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ST72104G1B6/XXX

STMicroelectronics

ST72104G1B6/XXX by STMicroelectronics

ST72104G1B6/XXX microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85°C. It supports dual PWM channels and offers connectivity via SPI. Ideal for industrial applications, it operates on supply voltages of 3.3V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,754 parts In-Stock

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4,754

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Digiode

USA . 2,837 parts In-Stock

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2,837

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Anansix

USA . 2,628 parts In-Stock

1+ parts

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2,628

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,310 parts In-Stock

1+ parts

$60.796

100+ parts

-

1k+ parts

$54.717

10k+ parts

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2,310

$60.796

-

$54.717

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MKK Technologies

India . 314 parts In-Stock

1+ parts

$114.324

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314

$114.324

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DigiPath Technology Company

USA . 314 parts In-Stock

1+ parts

$114.324

100+ parts

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314

$114.324

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Corphita

USA . 2,861 parts In-Stock

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2,861

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Parana Technologies

USA . 1,470 parts In-Stock

1+ parts

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$72.691

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1,470

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$72.691

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Overview

Elevate your projects with the ST72104G1B6/XXX microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for industrial applications, this robust 8-bit solution ensures superior performance in demanding environments while consuming minimal power. Benefit from its versatile connectivity options and efficient processing capabilities, making it ideal for automation, control systems, and more. Trust in STMicroelectronics' commitment to quality for your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance and longevity for the microcontroller in various applications.

Maximum Supply Voltage: 5.5 V

The ability to handle up to 5.5V makes this microcontroller versatile for various circuits, providing flexibility in power supply options.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and design, optimizing space for integration into various devices.

Bit Size: 8

An 8-bit architecture allows for a simpler design and lower power consumption, making it suitable for basic control applications.

Power Supplies: 3.3/5 V

Dual voltage supplies enable compatibility with a wide range of existing systems and components, enhancing its adaptability.

No. of Terminals: 32

A higher number of terminals allow for more functionalities and improved connectivity options for peripheral devices.

Package Style: IN-LINE, SHRINK PITCH

This package style is ideal for saving space and allows for easy integration into compact circuit designs.

Minimum Supply Voltage: 3.5 V

The ability to operate from a minimum of 3.5V makes this microcontroller suitable for low-power applications.

Maximum Operating Temperature: 85 °C

Withstand higher temperatures, this microcontroller is suitable for industrial applications where heat levels may be elevated.

CPU Family: ST72

The ST72 CPU family is known for its reliable performance in embedded systems, ensuring consistent operation.

Minimum Operating Temperature: -40 °C

The capability to operate in extreme cold makes this microcontroller suitable for outdoor and industrial environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish enhances solderability and longevity of connections during assembly and operation.

Terminal Position: DUAL

Dual terminal position provides flexible mounting options, making it easier to integrate into various designs.

ROM Words: 4096

With 4096 ROM words, there is ample storage for program code, allowing for complex applications.

Maximum Seated Height: 5.08 mm

The compact seated height is advantageous for space-constrained designs, allowing for effective integration.

Width: 10.16 mm

This width allows for efficient use of space on circuit boards, enabling miniaturization of devices.

Peripherals: TIMER(2)

Dual timer peripherals provide enhanced capabilities for timing applications and event scheduling.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures good performance for a variety of applications.

Length: 27.94 mm

The length is suitable for various compact applications, allowing it to be used in smaller devices.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this microcontroller ensures reliability and performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller allows for effective control of electronic devices, providing necessary processing capabilities.

RAM Bytes: 256

256 bytes of RAM support basic data processing needs, allowing for effective operation of simple applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making it ideal for battery-powered devices.

Terminal Form: THROUGH-HOLE

Through-hole form factor enhances durability and mechanical strength when mounted on PCBs.

Maximum Supply Current: 9 mA

The low supply current helps in reducing overall power consumption, which is crucial in portable applications.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5V makes it compatible with many existing power supplies and circuits.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of motors and LEDs, enhancing functionality.

Connectivity: SPI

The presence of SPI connectivity offers high-speed data transfer options, facilitating communication with other components.

ROM Programmability: MROM

MROM programmability provides easier updates and flexibility in managing firmware for different applications.

Terminal Pitch: 1.778 mm

A 1.778 mm terminal pitch allows for easy connections and flexibility in PCB layout.

Speed: 8 rpm

An 8 rpm speed suits various control applications, particularly in robotics and automation.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports simpler programming models, making it easier for developers.

No. of I/O Lines: 22

Having 22 I/O lines enhances the functionality of the microcontroller, allowing for multiple external connections.

Technical Specifications

Microcontrollers ST72104G1B6/XXX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 3.2 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

No. of I/O Lines:

22

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

TIMER(2)

Trade Compliance

ST72104G1B6/XXX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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