Stock

1+ parts

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100+ parts

$83.496

1k+ parts

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166

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$83.496

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Overview

The ST72101G2B6/XXX by STMicroelectronics is a top-of-the-line microcontroller designed with precision and reliability in mind. From industrial automation to consumer electronics, this versatile chip offers seamless integration, high performance, and unmatched efficiency. With a wide operating voltage range and low supply current, this microcontroller ensures optimal energy consumption without compromising on speed or functionality. Trust STMicroelectronics for quality products that deliver exceptional results every time. Elevate your projects with the ST72101G2B6/XXX and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the microcontroller, making it suitable for a wide range of applications.

Maximum Supply Voltage: 5.5 V

Supports a higher voltage input, allowing for flexibility in power supply options.

Bit Size: 8

Offers sufficient data processing capability for many embedded system applications.

CPU Family: ST72

Comes from a reputable CPU family known for reliability and performance.

ROM Words: 8192

Offers a large amount of Read-Only Memory for storing program instructions and data.

RAM Bytes: 256

Provides sufficient Random-Access Memory for temporary data storage during program execution.

Maximum Clock Frequency: 16 MHz

Allows for fast execution of instructions, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for embedded control applications, making it a suitable choice for various projects.

Temperature Grade: INDUSTRIAL

Can operate reliably in harsh industrial environments with wide temperature variations.

No. of I/O Lines: 22

Offers a sufficient number of Input/Output lines for connecting to external devices and sensors.

Technical Specifications

Microcontrollers ST72101G2B6/XXX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e0

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.5/5.5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Trade Compliance

ST72101G2B6/XXX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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