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ST10F269Z1Q6

STMicroelectronics

ST10F269Z1Q6 by STMicroelectronics

ST10F269Z1Q6 microcontroller from STMicroelectronics features a 16-bit architecture, operates at up to 80 MHz, and supports a supply voltage range of 4.5-5.5 V. With 144 terminals and industrial-grade temperature tolerance (-40 °C to 85 °C), it's ideal for robust applications. Its integrated ADC and PWM channels enhance versatility in control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,874 parts In-Stock

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3,874

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Digiode

USA . 2,015 parts In-Stock

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2,015

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Anansix

USA . 1,217 parts In-Stock

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1,217

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J & M Industries LLC

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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AZTECH Wire

Italy . 785 parts In-Stock

1+ parts

$16.940

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-

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785

$16.940

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IDEA Electronic Components Group

UK . 443 parts In-Stock

1+ parts

$26.195

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$23.576

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443

$26.195

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$23.576

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MKK Technologies

India . 1,025 parts In-Stock

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$49.258

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$49.258

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DigiPath Technology Company

USA . 1,025 parts In-Stock

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$49.258

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$49.258

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Microchip USA

USA . 256 parts In-Stock

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$68.702

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$68.702

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Corphita

USA . 3,752 parts In-Stock

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Parana Technologies

USA . 1,405 parts In-Stock

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$31.320

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1,405

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$31.320

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Overview

Unlock the potential of your projects with the ST10F269Z1Q6 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for reliability and performance, this robust 16-bit microcontroller excels in diverse applications from industrial automation to consumer electronics. Enjoy enhanced efficiency, superior processing speeds, and seamless integration, empowering you to innovate confidently while reducing time-to-market and operational costs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable package, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient use of circuit board space, ideal for compact designs.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5V ensures compatibility with standard power supply configurations.

Address Bus Width: 24

A 24-bit address bus width allows for accessing a larger memory footprint, enhancing performance.

Package Shape: SQUARE

The square shape aids in efficient layout on PCBs, allowing for better space management.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle a wide range of data processing tasks efficiently.

Power Supplies (V): 5

Operating at a nominal 5V provides ease of integration with common components and systems.

No. of Terminals: 144

A higher number of terminals supports more I/O operations, making it suitable for complex applications.

Package Style (Meter): FLATPACK

Flatpack style allows for a lower profile on the circuit board, which can be advantageous in space-constrained environments.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V provides flexibility in power source selection.

Maximum Operating Temperature: 85 °C

The ability to operate up to 85 °C makes this microcontroller suitable for industrial applications.

CPU Family: ST10

The ST10 CPU family offers advanced performance and a good balance of features for embedded applications.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures (-40 °C) enables deployment in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances reliability and durability, particularly in high-volume applications.

ADC Channels: YES

Integrated ADC channels allow for direct sensing of analog signals, simplifying design and reducing component count.

Terminal Position: QUAD

Quad terminal position promotes efficient routing on multi-layer PCBs, allowing for better electrical performance.

ROM Words: 131072

A substantial ROM capacity supports complex firmware development and larger applications.

Maximum Seated Height: 4.07 mm

The low profile aids in airtight fitting in compact device designs, contributing to overall design efficiency.

Width: 28 mm

The 28 mm width strikes a balance between size and component density, suitable for various applications.

External Data Bus Width: 16

A 16-bit external data bus width enables efficient data transfer and communication with peripherals.

Maximum Clock Frequency: 80 MHz

Operating at 80 MHz ensures fast processing, enhancing performance in demanding application scenarios.

Length: 28 mm

Maintaining a compact 28 mm length ensures the microcontroller can fit into small enclosures seamlessly.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures robust performance in varying environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller means it integrates processing and control, simplifying system design.

RAM Bytes: 12288

Adequate RAM size allows for efficient handling of data and enables more complex application functionalities.

Technology: CMOS

CMOS technology ensures low power consumption while delivering high-speed performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mounting, improving production efficiency.

Maximum Supply Current: 120 mA

With a maximum supply current of 120 mA, this microcontroller can drive a variety of peripherals while maintaining efficiency.

Nominal Supply Voltage: 5 V

The nominal 5V supply voltage is a standard in the industry, ensuring compatibility with many components.

PWM Channels: YES

Integrated PWM channels allow for precise control in applications such as motor control and LED dimming.

ROM Programmability: FLASH

FLASH ROM programmability offers the flexibility to update firmware easily and is advantageous for iterative development.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch achieves a good balance between compactness and manufacturability, making it easy to handle.

Speed: 40 rpm

A speed of 40 rpm allows for suitable applications in control systems requiring moderate actuation.

No. of I/O Lines: 111

111 I/O lines facilitate extensive interfacing capabilities, opening up a wide range of application possibilities.

Technical Specifications

Microcontrollers ST10F269Z1Q6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

ST10F269Z1Q6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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