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ST72F324J4B6

STMicroelectronics

ST72F324J4B6 by STMicroelectronics

ST72F324J4B6 by STMicroelectronics is an 8-bit microcontroller with 16384 ROM words, 512 RAM bytes, and a max clock frequency of 16 MHz. Ideal for industrial applications, it features 12-Ch 10-Bit ADC channels, TIMER(4) peripherals, and LIN/SCI/SPI connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,830 parts In-Stock

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4,830

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Digiode

USA . 1,863 parts In-Stock

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Anansix

USA . 665 parts In-Stock

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665

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ACDS - Activité Composants Distribution Service

France . 156 parts In-Stock

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156

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Bristol Electronics

USA . 156 parts In-Stock

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156

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Dan-Mar Components

USA . 156 parts In-Stock

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Nova Conductors

Japan . 76 parts In-Stock

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76

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Distributors (Availability)

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Microchip USA

USA . 291 parts In-Stock

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$3.933

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291

$3.933

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AZTECH Wire

Italy . 456 parts In-Stock

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$8.155

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456

$8.155

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IDEA Electronic Components Group

UK . 1,156 parts In-Stock

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$13.753

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$12.378

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1,156

$13.753

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$12.378

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Ampacity Inc.

Singapore . 1,562 parts In-Stock

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$16.000

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1,562

$16.000

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MKK Technologies

India . 1,435 parts In-Stock

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$25.862

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1,435

$25.862

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DigiPath Technology Company

USA . 1,435 parts In-Stock

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$25.862

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 10,065 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 9,360 parts In-Stock

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Vigor

Singapore . 2,184 parts In-Stock

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Parana Technologies

USA . 2,131 parts In-Stock

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$16.444

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A-Z Elektronik GmbH

Germany . 1,928 parts In-Stock

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Corphita

USA . 1,740 parts In-Stock

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Assy Fe

Spain . 1,547 parts In-Stock

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Continental Prestige Electronics

USA . 853 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Argo Parts USA

USA . 191 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your electronic projects with the ST72F324J4B6 microcontroller from STMicroelectronics. Known for their top-quality products, STMicroelectronics delivers reliable performance and durability. This versatile microcontroller is perfect for a wide range of applications, offering customers value and efficiency. Whether you're designing consumer electronics, industrial automation, or automotive systems, the ST72F324J4B6 provides the power and flexibility you need to bring your ideas to life. Experience the benefits of this innovative product and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and reliable performance.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic designs.

Bit Size: 8

The 8-bit architecture offers a balance between performance and cost-effectiveness for many applications.

No. of Terminals: 42

With 42 terminals, this microcontroller offers plenty of connectivity options for peripherals and external devices.

Terminal Finish: TIN

The use of tin terminal finish ensures good electrical conductivity and corrosion resistance.

ADC Channels: YES

The built-in analog-to-digital converters provide the ability to interface with analog sensors and signals.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows for fast processing speeds and real-time responsiveness.

RAM Bytes: 512

The 512 bytes of RAM provide sufficient memory for data storage and manipulation.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is a versatile and cost-effective solution for embedded systems.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity.

Analog To Digital Convertors: 12-Ch 10-Bit

With 12 analog-to-digital converters of 10-bit resolution, precise analog measurements can be obtained.

PWM Channels: YES

The presence of pulse-width modulation channels enables precise control over connected devices.

Connectivity: LIN, SCI, SPI

Multiple connectivity options such as LIN, SCI, and SPI make interfacing with other devices easy and flexible.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy updating and modification of stored program code.

Speed: 8 rpm

Operating at 8 revolutions per minute, this microcontroller is suitable for applications requiring precise speed control.

No. of I/O Lines: 32

With 32 input/output lines, this microcontroller offers plenty of flexibility for interfacing with external devices.

Technical Specifications

Microcontrollers ST72F324J4B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e3

Length:

36.83 mm

No. of I/O Lines:

32

No. of Terminals:

42

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324J4B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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