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ST10F296TR

STMicroelectronics

ST10F296TR by STMicroelectronics

ST10F296TR microcontroller from STMicroelectronics features a 16-bit architecture, operates at up to 64 MHz, and supports automotive applications with a temp range of -40 °C to 125°C. It includes 851968 ROM words and 69632 RAM bytes for robust performance. Ideal for complex control systems, it offers multiple ADC and PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,439 parts In-Stock

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2,439

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Anansix

USA . 451 parts In-Stock

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451

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Digiode

USA . 253 parts In-Stock

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253

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,321 parts In-Stock

1+ parts

$17.118

100+ parts

-

1k+ parts

$15.406

10k+ parts

-

1,321

$17.118

-

$15.406

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AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$20.510

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509

$20.510

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MKK Technologies

India . 2,197 parts In-Stock

1+ parts

$32.188

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2,197

$32.188

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DigiPath Technology Company

USA . 2,197 parts In-Stock

1+ parts

$32.188

100+ parts

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-

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-

2,197

$32.188

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-

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$55.856

100+ parts

$50.829

1k+ parts

$45.802

10k+ parts

-

900

$55.856

$50.829

$45.802

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Microchip USA

USA . 4,508 parts In-Stock

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4,508

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Corphita

USA . 2,786 parts In-Stock

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2,786

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Parana Technologies

USA . 1,835 parts In-Stock

1+ parts

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$20.467

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1,835

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$20.467

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Overview

Elevate your next project with the ST10F296TR microcontroller from STMicroelectronics, a leader in quality and innovation. Designed for automotive applications, it delivers exceptional performance in demanding environments, ensuring reliability you can trust. With advanced features like enhanced ADC and PWM channels, this 16-bit powerhouse offers unparalleled flexibility and efficiency, empowering engineers to create cutting-edge solutions while maximizing value and minimizing energy consumption. Transform your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material helps protect the microcontroller from environmental factors, ensuring reliability in various applications.

Surface Mount: YES

The surface mount design allows for compact assembly and is ideal for modern PCB designs, making it suitable for a wide range of applications.

Maximum Supply Voltage: 5 V

This offers compatibility with standard logic levels, making integration with other components easier.

Package Shape: SQUARE

The square shape ensures efficient space utilization on the PCB, allowing for high-density applications.

Bit Size: 16

The 16-bit architecture provides a good balance of performance and complexity, suitable for many control and processing tasks.

Power Supplies (V): 5

Supports standard supply voltages, facilitating easier design and component selection for power circuitry.

No. of Terminals: 208

A high number of terminals allows for extensive connectivity and peripheral support, ideal for complex designs.

Package Style (Meter): GRID ARRAY

The grid array layout provides excellent thermal performance and electrical connections, enhancing reliability and performance.

Minimum Supply Voltage: 4 V

This range ensures versatile power supply options for different applications, increasing the adaptability of the microcontroller.

Maximum Operating Temperature: 125 °C

The high temperature tolerance makes this microcontroller suitable for use in automotive and industrial environments.

CPU Family: ST10

This well-established family provides robust support and resources, making it a reliable choice for developers.

Minimum Operating Temperature: -40 °C

This feature enables operation in extreme conditions, making the microcontroller ideal for harsh environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and protection against oxidation, enhancing longevity and reliability.

ADC Channels: YES

Integrated ADC channels enable direct interfacing with analog sensors, streamlining design complexity.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and component placement, enhancing design efficiency.

ROM Words: 851968

A large ROM capacity allows for substantial program storage, accommodating complex applications.

Width: 23 mm

The compact width enhances space efficiency on PCBs, allowing for smaller overall device designs.

Maximum Clock Frequency: 64 MHz

High clock frequency ensures better processing power, allowing the microcontroller to handle demanding tasks efficiently.

Length: 23 mm

The small length with a square package provides excellent form factor solutions for tight spaces.

Temperature Grade: AUTOMOTIVE

With automotive-grade specifications, this microcontroller is designed to withstand rigorous automotive applications.

Peripheral IC Type: MICROCONTROLLER

This classification ensures that the product is optimized for various control tasks, providing flexibility for developers.

RAM Bytes: 69632

Adequate RAM size supports better real-time data processing and complex algorithms, enabling advanced applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form facilitates better thermal dissipation and efficient electrical connections in the package.

Maximum Supply Current: 148 mA

A relatively low maximum supply current makes this microcontroller energy-efficient, ideal for portable applications.

Nominal Supply Voltage: 4.5 V

The nominal voltage ensures consistent and reliable performance across various operating conditions and settings.

PWM Channels: YES

Presence of PWM channels enables control over motor speeds and other applications, enhancing versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing adaptability in various applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports flexible PCB design and ensures compatibility with a range of manufacturing processes.

Speed: 64 rpm

While primarily focused on clock frequency, this speed indicates the efficient operation of connected peripherals, especially in control applications.

No. of I/O Lines: 143

A larger number of I/O lines provides greater flexibility for interfacing with various peripherals, enhancing the application scope.

Technical Specifications

Microcontrollers ST10F296TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e3

Length:

23 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

143

No. of Terminals:

208

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA208,17X17,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

69632

ROM Words:

851968

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

148 mA

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

ST10F296TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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