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SGS131

STMicroelectronics

SGS131 by STMicroelectronics

STMicroelectronics SGS131 is a NPN BJT transistor with Darlington configuration, ideal for switching applications. It offers a max VCEsat of 3V and can handle up to 8A of collector current. With a power dissipation of 65W, it operates at temperatures up to 150 °C in a rectangular package with through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,783 parts In-Stock

1+ parts

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100+ parts

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4,783

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Digiode

USA . 1,924 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1,924

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Anansix

USA . 137 parts In-Stock

1+ parts

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100+ parts

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137

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,503 parts In-Stock

1+ parts

$1.667

100+ parts

-

1k+ parts

$1.500

10k+ parts

-

1,503

$1.667

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$1.500

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MKK Technologies

India . 1,493 parts In-Stock

1+ parts

$3.135

100+ parts

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1,493

$3.135

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DigiPath Technology Company

USA . 1,493 parts In-Stock

1+ parts

$3.135

100+ parts

-

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1,493

$3.135

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Corphita

USA . 3,896 parts In-Stock

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3,896

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Parana Technologies

USA . 3 parts In-Stock

1+ parts

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100+ parts

$1.993

1k+ parts

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3

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$1.993

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Overview

Experience the power of innovation with the SGS131 by STMicroelectronics, a top-of-the-line Power Bipolar Junction Transistor designed for high-performance switching applications. With unbeatable quality and reliability, STMicroelectronics sets the industry standard for excellence. The SGS131 offers customers unmatched value, benefits, and advantages, making it the ideal choice for a wide range of electronic projects. Upgrade to the SGS131 today and discover the difference that superior technology can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the transistor lightweight and durable, allowing for easy handling and increased product longevity.

Polarity or Channel Type: NPN

NPN configuration is widely used in many electronic applications, offering high efficiency and lower power consumption, making this transistor suitable for a variety of switching applications.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration combined with built-in diode and resistor simplifies circuit design, improves reliability, and enhances performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures fast response time and efficient operation in controlling electrical currents.

Maximum VCEsat: 3 V

The low maximum VCEsat value of 3V indicates minimal saturation voltage drop, leading to reduced power loss and improved efficiency in switching operations.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and mounting on circuit boards, contributing to space-saving design and efficient assembly processes.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, ensuring stable performance and ease of soldering during circuit integration.

No. of Terminals: 3

With 3 terminals, this transistor offers simple connectivity and compatibility with various circuit configurations, enabling versatile usage in different electronic systems.

Maximum Power Dissipation (Abs): 65 W

A high absolute maximum power dissipation rating of 65W allows the transistor to handle significant power levels without overheating, ensuring long-term reliability in demanding applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and effective heat dissipation, resulting in improved thermal management and overall performance of the transistor.

Maximum Power Dissipation Ambient: 70 W

The maximum power dissipation in ambient conditions of 70W ensures stable operation and protection against thermal stress, enhancing the transistor's durability and performance.

Minimum DC Current Gain (hFE): 1000

A minimum DC current gain of 1000 indicates high amplification capability, enabling precise control and accurate signal processing in various electronic circuits.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high-temperature environments, making it suitable for industrial applications with elevated temperature requirements.

Maximum Collector-Emitter Voltage: 80 V

A high maximum collector-emitter voltage rating of 80V ensures safe operation and protection against voltage spikes, making this transistor ideal for applications requiring high voltage handling capacity.

Transistor Element Material: SILICON

Silicon-based transistor elements offer excellent electrical performance, reliability, and high switching speed, making this transistor a reliable choice for various electronic applications.

Maximum Collector Current (IC): 8 A

With a maximum collector current of 8A, this transistor can handle high levels of current flow, allowing for efficient switching and control of electrical loads in demanding applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and corrosion resistance, ensuring secure connections and long-lasting performance in various operating conditions.

Terminal Position: SINGLE

Single terminal position simplifies installation and circuit connection, promoting ease of use and versatility in incorporating the transistor into different electronic systems.

Case Connection: ISOLATED

Isolated case connection enhances electrical safety and prevents potential short circuits, ensuring reliable performance and protection of the transistor in varying operating conditions.

Technical Specifications

Power Bipolar Junction Transistors (BJT) SGS131 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

80 V

Minimum DC Current Gain (hFE):

1000

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

70 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum VCEsat:

3 V

Trade Compliance

SGS131 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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