Loading...

RHFAC00K04V

STMicroelectronics

RHFAC00K04V by STMicroelectronics

RHFAC00K04V by STMicroelectronics is a military-grade CMOS logic gate with 4 functions and operates b/w -55 °C to 150 °C. It features a ceramic, metal-sealed package and supports supply voltages from 2V to 6V. Ideal for high-reliability applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,152

-

-

-

-

Digiode

USA . 1,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,980

-

-

-

-

Anansix

USA . 646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

646

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 24 parts In-Stock

1+ parts

$9.586

100+ parts

-

1k+ parts

$8.628

10k+ parts

-

24

$9.586

-

$8.628

-

MKK Technologies

India . 2,103 parts In-Stock

1+ parts

$18.027

100+ parts

-

1k+ parts

-

10k+ parts

-

2,103

$18.027

-

-

-

DigiPath Technology Company

USA . 2,103 parts In-Stock

1+ parts

$18.027

100+ parts

-

1k+ parts

-

10k+ parts

-

2,103

$18.027

-

-

-

Component Stockers USA

USA . 328 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

328

$99.990

-

-

-

Corphita

USA . 4,628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,628

-

-

-

-

Parana Technologies

USA . 867 parts In-Stock

1+ parts

-

100+ parts

$11.462

1k+ parts

-

10k+ parts

-

867

-

$11.462

-

-

Overview

Elevate your designs with the RHFAC00K04V from STMicroelectronics, a premier choice in logic gates that ensures unmatched reliability and performance. Crafted with military-grade precision, this versatile component thrives in extreme conditions, making it ideal for aerospace, defense, and industrial applications. With its ceramic, metal-sealed packaging and robust operating temperature range, you gain superior quality and peace of mind, empowering your projects to excel in any environment. Choose RHFAC00K04V for innovation that lasts!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction provides excellent protection against environmental factors, enhancing reliability in harsh conditions.

Surface Mount: YES

Surface mount technology allows for reduced PCB space and improved assembly efficiency, making it suitable for compact designs.

No. of Functions: 4

Offering multiple functions in a single package increases design flexibility and reduces the overall component count in applications.

Screening Level: MIL-PRF-38535 Class V

This high screening level ensures that the product meets stringent military and aerospace standards, ensuring reliability and performance.

No. of Inputs: 2

Dual-input functionality allows for versatile logic gate configurations, making this product suitable for a variety of logic applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout on PCBs and optimizes space utilization within electronic designs.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal voltage of 3V makes this product compatible with low-power applications, enhancing energy efficiency.

No. of Terminals: 14

With 14 terminals, this component provides ample connectivity options for various configurations while maintaining a compact form factor.

Package Style (Meter): FLATPACK

Flatpack packaging offers a low profile which is ideal for space-constrained applications and promotes better cooling.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable performance in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -55 °C

The ability to operate at extremely low temperatures expands the range of applications to extreme environments, such as aerospace and military.

Terminal Position: DUAL

Dual terminal positions facilitate simpler PCB layouts and more flexible design options, improving the overall integration process.

Maximum Seated Height: 2.72 mm

A low seated height minimizes the total height of the device on the PCB, which is essential for low-profile designs.

Width: 6.345 mm

A compact width allows for high-density circuit designs, optimizing space on PCBs without sacrificing functionality.

Minimum Supply Voltage (Vsup): 2 V

This low minimum supply voltage enhances compatibility with battery-powered applications, ensuring longer operational life.

Length: 9.5 mm

The moderate length contributes to compact design possibilities while still accommodating necessary connections.

Temperature Grade: MILITARY

Military-grade components are built to withstand rigorous operational demands, ensuring high reliability in critical applications.

Total Dose (V): 300k Rad(Si)

The capability of withstanding high radiation levels makes this product suitable for use in space and nuclear applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, which is essential for battery-operated and high-performance systems.

Terminal Form: FLAT

Flat terminals support good solderability and improve electrical connections in surface-mount applications.

Packing Method: TR

Tape and reel packing allows for automated placement in production, increasing manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables greater flexibility in PCB layout while ensuring reliable connections.

Maximum Supply Voltage (Vsup): 6 V

The ability to operate at a maximum of 6V provides versatility for a range of applications without compromising performance.

Technical Specifications

Logic Gates RHFAC00K04V attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AC

JESD-30 Code:

R-CDFP-F14

Length:

9.5 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL14,.25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

6.345 mm

Trade Compliance

RHFAC00K04V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19