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M87C257-10C1TR

STMicroelectronics

M87C257-10C1TR by STMicroelectronics

M87C257-10C1TR by STMicroelectronics is a 32Kx8 OTP ROM with a 5V supply, ideal for asynchronous applications. It features a max access time of 100 ns and operates within -40 °C to 70 °C. This compact chip carrier design ensures efficient data storage in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,554 parts In-Stock

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Anansix

USA . 2,278 parts In-Stock

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2,278

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Digiode

USA . 1,079 parts In-Stock

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1,079

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 572 parts In-Stock

1+ parts

$3.365

100+ parts

-

1k+ parts

$3.029

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572

$3.365

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$3.029

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MKK Technologies

India . 607 parts In-Stock

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$6.328

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607

$6.328

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DigiPath Technology Company

USA . 607 parts In-Stock

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$6.328

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607

$6.328

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Corphita

USA . 2,107 parts In-Stock

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Parana Technologies

USA . 1,899 parts In-Stock

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$4.024

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1,899

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$4.024

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Overview

Unlock unparalleled performance with the M87C257-10C1TR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality OTP ROM offers robust reliability and exceptional efficiency, perfect for diverse applications like consumer electronics and automotive systems. Experience faster data access and lower power consumption, empowering your designs with confidence and value. Choose STMicroelectronics for proven excellence that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mount technology allows for easier integration onto PCBs, saving space and improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient board layout, allowing for better space management on the PCB.

Operating Mode: ASYNCHRONOUS

An asynchronous operating mode allows for independent operation of the memory, enabling synchronous performance with other system components.

Input/Output Type: COMMON

The common I/O type simplifies interfacing with other components, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Designed to operate at a nominal supply voltage of 5V, it is compatible with many existing systems and components.

Power Supplies (V): 5

A standardized power supply requirement enhances compatibility with common electronic designs.

No. of Terminals: 32

With 32 terminals, it provides sufficient connection points for reliable integration into complex circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for a robust connection and better thermal dissipation, improving performance in demanding applications.

Maximum Operating Temperature: 70 °C

Supports a maximum operating temperature of 70 °C, making it suitable for a variety of ambient conditions and applications.

Organization: 32KX8

The 32K x 8 organization makes it optimal for applications requiring moderate storage capacity without increasing complexity.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for multiple devices to be connected to a single bus, facilitating better communication in complex systems.

Minimum Operating Temperature: 0 °C

The operational temperature range starting from 0 °C ensures reliable performance in standard indoor conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, enhancing the longevity of the connections.

Terminal Position: QUAD

Quad terminal positioning provides a compact layout while maintaining ease of access for connections.

Maximum Seated Height: 3.56 mm

A low seated height allows for compact designs and is beneficial in space-constrained environments.

Width: 11.43 mm

The width allows for dense packaging on PCB designs, which is advantageous for small electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V enables operation under a wide range of supply conditions, enhancing versatility.

Length: 13.97 mm

This length provides a balanced footprint that accommodates efficient PCB layouts without sacrificing space.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability in general-purpose applications, making it suitable for consumer electronics.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient and reliable for OTP ROM applications.

Parallel or Serial: PARALLEL

Parallel access enables faster data retrieval, significantly improving performance in applications where speed is critical.

Terminal Form: J BEND

J bend terminals provide ease of soldering and enhance reliable connectivity, which is essential for production and maintenance.

Maximum Supply Current: 30 mA

A maximum supply current of 30 mA is energy-efficient, helping to extend the battery life of portable applications.

No. of Words: 32768 words

With 32,768 words of memory, it provides sufficient data storage for numerous applications ranging from simple to relatively complex tasks.

Memory Width: 8

An 8-bit memory width is optimal for delivering adequate data throughput in a variety of digital applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compact design and ease of soldering, further supporting versatile applications.

No. of Words Code: 32K

The 32K words coding represents a practical balance between memory capacity and complexity in implementation.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for flexibility in system design and compatibility with various hardware components.

Memory Density: 262144 bit

With a memory density of 262,144 bits, it supports more extensive applications while remaining compact, making it suitable for electronic memory.

Memory IC Type: OTP ROM

As an OTP ROM, this product provides a single-time programmable solution, ideal for secure data storage or firmware applications.

Maximum Standby Current: 0.0001 Amp

A very low maximum standby current augments energy efficiency, beneficial for battery-powered devices.

Maximum Access Time: 100 ns

A maximum access time of 100 ns ensures rapid data retrieval, critical for real-time processing and high-performance applications.

Technical Specifications

OTP ROM M87C257-10C1TR attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

M87C257-10C1TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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