Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M87C257-10C3 by STMicroelectronics is a 32Kx8 OTP ROM with a max access time of 100 ns, ideal for automotive applications. It operates asynchronously at 5V and features a compact chip carrier package. With a temp range of -40 °C to 125 °C, it ensures reliability in harsh environments.
Median Price
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IDEA Electronic Components Group
$2.311
$2.080
MKK Technologies
$4.346
DigiPath Technology Company
Corphita
Parana Technologies
$2.763
The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.
Surface mount technology allows for compact design and efficient space utilization on printed circuit boards.
The rectangular shape enhances compatibility with standard PCB layouts, facilitating easier integration.
Asynchronous operation allows for flexible and rapid access to data, enhancing performance in time-sensitive applications.
Common I/O type simplifies circuit designs and enhances reliability through standardized connections.
A nominal supply voltage of 5V is widely supported in various electronic devices, ensuring broad compatibility.
The device’s requirement for 5V power supply makes it convenient for integration into standard systems.
Having 32 terminals provides ample connectivity options for various configurations and applications.
The chip carrier package style allows for easy handling and soldering during the manufacturing process.
A high maximum operating temperature ensures reliability in demanding environments, particularly in automotive applications.
The 32Kx8 organization enables efficient data storage and retrieval processes, catering to diverse application needs.
The 3-state output feature allows for better bus management in multi-device setups, increasing system flexibility.
A wide operating temperature range (-40 °C to 125 °C) is essential for automotive and industrial applications where extreme temperatures may occur.
Matte tin finish provides excellent solderability and reliability, enhancing long-term performance.
The quad terminal position facilitates easier routing on PCBs and reduces potential interference.
A low seated height minimizes space utilization, allowing for more compact designs in electronic products.
A width of 11.43 mm strikes a balance between performance and space-efficiency in circuit design.
The minimum supply voltage ensures functionality across a wide range of power conditions.
The length of 13.97 mm provides good dimensional compatibility with standard PCB layouts.
Rated for automotive applications, this product guarantees reliability and performance in harsh conditions.
CMOS technology allows for low power consumption and high speed, making it suitable for efficient designs.
Parallel access enables faster data retrieval compared to serial, improving overall system performance.
J bend terminals provide robust mechanical connections and easier assembly during manufacturing.
A maximum supply current of 30 mA allows for ample performance in power-sensitive applications.
With 32768 words, it offers substantial storage capacity for embedded applications requiring non-volatile memory.
An 8-bit memory width is suitable for a variety of applications, providing a balance between data density and access efficiency.
A terminal pitch of 1.27 mm ensures compatibility with common PCB designs and facilitates easier soldering.
The 32K word capacity indicates this OTP ROM can handle relatively large data sets, making it versatile for multiple applications.
Supports a maximum supply voltage of 5.5V, making it suitable for a range of power supply configurations.
With a memory density of 262144 bits, it effectively caters to applications needing significant data storage.
As an OTP ROM, it provides a secure way to store critical data in applications requiring tamper-proof memory.
Very low standby current helps minimize power consumption in low-power applications.
A maximum access time of 100 ns significantly boosts performance for applications that require fast data retrieval.
OTP ROM M87C257-10C3 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics
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M87C257-10C3 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
1N4148
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
1554216004
Molex
WIRE AND CABLE;
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Lite-on Semiconductor
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
AT27BV256-70JU
Atmel
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
AT27LV020A-12JU
AT27LV020A-12JU by Microchip: 256KX8 OTP ROM with 3.3V/5V supplies, 120ns access time, and 85°C max temp. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.
DS2502-E48
DS2502-E48 by Maxim Integrated is a 1024-bit OTP ROM with 3/5V power supplies, operating in synchronous mode. Its cylindrical package and through-hole terminals make it suitable for industrial applications requiring reliable non-volatile memory storage. With a temperature range of -40 to 85°C, it offers secure data storage in harsh environments.
JBP28S86MJ
Texas Instruments
JBP28S86MJ by Texas Instruments is a MILITARY-grade OTP ROM with 1KX8 organization, 8192-bit memory density, and 85 ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
DS2502P
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Memory Density: 1024 bit;
AM27C512-200JI
Advanced Micro Devices
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
BQ2026LPR
BQ2026LPR by Texas Instruments is an OTP ROM with 1.5KX1 organization, operating in asynchronous mode at 3/5V. It features a memory density of 1536 bits and operates serially at a max clock frequency of 0.01667 MHz. This IC is commonly used for applications requiring non-volatile memory storage in devices with limited space constraints.
JBP38S03X-30MFK
JBP38S03X-30MFK by Texas Instruments is a 32x8 OTP ROM chip carrier with 20 terminals. It operates at temperatures ranging from -55 to 125°C and has a max access time of 30ns. Ideal for military-grade applications requiring fast memory access in compact form factors.
M38510/20402BEA
Philips Semiconductors
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
SN74S475JP4
SN74S475JP4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It operates b/w 0°C to 70°C, drawing a max supply current of 155mA. Ideal for commercial applications requiring reliable TTL technology in a ceramic rectangular package with dual terminals.
CBP18SA46MJ
The Texas Instruments CBP18SA46MJ is a MIL-STD-883 Class B OTP ROM with 512x8 organization and 4096-bit memory density. It operates b/w -55°C to 125°C, has a max access time of 85ns, and consumes up to 155mA. Ideal for military applications requiring reliable non-volatile memory in harsh environments.
SN74186J4
SN74186J4 by Texas Instruments is a 64x8 OTP ROM IC with TTL technology. It operates b/w 0°C to 70°C, making it suitable for commercial applications. With a package style of IN-LINE and through-hole terminal form, it offers reliable memory storage in various electronic devices.
SN74S472NP3
SN74S472NP3 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
DS2502P+T&R
Analog Devices
Analog Devices' DS2502P+T&R is a 1024-bit OTP ROM with 128x8 organization. Operating at 5V, it has a temperature range of -40 to 85°C. With serial interface and small outline package, it's ideal for industrial applications requiring non-volatile memory storage.
5962-01-417-7349
Texas Instruments' 5962-01-417-7349 is a 512x8 OTP ROM with memory density of 4096 bit. It operates at 5V, has a max access time of 60ns, and supports TTL technology. Ideal for commercial applications requiring non-volatile memory storage in a ceramic rectangular package.
BQ2022ADBZRG4
BQ2022ADBZRG4 by Texas Instruments is an OTP ROM with 1KX1 organization, operating at 2.7V nominal voltage. It features a small outline package style and operates in serial mode. Ideal for applications requiring low power consumption and compact design in temperature-sensitive environments.
TBP18SA030J
TBP18SA030J by Texas Instruments is a 256-bit OTP ROM with 32x8 organization. It operates at 5V, has a max access time of 40ns, and uses CMOS technology. Suitable for commercial applications, it features a rectangular package shape made of ceramic and glass-sealed material.
5962-8851805LA
Defense Logistics Agency
Defense Logistics Agency's 5962-8851805LA is a MILITARY-grade OTP ROM with 512X8 organization, operating at -55 to 125 °C. It features CERAMIC package, SYNCHRONOUS mode, and 24 terminals for parallel connection. Ideal for secure data storage in harsh environments.
5962-01-114-2077
Texas Instruments' 5962-01-114-2077 is a 512x8 OTP ROM with 4096-bit memory density. It operates at 5V, has a max access time of 75ns, and supports TTL technology. Ideal for commercial applications requiring non-volatile memory in a ceramic rectangular package.
Cypress Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
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M87C257-10X3TR
STMicroelectronics
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M87C257-10C6X
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M87C257-10X1TR
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
M87C257-10C7
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M87C257-10C6
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; No. of Words: 32768 words;
M87C257-10X3X
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
M87C257-10C1TR
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M87C257-10C6XTR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Length: 13.995 mm;
M87C257-10C3TR
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
M87C257-10C7XTR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
M87C257-10C7TR
M87C257-10C3XTR
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
M87C257-10X1X
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
M87C257-10C1XTR
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Surface Mount: YES;
M87C257-10C6TR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
M87C257-10C1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
M87C257-10C1X
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;
M87C257-10C3X
M87C257-10C7X
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-609 Code: e3;
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