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ST10F273M-4TR3

STMicroelectronics

ST10F273M-4TR3 by STMicroelectronics

ST10F273M-4TR3 microcontroller from STMicroelectronics features a 16-bit CPU with a max clock frequency of 40 MHz, operating b/w -40 °C to 125°C. It supports up to 144 terminals and includes ADC channels for versatile applications in automotive systems. With a supply voltage range of 4.5V to 5.5V, it's ideal for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,924 parts In-Stock

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7,924

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Anansix

USA . 2,061 parts In-Stock

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2,061

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Digiode

USA . 1,747 parts In-Stock

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1,747

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Distributors (Availability)

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AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$9.840

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596

$9.840

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IDEA Electronic Components Group

UK . 185 parts In-Stock

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$73.468

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$66.122

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185

$73.468

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$66.122

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MKK Technologies

India . 1,750 parts In-Stock

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$138.153

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1,750

$138.153

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DigiPath Technology Company

USA . 1,750 parts In-Stock

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$138.153

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1,750

$138.153

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Corphita

USA . 2,659 parts In-Stock

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2,659

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Parana Technologies

USA . 165 parts In-Stock

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$87.843

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Overview

Unlock unparalleled performance and reliability with the ST10F273M-4TR3 microcontroller from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a powerhouse suited for automotive applications and beyond. This versatile microcontroller boasts advanced connectivity options and robust features, ensuring seamless integration into your projects. Experience enhanced efficiency, reduced downtime, and superior temperature resilience, empowering innovation in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material enhances longevity and reliability under various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage facilitates compatibility with a wider range of devices.

Address Bus Width: 24

A wider address bus allows for accessing more memory, improving performance in larger applications.

Package Shape: SQUARE

Square packages are easy to integrate into layout designs and offer a stable footprint.

Bit Size: 16

16-bit architecture provides a balance of performance and power efficiency, suitable for a wide range of applications.

Power Supplies (V): 5

Operating on a standard 5V supply makes it easy to power and integrate with commonly used devices.

No. of Terminals: 144

A higher number of terminals enables more I/O connections, allowing for complex and versatile functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low-profile design minimizes space usage, making it ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Flexibility in supply voltage range allows it to operate effectively in various power environments.

Maximum Operating Temperature: 125 °C

High temperature rating ensures reliable operation in harsh conditions, particularly in automotive applications.

CPU Family: ST10

ST10 family offers proven performance and support for various applications, simplifying integration.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme environments, enhancing reliability.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and prevents corrosion, ensuring long-term performance.

ADC Channels: YES

Integrated ADC channels provide flexible analog input options for diverse sensing applications.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and thermal performance in the mounting process.

ROM Words: 131072

Substantial ROM allows for extensive program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

Low height facilitates compact designs, especially in portable or space-sensitive electronics.

Width: 20 mm

Standard width makes it compatible with various circuit board designs for easy integration.

External Data Bus Width: 16

16-bit external data bus supports efficient data transfer rates for applications requiring fast processing.

Peripherals: PWM(8), RTC, TIMER(5), WDT

Rich peripheral set enhances application functionality, enabling real-time control and timing applications.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for faster processing, improving application performance.

Maximum Time At Peak Reflow Temperature (s): 40

Extended peak reflow time ensures reliability during soldering, maintaining component integrity.

Peak Reflow Temperature °C: 260

High reflow peak temperature tolerance supports various assembly processes without damage.

Length: 20 mm

Standard length ensures compatibility with a broad range of PCB layouts.

Temperature Grade: AUTOMOTIVE

Automotive-grade qualification guarantees reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, it offers targeted features for embedded applications.

RAM Bytes: 36864

Adequate RAM size supports various operations, enabling more complex applications and multitasking capabilities.

Technology: CMOS

CMOS technology ensures low power consumption while providing a high level of integration.

Terminal Form: GULL WING

Gull wing terminals provide reliable connection points for surface mounting and facilitate automated assembly.

Analog To Digital Convertors: 24-Ch 10-Bit

Multiple ADC channels and adequate resolution increase versatility in data acquisition from numerous sensors.

Nominal Supply Voltage: 5 V

Standard nominal voltage simplifies design and power supply considerations, ensuring availability.

PWM Channels: YES

Integrated PWM channels allow for efficient motor control and other signal modulation applications.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Versatile connectivity options enable integration into different communication networks and systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and final product modifications in the field.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density designs, maximizing the use of PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 classification indicates suitable handling to protect against moisture damage during assembly.

Speed: 40 rpm

The designated speed allows for real-time responsiveness in applications requiring fast processing and control.

On Chip Program ROM Width: 32

Wider ROM width supports complex programming capabilities and improves overall functionality.

No. of I/O Lines: 111

A high number of I/O lines provides flexibility for interfacing with various peripherals and sensors.

Technical Specifications

Microcontrollers ST10F273M-4TR3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F273M-4TR3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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