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ST10F276-4TR3

STMicroelectronics

ST10F276-4TR3 by STMicroelectronics

ST10F276-4TR3 microcontroller from STMicroelectronics features a 16-bit architecture, operates at 5V with a max temp of 105 °C, and includes 24 ADC channels. Ideal for industrial applications, it offers robust connectivity options like CAN and I2C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,343 parts In-Stock

1+ parts

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4,343

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Vyrian

USA . 4,144 parts In-Stock

1+ parts

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4,144

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Anansix

USA . 680 parts In-Stock

1+ parts

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680

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 308 parts In-Stock

1+ parts

$10.710

100+ parts

-

1k+ parts

-

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308

$10.710

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Microchip USA

USA . 357 parts In-Stock

1+ parts

$30.635

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357

$30.635

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IDEA Electronic Components Group

UK . 85 parts In-Stock

1+ parts

$65.935

100+ parts

-

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$59.342

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85

$65.935

-

$59.342

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MKK Technologies

India . 1,439 parts In-Stock

1+ parts

$123.987

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1,439

$123.987

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DigiPath Technology Company

USA . 1,439 parts In-Stock

1+ parts

$123.987

100+ parts

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1,439

$123.987

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Corphita

USA . 4,410 parts In-Stock

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4,410

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Parana Technologies

USA . 1,167 parts In-Stock

1+ parts

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100+ parts

$78.836

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1,167

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$78.836

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Overview

Unlock the potential of your next project with the ST10F276-4TR3 microcontroller from STMicroelectronics, a leader in innovative technology. This robust and versatile solution delivers exceptional performance across various applications, from industrial automation to consumer electronics. With its low power consumption, extensive connectivity options, and high reliability, you can trust the ST10F276-4TR3 to drive efficiency and enhance functionality, all backed by ST's commitment to quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the microcontroller can withstand various environmental conditions.

Surface Mount: YES

Allows for compact design with a smaller footprint, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Compatible with standard voltage levels commonly used in many electronic applications.

Address Bus Width: 24

Enables access to a larger memory address space, accommodating more complex applications.

Package Shape: SQUARE

Square shape facilitates easier PCB layout and integration into existing designs.

Bit Size: 16

Offers a good balance between performance and power efficiency, suitable for a wide range of applications.

Power Supplies (V): 5

Standard operating voltage simplifies design and reduces the need for voltage regulation in many applications.

No. of Terminals: 144

Provides ample I/O capacity for connecting various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile design minimizes height and allows for high-density PCB layouts.

Minimum Supply Voltage: 4.5 V

Flexible operating range allows for reliable performance in various power environments.

Maximum Operating Temperature: 105 °C

High-temperature rating ensures reliable operation in industrial applications.

CPU Family: ST10

Proven and reliable CPU family known for its robust performance in embedded applications.

Minimum Operating Temperature: -40 °C

Ideal for applications that operate in extreme environments, ensuring continuous operation.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance, enhancing product longevity.

ADC Channels: YES

Integrated ADC channels simplify design by reducing component count while enabling analog signal processing.

Terminal Position: QUAD

Facilitates easier and more reliable connections on the PCB.

ROM Words: 212992

Adequate ROM capacity allows for storing complex programs and applications.

Maximum Seated Height: 1.6 mm

Low height allows for compact designs without compromising functionality.

Width: 20 mm

Standard width that fits well in typical embedded applications.

External Data Bus Width: 16

Enables fast data transfer rates, improving overall system performance.

Peripherals: POR, PWM(8), RTC, TIMER(5), WDT

Rich peripheral set enhances versatility and performance for a wide range of applications.

Maximum Clock Frequency: 12 MHz

Sufficient clock speed for a variety of control applications, allowing for efficient processing.

Maximum Time At Peak Reflow Temperature (s): 40

Suitable for standard reflow soldering processes, simplifying manufacturing and assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability ensures compatibility with lead-free solder processes.

Length: 20 mm

Standard length that aids in streamlined PCB design and integration.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, making it suitable for harsh operating environments.

Peripheral IC Type: MICROCONTROLLER

Focus on integrated control functions makes it perfect for various embedded systems.

RAM Bytes: 2048

Sufficient RAM allows for efficient operation of complex applications and multitasking.

Technology: CMOS

Low power consumption and high density make CMOS technology ideal for embedded systems.

Terminal Form: GULL WING

Gull wing terminals provide better mechanical strength and reliability during soldering.

Analog To Digital Convertors: 24-Ch 10-Bit

High-resolution ADC channels enhance the microcontroller's capability to handle analog signals accurately.

Nominal Supply Voltage: 5 V

Standard voltage for microcontrollers, ensuring ease of integration and design.

PWM Channels: YES

Integrated PWM channels enable precise control of motors and other devices directly from the microcontroller.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Multiple communication interfaces offer great flexibility for different application requirements.

ROM Programmability: FLASH

Reprogrammable flash memory allows for updates and modifications without hardware changes.

Terminal Pitch: 0.5 mm

Fine pitch enables higher pin density, allowing for more features in a smaller area.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating means it can handle a moderate level of moisture sensitivity during manufacturing and storage.

Speed: 48 rpm

Satisfactory speed for applications requiring standard processing rates.

On Chip Program ROM Width: 32

Supports wide program widths for better code management and storage capabilities.

No. of I/O Lines: 111

Ample I/O lines provide extensive interfacing options, making the microcontroller versatile for various designs.

Technical Specifications

Microcontrollers ST10F276-4TR3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

212992

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

POR, PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F276-4TR3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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