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ST72101G1M1/XXX

STMicroelectronics

ST72101G1M1/XXX by STMicroelectronics

ST72101G1M1/XXX by STMicroelectronics is an 8-bit microcontroller with 256 bytes of RAM and 4096 ROM words. Operating at a max clock frequency of 16 MHz, it has 22 I/O lines and PWM channels for various applications in commercial-grade temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,245 parts In-Stock

1+ parts

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4,245

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Vyrian

USA . 3,066 parts In-Stock

1+ parts

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3,066

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Anansix

USA . 2,143 parts In-Stock

1+ parts

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2,143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,274 parts In-Stock

1+ parts

$45.688

100+ parts

-

1k+ parts

$41.119

10k+ parts

-

2,274

$45.688

-

$41.119

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MKK Technologies

India . 736 parts In-Stock

1+ parts

$85.914

100+ parts

-

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-

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736

$85.914

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DigiPath Technology Company

USA . 736 parts In-Stock

1+ parts

$85.914

100+ parts

-

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-

736

$85.914

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Corphita

USA . 3,638 parts In-Stock

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3,638

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Parana Technologies

USA . 992 parts In-Stock

1+ parts

-

100+ parts

$54.627

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992

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$54.627

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Overview

Unlock the power of innovation with the ST72101G1M1/XXX microcontroller from STMicroelectronics. Designed with precision and reliability in mind, this small outline package delivers high performance for a wide range of applications. With a maximum clock frequency of 16 MHz and 256 bytes of RAM, this microcontroller offers unparalleled speed and efficiency. Ideal for projects requiring precise control and fast processing, the ST72101G1M1/XXX is the perfect choice for your next endeavor. Experience the value and benefits that STMicroelectronics brings to the table with this cutting-edge product.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

The use of plastic/epoxy as the body material makes the product lightweight, durable, and cost-effective.

Surface Mount : YES

Being surface mountable allows for easier and more efficient PCB assembly.

Maximum Supply Voltage : 5.5 V

The high maximum supply voltage makes this microcontroller suitable for a wide range of applications.

Bit Size : 8

The 8-bit architecture allows for efficient processing and control capabilities.

Power Supplies (V) : 3.5/5.5

Support for multiple power supply voltages provides flexibility in design and compatibility with various systems.

No. of Terminals : 28

Having 28 terminals allows for versatile connectivity options and peripherals to be interfaced with the microcontroller.

ROM Words : 4096

The ROM capacity of 4096 words provides sufficient memory for storing program instructions and data.

Maximum Clock Frequency : 16 MHz

The high maximum clock frequency of 16 MHz enables fast data processing and execution of instructions.

RAM Bytes : 256

With 256 bytes of RAM, the microcontroller can efficiently handle data manipulation and storage during operations.

Technology : HCMOS

The HCMOS technology ensures low power consumption and high speed performance, making it energy-efficient.

Technical Specifications

Microcontrollers ST72101G1M1/XXX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

No. of I/O Lines:

22

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.5/5.5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST72101G1M1/XXX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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