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ST10F276R-6Q3

STMicroelectronics

ST10F276R-6Q3 by STMicroelectronics

STMicroelectronics' ST10F276R-6Q3 microcontroller features 16-bit architecture, 851968 ROM words, and 111 I/O lines. With a max supply voltage of 5.5V and PWM channels, it is ideal for applications requiring high-speed processing and precise control such as automotive engine management systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,565 parts In-Stock

1+ parts

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2,565

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Vyrian

USA . 2,504 parts In-Stock

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2,504

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Anansix

USA . 1,446 parts In-Stock

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1,446

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 50 parts In-Stock

1+ parts

$8.590

100+ parts

-

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50

$8.590

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IDEA Electronic Components Group

UK . 159 parts In-Stock

1+ parts

$43.475

100+ parts

-

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$39.127

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159

$43.475

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$39.127

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MKK Technologies

India . 1,473 parts In-Stock

1+ parts

$81.751

100+ parts

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1,473

$81.751

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DigiPath Technology Company

USA . 1,473 parts In-Stock

1+ parts

$81.751

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1,473

$81.751

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Corphita

USA . 4,365 parts In-Stock

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4,365

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Parana Technologies

USA . 515 parts In-Stock

1+ parts

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100+ parts

$51.980

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515

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$51.980

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Microchip USA

USA . 323 parts In-Stock

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323

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Overview

Unleash the power of innovation with the ST10F276R-6Q3 microcontroller from STMicroelectronics. With its cutting-edge technology and high-quality manufacturing, this microcontroller is perfect for a wide range of applications. Whether you're working on automotive systems, industrial automation, or consumer electronics, this product offers unparalleled value and performance. Experience seamless integration, reliable operation, and enhanced functionality with the ST10F276R-6Q3. Elevate your projects to new heights with this exceptional microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supply options, allowing flexibility in design and compatibility with various systems.

Package Shape: SQUARE

Square shape ensures efficient use of space on the PCB, maximizing component density.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle more complex instructions and computations efficiently.

No. of Terminals: 114

Ample terminals provide connectivity for various external components and peripherals, enhancing the device's functionality.

Package Style (Meter): FLATPACK

The flatpack package offers reliability in mounting and soldering, ensuring stable connections and long-term performance.

Minimum Supply Voltage: 4.5 V

Supports low power operation, allowing energy-efficient performance in applications where power consumption is critical.

ADC Channels: YES

Integration of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its applicability.

Terminal Position: QUAD

Quad terminal arrangement facilitates easy and organized connections, simplifying PCB layout and enhancing signal integrity.

ROM Words: 851968

Ample ROM storage capacity accommodates a large number of program instructions and data, enabling complex algorithms and applications.

Width: 28 mm

Compact width allows for space-efficient PCB design, ideal for compact electronic devices and systems.

Length: 28 mm

Balanced length dimension complements the square package shape, contributing to a compact and efficient overall footprint.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers fast and efficient processing capabilities, making the microcontroller suitable for high-performance applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology ensures low power consumption and reliable operation, making the microcontroller suitable for portable and battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical connection and facilitate automated assembly processes, ensuring reliable and efficient manufacturing.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage simplifies power management and compatibility with standard electronic components, enhancing ease of integration.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of output signals, making the microcontroller suitable for applications requiring accurate analog output.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on PCBs, enabling compact and space-efficient designs.

Speed: 64 rpm

Operates at a speed of 64 rotations per minute, suitable for a wide range of applications requiring moderate processing speed.

No. of I/O Lines: 111

Abundance of input/output lines provides versatile interfacing options with external devices and peripherals, enhancing the microcontroller's connectivity and versatility.

Technical Specifications

Microcontrollers ST10F276R-6Q3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

DMA Channels:

NO

External Data Bus Width:

0

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

114

PWM Channels:

YES

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

ROM Words:

851968

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10F276R-6Q3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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