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ST10F269-DPR

STMicroelectronics

ST10F269-DPR by STMicroelectronics

ST10F269-DPR microcontroller from STMicroelectronics features a 16-bit architecture with a max clock frequency of 80 MHz, supporting automotive applications. It operates b/w -40 °C to 125°C and includes 16 ADC channels for versatile data processing. With 144 terminals and flash ROM, it's ideal for complex control systems.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,751 parts In-Stock

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8,751

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Digiode

USA . 663 parts In-Stock

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663

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Anansix

USA . 363 parts In-Stock

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363

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Bristol Electronics

USA . 78 parts In-Stock

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AZTECH Wire

Italy . 519 parts In-Stock

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$9.720

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519

$9.720

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Microchip USA

USA . 138 parts In-Stock

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$24.237

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138

$24.237

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IDEA Electronic Components Group

UK . 1,472 parts In-Stock

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$42.864

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$38.577

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$42.864

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$38.577

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MKK Technologies

India . 663 parts In-Stock

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$80.602

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$80.602

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DigiPath Technology Company

USA . 663 parts In-Stock

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$80.602

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663

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Corphita

USA . 1,745 parts In-Stock

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Parana Technologies

USA . 650 parts In-Stock

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$51.250

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650

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$51.250

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Overview

Unlock the potential of your next project with the ST10F269-DPR from STMicroelectronics, a leader in microcontroller innovation. This robust 16-bit microcontroller is designed for automotive excellence, delivering high performance in demanding environments. With advanced features like multiple ADC channels and versatile connectivity options, it ensures reliability and efficiency. Elevate your applications with a trusted solution that combines quality, durability, and unmatched functionality. Choose STMicroelectronics for cutting-edge technology that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a robust and lightweight package, making it suitable for various applications, particularly in automotive settings.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes, enabling the microcontroller to fit into space-constrained designs.

Maximum Supply Voltage: 5.5 V

This voltage range ensures compatibility with standard power supply systems, making integration into existing designs easier.

Address Bus Width: 24

A wider address bus allows for accessing larger memory capacities, enhancing the microcontroller's performance and usability.

Package Shape: SQUARE

The square package shape optimizes the layout on the printed circuit board (PCB), facilitating easier routing and organization.

Bit Size: 16

A 16-bit architecture strikes a balance for processing power and efficiency, suitable for a wide range of applications.

No. of Terminals: 144

More terminals provide greater connectivity options, allowing for various interfacing capabilities with peripherals and other components.

Package Style (Meter): FLATPACK

Flatpack style reduces the overall height of the component, making it advantageous for compact electronic designs.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage ensures stable operation in low-power applications, enhancing versatility.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this microcontroller suitable for automotive and industrial applications where high thermal conditions are common.

Minimum Operating Temperature: -40 °C

This wide temperature range supports the needs of harsh environments, making it ideal for outdoor and industrial use.

ADC Channels: YES

The inclusion of ADC channels allows for real-time analog signal processing, expanding the microcontroller's usability in sensor applications.

Terminal Position: QUAD

Quad terminal positioning improves mechanical stability and electrical connectivity of the microcontroller on the PCB.

ROM Words: 65536

A considerable amount of ROM enables the storage of substantial program code, facilitating complex application development.

Maximum Seated Height: 4.07 mm

This low profile height allows for space-saving designs, beneficial in compact electronic systems.

Width: 28 mm

A moderate width dimension allows for flexibility in PCB layout while still maintaining a compact profile.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient data transfer, enhancing overall system performance.

Peripherals: PWM(4), RTC, TIMER(2), WDT

Multiple built-in peripherals provide increased functionality, making the microcontroller well-suited for a variety of applications.

Maximum Clock Frequency: 80 MHz

A high clock frequency offers enhanced processing speed, supporting more demanding applications.

Length: 28 mm

This length complements the width to offer a compact design while providing sufficient pin arrangement.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it guarantees reliability and performance in fluctuating temperature conditions typical of vehicles.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it brings versatility to embedded systems, accommodating diverse functionalities.

RAM Bytes: 12288

Ample RAM supports complex operations and data handling, facilitating sophisticated application programming.

Technology: CMOS

CMOS technology allows for lower power consumption while maintaining performance, making it suitable for energy-efficient applications.

Terminal Form: GULL WING

Gull wing leads assist in easy soldering and handling during manufacturing, improving overall production efficiency.

Analog To Digital Converters: 16-Ch 10-Bit

With multiple ADC channels, this microcontroller excels in applications requiring simultaneous data acquisition from various sensors.

Nominal Supply Voltage: 5 V

The nominal supply voltage aligns well with most electronic systems, simplifying integration into new and existing designs.

PWM Channels: YES

PWM capabilities allow for precise control of motors and other devices, which is essential in automotive applications.

Connectivity: ASC, CAN(2), SSC

Versatile connectivity options enhance the microcontroller's capabilities for automotive networking and communication systems.

ROM Programmability: FLASH

Flash ROM allows for reprogramming, making it easier to update and maintain applications without hardware changes.

Terminal Pitch: 0.65 mm

A tight terminal pitch enables higher density designs and minimizes the PCB footprint.

Speed: 40 rpm

This speed specification indicates that the microcontroller can effectively manage applications requiring moderate-speed operation.

On Chip Program ROM Width: 32

A wider program ROM width supports more complex instructions, which improves the microcontroller's performance.

No. of I/O Lines: 111

A high number of I/O lines provide extensive interface options, making it adaptable to various applications and peripheral devices.

Technical Specifications

Microcontrollers ST10F269-DPR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

40 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC, CAN(2), SSC

Peripherals:

PWM(4), RTC, TIMER(2), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST10F269-DPR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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