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ST10F272Z2T3

STMicroelectronics

ST10F272Z2T3 by STMicroelectronics

ST10F272Z2T3 microcontroller from STMicroelectronics features a 16-bit architecture, operates at a max voltage of 5.5V, and supports up to 40 MHz clock frequency. With 144 terminals and automotive-grade temperature range (-40 °C to 125 °C), it's ideal for automotive applications. Its flash ROM allows for flexible programming, making it suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,967 parts In-Stock

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Anansix

USA . 1,061 parts In-Stock

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1,061

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Digiode

USA . 347 parts In-Stock

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347

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AZTECH Wire

Italy . 849 parts In-Stock

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$12.060

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849

$12.060

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Microchip USA

USA . 132 parts In-Stock

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$22.760

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132

$22.760

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IDEA Electronic Components Group

UK . 484 parts In-Stock

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$47.378

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$42.640

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484

$47.378

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$42.640

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MKK Technologies

India . 295 parts In-Stock

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$89.092

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295

$89.092

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DigiPath Technology Company

USA . 295 parts In-Stock

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$89.092

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295

$89.092

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Corphita

USA . 4,674 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,590 parts In-Stock

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Parana Technologies

USA . 1,957 parts In-Stock

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$56.648

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Overview

Unlock the potential of your next project with the ST10F272Z2T3 microcontroller from STMicroelectronics—a leader in quality and innovation. Designed for automotive applications, this versatile chip ensures reliability in extreme conditions, delivering exceptional performance with low power consumption. Experience seamless integration with its compact design and robust features, making it ideal for everything from automotive systems to advanced consumer electronics. Enhance your designs with a trusted partner that prioritizes excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resilience against environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount allows for smaller and more compact circuit designs, making integration into modern electronics more efficient.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5V provides flexibility in power supply options while ensuring safe operation.

Address Bus Width: 24

A 24-bit address bus width allows for extensive memory addressing, enabling complex applications with large memory needs.

Package Shape: SQUARE

The square shape offers symmetry which can simplify PCB layout and assembly processes.

Bit Size: 16

With a 16-bit architecture, this microcontroller balances performance and resource efficiency, suitable for a variety of tasks.

Power Supplies (V): 5

Operating with a nominal voltage of 5V is standard for many devices, enhancing versatility and ease of use.

No. of Terminals: 144

Having 144 terminals allows for numerous connections and interfaces, catering to complex peripheral integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for space-constrained applications, providing a low-profile solution that minimizes height.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures reliable operation under various conditions and battery types.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C makes this microcontroller suitable for automotive and industrial applications.

CPU Family: ST10

The ST10 CPU family is known for its performance and efficiency, delivering solid processing capabilities.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller can function in extreme conditions, ideal for harsh environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, contributing to the reliability of connections.

ADC Channels: YES

Integrated ADC channels allow for easy analog signal processing, making it suitable for sensing applications.

Terminal Position: QUAD

Quad terminal positioning simplifies routing on PCBs, improving design efficiency.

ROM Words: 262144

A substantial ROM of 262144 words enables significant program storage capacity for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height facilitates space-efficient designs, aligning with modern electronic form factors.

Width: 20 mm

A standard width of 20mm makes it compatible with a wide range of PCB designs.

External Data Bus Width: 16

The 16-bit external data bus width supports efficient data transfer for high-performance applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures that the microcontroller can handle demanding applications efficiently.

Length: 20 mm

Similar to its width, the 20mm length aids in standardization and design compatibility.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade guarantees robustness and dependability in the automotive industry.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates various functions in a single chip, saving space and costs in designs.

RAM Bytes: 20480

20480 bytes of RAM support adequate temporary data storage for medium-complexity applications.

Technology: CMOS

CMOS technology enhances power efficiency, which is crucial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process and are well-suited for automated assembly.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5V enhances compatibility with a range of components and systems.

PWM Channels: YES

PWM channels are essential for applications requiring motor control or signal modulation, broadening its usability.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming and updates, making it convenient for development and production.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for high-density PCB layouts, accommodating advanced designs.

Speed: 40 rpm

The ability to operate at 40 rpm indicates suitability for low-speed applications, including those in automation and control.

No. of I/O Lines: 111

With 111 I/O lines, it provides ample flexibility for interfacing and connecting various devices and sensors.

Technical Specifications

Microcontrollers ST10F272Z2T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

ST10F272Z2T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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