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ST72104G1B3/XXX

STMicroelectronics

ST72104G1B3/XXX by STMicroelectronics

ST72104G1B3/XXX microcontroller from STMicroelectronics features an 8-bit CPU with a max supply voltage of 5.5V and operates in extreme temperatures (-40 °C to 125°C). It includes 22 I/O lines, dual timers, and supports SPI connectivity. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,870 parts In-Stock

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2,870

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Vyrian

USA . 1,860 parts In-Stock

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1,860

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Digiode

USA . 280 parts In-Stock

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280

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 41 parts In-Stock

1+ parts

$30.235

100+ parts

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$27.211

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41

$30.235

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$27.211

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MKK Technologies

India . 521 parts In-Stock

1+ parts

$56.855

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521

$56.855

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DigiPath Technology Company

USA . 521 parts In-Stock

1+ parts

$56.855

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521

$56.855

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Corphita

USA . 4,674 parts In-Stock

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4,674

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Parana Technologies

USA . 698 parts In-Stock

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$36.150

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698

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$36.150

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Overview

Unlock the potential of your projects with the ST72104G1B3/XXX microcontroller from STMicroelectronics! Renowned for their exceptional quality and reliability, STMicroelectronics empowers your designs with innovative features tailored for automotive applications. With a robust temperature range and powerful peripherals, this versatile 8-bit MCU ensures efficiency and performance in demanding environments. Elevate your development experience and drive success with a partner that values precision and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances the microcontroller's reliability, making it suitable for a variety of applications.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with a range of devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, making it easier to integrate into compact designs.

Bit Size: 8

The 8-bit architecture is ideal for simpler applications, providing efficiency and ease of programming for basic tasks.

Power Supplies (V): 3.3/5

Support for multiple voltage levels enhances versatility and allows this microcontroller to be used in various system environments.

No. of Terminals: 32

A higher number of terminals enables more I/O options, allowing for increased connectivity and functionality.

Package Style (Meter): IN-LINE, SHRINK PITCH

This packaging style facilitates efficient PCB assembly and can save space on circuit boards.

Minimum Supply Voltage: 3.5 V

A lower minimum supply voltage can help in power-sensitive applications, extending battery life and reducing energy consumption.

Maximum Operating Temperature: 125 °C

High operating temperature ratings make this microcontroller suitable for automotive and industrial applications where heat resistance is crucial.

CPU Family: ST72

The ST72 family is known for its reliability and performance, ensuring robust operation across various applications.

Minimum Operating Temperature: -40 °C

Extreme low-temperature capabilities allow this microcontroller to function reliably in harsh environments.

Terminal Finish: Matte Tin (Sn)

Matte tin provides good solderability and corrosion resistance, ensuring durability in electronic assemblies.

Terminal Position: DUAL

Dual terminal positions offer more flexible mounting options, which can be beneficial for design optimization.

ROM Words: 4096

A substantial ROM capacity allows for more complex programs to be stored, enabling the execution of advanced tasks.

Maximum Seated Height: 5.08 mm

A compact seated height aids in space-constrained designs, making it versatile for various applications.

Width: 10.16 mm

The width is suitable for moderate-sized PCB layouts, maintaining component density without overcrowding.

Peripherals: TIMER(2)

Having multiple timers enhances the capability for time-sensitive tasks and event handling in various applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures sufficient processing speed for many applications without excessive power consumption.

Length: 27.94 mm

Overall length accommodates a balance of connection and functionality in standard enclosure spaces.

Temperature Grade: AUTOMOTIVE

This temperature grade ensures the microcontroller's reliability in automotive applications, where temperature fluctuations can be significant.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed to handle both processing and interfacing with peripherals, simplifying circuit design.

RAM Bytes: 256

256 bytes of RAM provide adequate memory for operational tasks and data handling in simpler applications.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-powered devices.

Terminal Form: THROUGH-HOLE

Through-hole technology provides robust physical connections, ideal for prototyping and repair.

Maximum Supply Current: 9 mA

A relatively low maximum supply current helps to minimize energy usage, critical for battery-operated devices.

Nominal Supply Voltage: 5 V

A common nominal supply voltage simplifies integration with standard electronic components and power supplies.

PWM Channels: YES

The inclusion of PWM channels is beneficial for applications requiring motor control and signal modulation.

Connectivity: SPI

The support for SPI connectivity enhances communication with other devices, enabling versatile interfacing options.

ROM Programmability: MROM

Masked ROM programming provides reliable and permanent program storage, suitable for dedicated applications.

Terminal Pitch: 1.778 mm

This terminal pitch provides a good balance between density and ease of soldering, making it user-friendly for assembly.

Speed: 8 rpm

This speed specification indicates suitability for various control tasks, particularly in automotive applications.

On Chip Program ROM Width: 8

An 8-bit ROM width is adequate for storing essential application code, facilitating efficient program execution.

No. of I/O Lines: 22

With 22 I/O lines, this microcontroller can support a wide range of peripheral connections, enhancing its functionality in diverse applications.

Technical Specifications

Microcontrollers ST72104G1B3/XXX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 3.2 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(2)

Trade Compliance

ST72104G1B3/XXX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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