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RHFAC04K02V

STMicroelectronics

RHFAC04K02V by STMicroelectronics

RHFAC04K02V by STMicroelectronics is a military-grade CMOS logic gate with 6 functions, operating b/w -55 °C and 150 °C. It features a ceramic, metal-sealed package and supports supply voltages from 2V to 6V. Ideal for high-reliability applications in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,516 parts In-Stock

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Vyrian

USA . 798 parts In-Stock

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Digiode

USA . 202 parts In-Stock

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202

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 175 parts In-Stock

1+ parts

$9.080

100+ parts

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$8.172

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175

$9.080

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$8.172

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MKK Technologies

India . 125 parts In-Stock

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$17.075

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$17.075

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DigiPath Technology Company

USA . 125 parts In-Stock

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$17.075

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$17.075

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Corphita

USA . 1,701 parts In-Stock

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Parana Technologies

USA . 17 parts In-Stock

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$10.857

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$10.857

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Overview

Unlock unparalleled performance with the RHFAC04K02V from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This exceptional logic gate, crafted for extreme conditions, ensures reliability across diverse applications—military, aerospace, and more. Its robust design offers superior thermal stability and durability, making it the ideal choice for critical systems. Choose STMicroelectronics for unmatched quality and innovation that propels your projects to new heights!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package material ensures high reliability and provides excellent protection against environmental stress.

Surface Mount: YES

Surface mount capability allows for easier integration in modern electronic designs, enabling smaller and more compact circuit layouts.

No. of Functions: 6

Having six functions means this logic gate can perform multiple tasks, making it versatile and suitable for complex applications.

Screening Level: MIL-PRF-38535 Class V

This screening level indicates high levels of reliability and performance, ideal for demanding military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this product energy-efficient, extending battery life in portable applications.

No. of Terminals: 14

With 14 terminals, this logic gate offers sufficient connectivity options for complex circuit configurations.

Package Style (Meter): FLATPACK

The flatpack package style allows for a lower profile on the PCB, which is advantageous in space-constrained designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature means this logic gate can function reliably in extreme environments.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes this product suitable for applications in harsh climates.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in designing circuit layouts and enhances signal integrity.

Maximum Seated Height: 2.33 mm

A low seated height contributes to a compact design, facilitating the creation of thin-profile electronic devices.

Width: 6.91 mm

The width dimension supports a compact design, making it easier to fit into tight spaces on circuit boards.

Minimum Supply Voltage (Vsup): 2 V

Operating with a minimum supply voltage of 2V allows compatibility with a wide range of power sources.

Length: 9.95 mm

The length is optimized for space efficiency, allowing for denser circuit designs.

Temperature Grade: MILITARY

Military temperature grading ensures reliability and performance in extreme conditions, making this product suitable for defense applications.

Total Dose (V): 300k Rad(Si)

A total dose tolerance of 300k Rad(Si) indicates suitability for use in radiation-prone environments, such as space applications.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, ensuring efficient operation.

Terminal Form: FLAT

Flat terminals facilitate easier soldering and connection to printed circuit boards, improving assembly processes.

Packing Method: TR

Tape and reel (TR) packing simplifies automated assembly processes, enhancing production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact layouts while maintaining manageable spacing for reliable connections.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V provides flexibility in power supply choices, catering to a variety of application needs.

Technical Specifications

Logic Gates RHFAC04K02V attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Additional Features:

SEATED HT-CALCULATED

Family:

AC

JESD-30 Code:

R-CDFP-F14

Length:

9.95 mm

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.33 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

6.91 mm

Trade Compliance

RHFAC04K02V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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