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ST72104G1B6

STMicroelectronics

ST72104G1B6 by STMicroelectronics

ST72104G1B6 microcontroller from STMicroelectronics operates at a max voltage of 5.5V and features 32 terminals with an 8-bit architecture. It supports industrial applications with a temp range of -40 °C to 85 °C, offering connectivity via SPI and PWM channels. With 4KB ROM and 256 bytes RAM, it's ideal for embedded systems requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,639 parts In-Stock

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4,639

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Vyrian

USA . 3,302 parts In-Stock

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3,302

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Anansix

USA . 1,935 parts In-Stock

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1,935

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$59.009

100+ parts

-

1k+ parts

$53.108

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95

$59.009

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$53.108

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MKK Technologies

India . 4 parts In-Stock

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$110.962

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4

$110.962

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DigiPath Technology Company

USA . 4 parts In-Stock

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$110.962

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4

$110.962

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Corphita

USA . 3,167 parts In-Stock

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3,167

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Parana Technologies

USA . 729 parts In-Stock

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$70.554

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729

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$70.554

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Overview

Unlock unparalleled performance with the ST72104G1B6 microcontroller by STMicroelectronics. Renowned for its commitment to quality and innovation, STMicroelectronics delivers robust solutions for diverse applications ranging from automation to consumer electronics. This versatile 8-bit MCU operates efficiently across a wide temperature range, ensuring reliability in demanding environments. Experience enhanced control, energy efficiency, and seamless connectivity that elevate your projects—choose ST72104G1B6 for superior value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, ensuring the microcontroller is suited for various applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller is compatible with various power sources, making it versatile for different projects.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and space-saving designs, ideal for compact applications.

Bit Size: 8

The 8-bit architecture allows for simple and efficient processing, making it a great choice for less complex tasks and low-power applications.

Power Supplies (V): 3.5/5.5

Supporting a range of power supply voltages (3.5V to 5.5V) provides flexibility in integrating the microcontroller into various systems.

No. of Terminals: 32

Having 32 terminals allows for multiple input/output operations, enabling complex control and interaction with external devices.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style is designed for high-density applications, facilitating ease of soldering and reducing PCB space requirements.

Minimum Supply Voltage: 3.5 V

The minimum supply voltage of 3.5 V allows for battery-powered applications, contributing to the microcontroller's versatility.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is suitable for industrial environments that require resilience to high heat.

CPU Family: ST72

The ST72 CPU family provides a robust architecture featuring efficient instruction sets, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Operational between -40 °C and 85 °C makes this microcontroller suitable for extreme environmental conditions, enhancing reliability.

Terminal Finish: TIN LEAD

The tin-lead finish on terminals ensures good solderability and durability, making it a reliable option for various soldering processes.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, accommodating different PCB designs.

ROM Words: 4096

With 4096 ROM Words, there is ample memory for program storage, enabling more complex applications and features.

Maximum Seated Height: 5.08 mm

A compact seated height of 5.08 mm helps save PCB space, making it conducive for tight layouts in small devices.

Width: 10.16 mm

A width of 10.16 mm keeps the component compact, allowing for higher density in electronic designs.

Peripherals: TIMER(2)

The inclusion of two timers enhances control features, allowing for precise timing and event management in applications.

Maximum Clock Frequency: 16 MHz

The microcontroller operates at a maximum clock frequency of 16 MHz, providing sufficient processing power for a variety of tasks.

Length: 27.94 mm

Its length of 27.94 mm contributes to the compactness of designs, optimizing space usage on PCB layouts.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this microcontroller ensures reliability and stable performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, it integrates processing capabilities with peripheral functions, simplifying system complexity.

RAM Bytes: 256

256 bytes of RAM allows for basic data storage needs, sufficient for many simple applications.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption and high efficiency, making it a cost-effective solution.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure attachment and ease of handling during assembly, particularly in prototyping.

Maximum Supply Current: 10 mA

A maximum supply current of 10 mA enables low power consumption, making it suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures compatibility with standard power supplies, facilitating easy integration.

PWM Channels: YES

The inclusion of PWM channels allows for efficient motor control and modulation, widening its application scope.

Connectivity: SPI

Support for SPI connectivity facilitates high-speed communication with other peripherals and devices, enhancing performance capabilities.

ROM Programmability: FLASH

The use of flash memory for ROM programmability allows for easy updates to scripts and applications, improving the product's adaptability.

Terminal Pitch: 1.778 mm

With a terminal pitch of 1.778 mm, it is suitable for both standard and compact layouts, providing design flexibility.

Speed: 16 rpm

A response speed of 16 rpm caters to applications requiring moderate response times, suitable for a range of control systems.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides flexibility in programming and space efficiency, catering to a variety of application requirements.

No. of I/O Lines: 22

With 22 I/O lines, the microcontroller offers ample interfacing opportunities, enhancing its capability for complex tasks.

Technical Specifications

Microcontrollers ST72104G1B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 3.2 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e0

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.5/5.5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(2)

Trade Compliance

ST72104G1B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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