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RHFAC00K03V

STMicroelectronics

RHFAC00K03V by STMicroelectronics

RHFAC00K03V by STMicroelectronics is a military-grade CMOS logic gate with 4 functions and operates b/w -55 °C to 150 °C. It features a ceramic, metal-sealed package and supports supply voltages from 2V to 6V. Ideal for high-reliability applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,581 parts In-Stock

1+ parts

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2,581

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Anansix

USA . 1,695 parts In-Stock

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1,695

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Digiode

USA . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,206 parts In-Stock

1+ parts

$31.136

100+ parts

-

1k+ parts

$28.023

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2,206

$31.136

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$28.023

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MKK Technologies

India . 253 parts In-Stock

1+ parts

$58.550

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253

$58.550

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DigiPath Technology Company

USA . 253 parts In-Stock

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$58.550

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253

$58.550

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Corphita

USA . 4,274 parts In-Stock

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4,274

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Parana Technologies

USA . 309 parts In-Stock

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$37.228

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309

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$37.228

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Overview

Unlock exceptional performance in your projects with the RHFAC00K03V from STMicroelectronics. Renowned for its robust quality and reliability, this logic gate is engineered to excel in demanding environments. With military-grade screening and a wide operating temperature range, it ensures durability and precision across various applications including aerospace, industrial controls, and telecommunications. Choose RHFAC00K03V for peace of mind and superior functionality that elevates your designs to new heights!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package enhances reliability and protects the internal components from environmental factors.

Surface Mount: YES

Surface mount capability allows for easier assembly and improved performance in compact electronic designs.

No. of Functions: 4

Having four functions in one package increases design flexibility and reduces board space requirements.

Screening Level: MIL-PRF-38535 Class V

Meets stringent military standards, ensuring high reliability and performance in demanding applications.

No. of Inputs: 2

With two input capabilities, this logic gate can effectively manage complex logic operations.

Package Shape: RECTANGULAR

The rectangular shape contributes to efficient layout designs and effective utilization of PCB space.

Nominal Supply Voltage / Vsup (V): 3

A standard nominal supply voltage makes it compatible with various digital systems, enhancing usability.

No. of Terminals: 14

The 14 terminals offer sufficient connectivity options, enabling diverse configurations and applications.

Package Style (Meter): FLATPACK

The flatpack style provides a low-profile solution that is ideal for space-constrained applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability in harsh environments, making it suitable for military and industrial use.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures functionality in extreme conditions, perfect for military-grade applications.

Terminal Position: DUAL

Dual terminal position allows for simplified connections and improved signal integrity.

Maximum Seated Height: 2.72 mm

The low seated height facilitates compact designs and is beneficial in applications requiring low profile components.

Width: 6.345 mm

Compact width aids in optimizing PCB layout while maintaining robust performance.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enables operation in energy-efficient applications.

Length: 9.5 mm

The length is optimized for various circuit layouts, making it adaptable to different design requirements.

Temperature Grade: MILITARY

Military grade components ensure reliability and compliance in defense and aerospace applications.

Total Dose (V): 300k Rad(Si)

High total radiation dose tolerance makes it suitable for space applications and environments with significant radiation exposure.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, enhancing overall efficiency.

Terminal Form: FLAT

Flat terminals provide strong mechanical connections and improve the stability of the device during performance.

Packing Method: TR

Tape and reel packing method simplifies handling and automated assembly processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is compatible with standard PCB layouts, enhancing usability in various designs.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V provides flexibility for integration into different circuit configurations.

Technical Specifications

Logic Gates RHFAC00K03V attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F14

Length:

9.5 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL14,.25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

6.345 mm

Trade Compliance

RHFAC00K03V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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