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M87C257-10C7TR

STMicroelectronics

M87C257-10C7TR by STMicroelectronics

M87C257-10C7TR by STMicroelectronics is a 32Kx8 OTP ROM with a 5V supply, ideal for industrial applications. It features a max operating temp of 105 °C and access time of 100 ns. This compact chip carrier design ensures efficient performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,631 parts In-Stock

1+ parts

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4,631

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Vyrian

USA . 2,070 parts In-Stock

1+ parts

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2,070

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Anansix

USA . 1,245 parts In-Stock

1+ parts

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1,245

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 412 parts In-Stock

1+ parts

$5.343

100+ parts

-

1k+ parts

$4.809

10k+ parts

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412

$5.343

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$4.809

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MKK Technologies

India . 1,858 parts In-Stock

1+ parts

$10.048

100+ parts

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10k+ parts

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1,858

$10.048

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DigiPath Technology Company

USA . 1,858 parts In-Stock

1+ parts

$10.048

100+ parts

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1,858

$10.048

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Corphita

USA . 2,890 parts In-Stock

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2,890

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Parana Technologies

USA . 1,678 parts In-Stock

1+ parts

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100+ parts

$6.389

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1,678

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$6.389

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Overview

Unlock the power of innovation with the M87C257-10C7TR from STMicroelectronics, a leading name in advanced semiconductor solutions. This high-quality OTP ROM offers exceptional reliability and performance, perfect for diverse applications like automotive, industrial control, and consumer electronics. Designed to thrive in extreme temperatures, it ensures your projects run smoothly under any conditions. Choose STMicroelectronics for unmatched quality and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the product's reliability and longevity, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for efficient PCB design and space-saving installation, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient, facilitating compact arrangements in electronic circuits.

Input/Output Type: COMMON

Having a common I/O type simplifies integration into systems, providing flexibility in connectivity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with a wide range of devices and power supplies.

Power Supplies (V): 5

A consistent power supply requirement helps maintain device performance and stability in various applications.

No. of Terminals: 32

With 32 terminals, the device supports flexible configurations for diverse applications and simplifying connections.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides efficient thermal management and easy attachment to circuits.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature ensures the product can function reliably in demanding environments.

Organization: 32KX8

This organization supports 32,768 words of 8 bits each, providing ample memory capacity for various applications.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for versatile interfacing, enabling multiple devices to share common data lines.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature means the device can perform reliably in cold environments, broadening its potential use cases.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, improving the overall durability of connections.

Terminal Position: QUAD

Quad terminal position promotes efficient routing and connections on circuit boards, optimizing space utilization.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable performance in harsh environments, suitable for commercial and industrial applications.

Technology: CMOS

CMOS technology allows low power consumption and high speed, enhancing the efficiency of the device.

Terminal Form: J BEND

J bend terminals simplify board placement and soldering process, resulting in a more reliable assembly.

Maximum Supply Current: 30 mA

A maximum supply current of 30 mA ensures the device can handle various operational requirements efficiently.

No. of Words: 32768 words

With a capacity of 32,768 words, this product meets the needs for applications requiring substantial memory storage.

Memory Width: 8

An 8-bit memory width balances efficiency and storage, making it suitable for a variety of data processing tasks.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact design while maintaining sufficient spacing for reliable connections.

No. of Words Code: 32K

The 32K words code reflects the high memory capability, suitable for applications requiring non-volatile data storage.

Memory Density: 262144 bit

A memory density of 262,144 bits provides ample storage for complex applications and data requirements.

Memory IC Type: OTP ROM

As an OTP ROM, this memory type allows for one-time programming, ideal for use in secure applications.

Maximum Standby Current: 0.0001 Amp

A low maximum standby current improves energy efficiency, making it suitable for battery-operated devices.

Maximum Access Time: 100 ns

With a maximum access time of 100 ns, this device ensures fast read times, which is critical for responsive systems.

Technical Specifications

OTP ROM M87C257-10C7TR attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

M87C257-10C7TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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