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ST10R272LT6

STMicroelectronics

ST10R272LT6 by STMicroelectronics

STMicroelectronics ST10R272LT6 microcontroller features 16-bit CPU with 24-bit address bus, operating at max 100 MHz. Suitable for industrial applications, it offers 1024 bytes of RAM, 77 I/O lines, and PWM channels for versatile control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,422 parts In-Stock

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Digiode

USA . 2,221 parts In-Stock

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2,221

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Anansix

USA . 886 parts In-Stock

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886

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J2 Sourcing AB

Sweden . 3 parts In-Stock

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Connector Distribution Corp

USA . 1 parts In-Stock

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1

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Right Parts Inc.

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$8.010

100+ parts

-

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512

$8.010

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Microchip USA

USA . 105 parts In-Stock

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$24.667

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105

$24.667

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IDEA Electronic Components Group

UK . 1,293 parts In-Stock

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$57.799

100+ parts

-

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$52.019

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1,293

$57.799

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$52.019

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Component Stockers USA

USA . 423 parts In-Stock

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$99.990

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423

$99.990

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MKK Technologies

India . 1,685 parts In-Stock

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$108.687

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1,685

$108.687

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DigiPath Technology Company

USA . 1,685 parts In-Stock

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$108.687

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1,685

$108.687

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Corphita

USA . 4,955 parts In-Stock

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4,955

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A-Z Elektronik GmbH

Germany . 4,586 parts In-Stock

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Perfect Parts

USA . 1,085 parts In-Stock

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1,085

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Parana Technologies

USA . 849 parts In-Stock

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$69.108

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849

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$69.108

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Overview

Unleash the power of innovation with the ST10R272LT6 by STMicroelectronics. Crafted with precision and expertise, this microcontroller is a game-changer in the world of technology. With its versatile applications and top-notch performance, this product offers unmatched value and benefits to customers. Experience seamless operations and enhanced capabilities in various industrial settings with this cutting-edge device. Upgrade your systems and elevate your projects with the superior quality and reliability of the ST10R272LT6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the microcontroller onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures versatility in power supply options for the microcontroller, accommodating different system requirements.

Address Bus Width: 24

A wide address bus width of 24 allows for efficient memory addressing and data transfer, enhancing the performance of the microcontroller.

Package Shape: SQUARE

The square package shape offers uniformity and ease of mounting, making it convenient for integration into electronic devices.

Bit Size: 16

A 16-bit bit size provides a good balance between performance and cost, suitable for a wide range of applications that require moderate processing power.

Power Supplies (V): 3.3

The nominal supply voltage of 3.3V is commonly used in many electronic systems, ensuring compatibility and ease of integration with other components.

No. of Terminals: 100

A higher number of terminals allow for more I/O options and connectivity, offering flexibility in system design and functionality.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and operation, ideal for applications where power efficiency is crucial.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions, making it reliable for industrial use.

CPU Family: ST10

The ST10 CPU family is known for its performance and reliability, ensuring efficient processing and operation of the microcontroller.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature allows the microcontroller to function in extreme cold conditions, expanding its usability in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides corrosion resistance and reliable electrical connections, ensuring the long-term performance of the microcontroller.

Terminal Position: QUAD

A quad terminal position offers stability and secure mounting of the microcontroller on the PCB, reducing the risk of damage during operation.

Maximum Seated Height: 1.6 mm

The low seated height allows for a slim and compact profile of the microcontroller, suitable for space-constrained applications.

Width: 14 mm

The moderate width of the microcontroller facilitates easy integration into electronic systems, providing a balance between space-saving and connectivity options.

External Data Bus Width: 16

A 16-bit external data bus width enables efficient data transfer and processing, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency allows for fast processing and operation of the microcontroller, suitable for applications that require real-time data processing.

Length: 14 mm

The compact length of the microcontroller offers flexibility in design and integration, making it suitable for small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and features on a single chip, offering a compact and cost-effective solution for embedded systems.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can efficiently store and process data during operation, enhancing its multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for long-term use.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering during PCB assembly, ensuring secure connections for stable operation.

Maximum Supply Current: 140 mA

The maximum supply current of 140 mA ensures efficient power consumption and operation, suitable for battery-powered or low-power applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable and reliable power for the microcontroller, ensuring consistent performance in various operating conditions.

PWM Channels: YES

Having PWM channels allows the microcontroller to generate precise and adjustable analog signals, making it suitable for motor control, LED dimming, and other applications.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm offers high-density mounting options, allowing for compact PCB design and space-saving integration of the microcontroller.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the microcontroller can withstand moderate exposure to moisture during storage and assembly, ensuring its reliability in various environmental conditions.

Speed: 50 rpm

The speed capability of 50 rpm allows the microcontroller to process data and execute commands efficiently, suitable for applications that require high-speed operations.

No. of I/O Lines: 77

With 77 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices and sensors, enhancing its versatility in system integration.

Technical Specifications

Microcontrollers ST10R272LT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

100 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

1024

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST10R272LT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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