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RHFACT14K01V

STMicroelectronics

RHFACT14K01V by STMicroelectronics

RHFACT14K01V by STMicroelectronics is a logic gate with 6 functions. It has a ceramic package and can be surface mounted. It operates at temperatures ranging from -55 to 150 °C and is suitable for military applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,788 parts In-Stock

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4,788

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Anansix

USA . 1,953 parts In-Stock

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1,953

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Vyrian

USA . 726 parts In-Stock

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726

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 269 parts In-Stock

1+ parts

$15.925

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-

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269

$15.925

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Aztec Data Supply Inc.

USA . 230 parts In-Stock

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$23.220

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230

$23.220

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IDEA Electronic Components Group

UK . 1,246 parts In-Stock

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$25.263

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$22.737

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$25.263

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$22.737

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Corohmni

South Africa . 384 parts In-Stock

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$27.232

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384

$27.232

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Ampacity Inc.

Singapore . 1,221 parts In-Stock

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$28.000

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$28.000

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MKK Technologies

India . 1,251 parts In-Stock

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$47.506

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1,251

$47.506

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DigiPath Technology Company

USA . 1,251 parts In-Stock

1+ parts

$47.506

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$47.506

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Continental Prestige Electronics

USA . 6,812 parts In-Stock

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Corphita

USA . 4,313 parts In-Stock

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Argo Parts USA

USA . 2,438 parts In-Stock

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2,438

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Parana Technologies

USA . 1,786 parts In-Stock

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$30.206

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$30.206

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Bastille Electronics

Australia . 17 parts In-Stock

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Overview

Experience the power of the RHFACT14K01V by STMicroelectronics, a leading manufacturer in the industry. This logic gate is designed to provide reliable performance and exceptional quality. With its advanced technology and precision engineering, it offers numerous benefits and advantages to customers. Whether you're looking for high-speed operation or low power consumption, this versatile device delivers it all. From automotive systems to industrial applications, the RHFACT14K01V is the perfect solution for your needs. Trust STMicroelectronics to deliver excellence every time.

Feature Benefit Bullets

Package Body Material

CERAMIC - The ceramic package body material ensures excellent thermal conductivity, making this logic gate highly reliable in various o/ating conditions.

Surface Mount

YES - With surface mount capability, this logic gate can be easily integrated onto circuit boards, simplifying the assembly process and enhancing space efficiency.

No. of Functions

6 - Offering six functions in a single package, this logic gate provides versatility and cost-effectiveness, reducing the need for multiple components.

Screening Level

38535V;38534K;883S - Meeting stringent screening levels, this logic gate is suitable for applications where high reliability and /formance are crucial, ensuring optimal functionality.

Package Shape

RECTANGULAR - The rectangular package shape allows for easy mounting and integration, facilitating seamless integration into various electronic systems.

Nominal Supply Voltage / Vsup (V)

5 - O/ating at a nominal supply voltage of 5V, this logic gate is compatible with standard power supply configurations, ensuring compatibility and flexibility in design.

Power Supplies (V)

5 - With a dedicated power supply of 5V, this logic gate delivers consistent and reliable power to enable accurate and efficient signal processing.

No. of Terminals

14 - Offering 14 terminals, this logic gate provides an extensive range of input and output options, enabling flexible and versatile connectivity for diverse circuit configurations.

Package Style (Meter)

FLATPACK - The flatpack package style enhances the ease of installation and assembly, improving overall reliability and maintaining a compact form factor.

Maximum O/ating Tem/ature

150 °C - With a maximum o/ating tem/ature of 150°C, this logic gate can handle demanding environments, ensuring optimal /formance even under high-tem/ature conditions.

Minimum O/ating Tem/ature

55 °C - O/ating reliably at tem/atures as low as -55°C, this logic gate is suitable for use in extreme cold environments, guaranteeing stable o/ation in various conditions.

Terminal Position

DUAL - Featuring a dual terminal position, this logic gate provides flexibility in circuit board layout and allows for easier connections, enhancing ease of use and installation efficiency.

Maximum Seated Height

2.72 mm - With a maximum seated height of 2.72mm, this logic gate offers a compact design, reducing space requirements and enabling efficient integration in tight electronic assemblies.

Width

6.345 mm - The compact width of 6.345mm ensures space-saving installation, making it an ideal choice for applications with limited board space.

Minimum Supply Voltage (Vsup)

4.5 V - O/ating at a minimum supply voltage of 4.5V, this logic gate provides flexibility in power source options, allowing for compatibility with a wide range of systems.

Length

9.5 mm - The compact length of 9.5mm ensures minimal footprint, enabling seamless integration of this logic gate into space-constrained electronic devices and systems.

Tem/ature Grade

MILITARY - This logic gate meets military-grade tem/ature standards, ensuring durability and reliability in demanding and harsh environments.

Total Dose (V)

300k Rad(Si) - With a total dose of 300k Rad(Si), this logic gate exhibits robust radiation tolerance, making it suitable for use in aerospace and nuclear applications.

Schmitt Trigger

YES - The inclusion of a Schmitt trigger in this logic gate ensures robust noise immunity, preventing false signal triggering and enhancing overall system stability.

Technology

CMOS - Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this logic gate delivers high-speed /formance, low power consumption, and excellent noise margin.

Terminal Form

FLAT - Featuring a flat terminal form, this logic gate offers hassle-free installation and soldering, ensuring reliable and secure connections for optimal signal transmission.

Packing Method

TR - This logic gate is packed in tape and reel packaging, simplifying handling, transportation, and storage, improving production efficiency.

Terminal Pitch

1.27 mm - The terminal pitch of 1.27mm enables easy and accurate installation onto circuit boards, facilitating precise connections and reducing assembly time.

Maximum Supply Voltage (Vsup)

5.5 V - With a maximum supply voltage of 5.5V, this logic gate can handle voltage fluctuations or surges, ensuring robust /formance and protection against power spikes.

Technical Specifications

Logic Gates RHFACT14K01V attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

ACT

JESD-30 Code:

R-CDFP-F14

Length:

9.5 mm

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Power Supplies (V):

5

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

38535V;38534K;883S

Maximum Seated Height:

2.72 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

6.345 mm

Trade Compliance

RHFACT14K01V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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