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ST10F272M-4T3

STMicroelectronics

ST10F272M-4T3 by STMicroelectronics

ST10F272M-4T3 microcontroller from STMicroelectronics features a 16-bit architecture, operates at 5V with a max temp of 125 °C, and includes 24 ADC channels. Ideal for automotive applications, it supports various connectivity options like CAN and I2C. Its compact design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,451 parts In-Stock

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12,451

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Anansix

USA . 2,647 parts In-Stock

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2,647

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Digiode

USA . 2,620 parts In-Stock

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2,620

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$13.180

100+ parts

-

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276

$13.180

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IDEA Electronic Components Group

UK . 1,954 parts In-Stock

1+ parts

$28.347

100+ parts

-

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$25.512

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1,954

$28.347

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$25.512

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Microchip USA

USA . 2,028 parts In-Stock

1+ parts

$33.027

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2,028

$33.027

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MKK Technologies

India . 1,217 parts In-Stock

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$53.305

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1,217

$53.305

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DigiPath Technology Company

USA . 1,217 parts In-Stock

1+ parts

$53.305

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1,217

$53.305

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Corphita

USA . 4,042 parts In-Stock

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4,042

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Parana Technologies

USA . 621 parts In-Stock

1+ parts

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$33.893

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621

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$33.893

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Perfect Parts

USA . 160 parts In-Stock

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160

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Overview

Unlock unparalleled performance with the ST10F272M-4T3 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for automotive applications, it offers robust reliability in extreme conditions while boasting an extensive range of features like advanced ADC channels and various connectivity options. Experience reduced development time and increased efficiency, empowering your projects with unmatched quality and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and cost-effectiveness, making it suitable for both industrial and consumer applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

A supply voltage of up to 5.5V provides flexibility in power supply options, suitable for various applications.

Address Bus Width: 24

A 24-bit address bus width allows for addressing a larger memory space, which is crucial for complex applications.

Package Shape: SQUARE

The square shape facilitates efficient layout and assembly in PCB designs.

Bit Size: 16

A 16-bit architecture provides a good balance of performance and resource usage, suitable for many control applications.

Power Supplies (V): 5

Operating at a nominal 5V is standard, making it compatible with a wide array of devices and power supplies.

No. of Terminals: 144

With 144 terminals, this microcontroller supports extensive interconnectivity and provides flexibility for peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack low profile design aids in space-saving applications where height is a constraint.

Minimum Supply Voltage: 4.5 V

Operating down to 4.5V allows for use in low-power applications and helps in conserving energy.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes it suitable for automotive and other high-temperature environments.

CPU Family: ST10

The ST10 CPU family is known for its reliability and efficiency, making it suitable for a variety of applications.

Minimum Operating Temperature: -40 °C

Capable of operating at -40 °C is essential for outdoor and harsh environment applications, typical in industrial uses.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and protection against corrosion, enhancing long-term reliability.

ADC Channels: YES

Integrated ADC channels allow the microcontroller to interact with analog sensors directly, simplifying design.

Terminal Position: QUAD

Quad terminal position provides better ease of soldering and handling during assembly.

ROM Words: 65536

A ROM capacity of 65536 words allows for substantial program memory, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height aids in compact designs, making it easier to fit into space-constrained applications.

Width: 20 mm

The 20 mm width makes it manageable in size for multi-channel configurations and component density.

External Data Bus Width: 16

A 16-bit external data bus width provides good throughput for data-intensive applications.

Peripherals: PWM(8), RTC, TIMER(5), WDT

Integrated peripherals like PWM and timers enhance versatility and functionality, reducing the need for external components.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz allows for high-speed processing, suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

This specification indicates robust thermal stability under soldering conditions, ensuring the microcontroller's integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports compatibility with a variety of soldering processes.

Length: 20 mm

The 20 mm length complements the width for a compact package suitable for tight spaces.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade ensures reliability for use in vehicles, where environmental conditions can be extreme.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture is known for its efficiency, leading to lower power consumption while maintaining high performance.

RAM Bytes: 20480

A RAM size of 20480 bytes provides adequate space for variable storage, enhancing program capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals ensure ease of handling and better soldering reliability, critical in PCB assembly.

Analog To Digital Converters: 24-Ch 10-Bit

24-channel, 10-bit ADC allows the device to capture multiple inputs simultaneously, enhancing data acquisition capabilities.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is standard, ensuring compatibility with a wide range of electronic circuits.

PWM Channels: YES

Having PWM channels provides efficient control of motors and other actuators, useful in various applications.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Multiple connectivity options make it flexible for interfacing with different devices, catering to complex communication needs.

ROM Programmability: FLASH

Flash ROM allows for easy updating and reprogramming, beneficial for applications requiring firmware changes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density packaging, accommodating modern compact PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, guiding appropriate storage and handling protocols.

Speed: 40 rpm

An operational speed of 40 RPM indicates suitability for low-speed motor applications, such as in automotive parts or small devices.

On Chip Program ROM Width: 32

A wide program ROM width allows for efficient data processing and expands the instruction set capabilities.

No. of I/O Lines: 111

111 I/O lines offer excellent interfacing capabilities with peripherals, enabling extensive application designs.

Technical Specifications

Microcontrollers ST10F272M-4T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F272M-4T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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