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M74HCT640RM13TR

STMicroelectronics

M74HCT640RM13TR by STMicroelectronics

M74HCT640RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 33 ns and operates at a nominal voltage of 5V. It features a compact SO package, ideal for space-constrained applications. This CMOS device supports bidirectional data flow and is suitable for military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,160 parts In-Stock

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4,160

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Anansix

USA . 2,417 parts In-Stock

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Vyrian

USA . 2,232 parts In-Stock

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2,232

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Distributors (Availability)

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Andel Nordic

Denmark . 1,821 parts In-Stock

1+ parts

$2.224

100+ parts

-

1k+ parts

$2.135

10k+ parts

$2.135

1,821

$2.224

-

$2.135

$2.135

Ampacity Inc.

Singapore . 243 parts In-Stock

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$7.000

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-

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243

$7.000

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Microchip USA

USA . 150 parts In-Stock

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$14.277

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150

$14.277

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IDEA Electronic Components Group

UK . 189 parts In-Stock

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$15.125

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$13.612

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189

$15.125

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$13.612

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AZTECH Wire

Italy . 455 parts In-Stock

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$19.510

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455

$19.510

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MKK Technologies

India . 2,309 parts In-Stock

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$28.441

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$28.441

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DigiPath Technology Company

USA . 2,309 parts In-Stock

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$28.441

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$28.441

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Component Stockers USA

USA . 648 parts In-Stock

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$99.990

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Perfect Parts

USA . 3,919 parts In-Stock

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Corphita

USA . 1,303 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,006 parts In-Stock

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Parana Technologies

USA . 893 parts In-Stock

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$18.084

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Overview

Unlock unparalleled performance and reliability with the M74HCT640RM13TR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust 8-bit bus driver and transceiver is designed for seamless data communication across diverse applications, ensuring optimal efficiency even in extreme conditions. With superior propagation delay and dual-port capability, it empowers your designs to excel while delivering enhanced value, reduced power consumption, and exceptional durability. Elevate your projects with this high-quality component that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures the bus driver is protected from environmental factors, contributing to its longevity.

Propagation Delay At Nominal Supply: 33 ns

A low propagation delay allows for faster data transmission, improving overall system performance.

Surface Mount: YES

Surface mount technology enables compact designs and simplifies manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and optimized use of PCB space.

No. of Bits: 8

An 8-bit data path ensures compatibility with a wide range of applications while providing sufficient data bandwidth.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V makes this device versatile and easy to integrate.

Power Supplies (V): 5

Compatibility with common power supplies further enhances design flexibility and reliability.

No. of Terminals: 20

Having 20 terminals allows for multiple connections, enhancing functionality and performance in applications.

Package Style (Meter): SMALL OUTLINE

A small outline package design reduces PCB space usage while maintaining performance.

Maximum I (ol): 6 Amp

A high output current capability supports demanding applications, making it suitable for extensive bus systems.

Propagation Delay (tpd): 45 ns

The propagation delay allows for a good balance between speed and reliability in data transmission.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows the device to be used in challenging environments.

Output Characteristics: 3-STATE

3-state output capability enhances flexibility in bus systems by allowing multiple devices to share the same bus.

Minimum Operating Temperature: -55 °C

Extensive temperature range makes the product versatile for various environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

A high-quality terminal finish ensures excellent conductivity and durability, reducing the risk of corrosion.

Terminal Position: DUAL

Dual terminal position aids in flexible PCB design and improves signal integrity.

No. of Ports: 2

Having 2 ports allows for bidirectional data flow, crucial for many applications.

Maximum Seated Height: 2.65 mm

Low profile design enables space-saving in applications, making it ideal for compact devices.

Width: 7.5 mm

Compact width makes it easier to fit into dense designs while maintaining performance.

Output Polarity: INVERTED

Inverted output polarity provides flexibility in system design and interfacing with other components.

Minimum Supply Voltage (Vsup): 4.5 V

Allows operation in lower voltage scenarios, enhancing energy efficiency in applications.

Maximum Time At Peak Reflow Temperature (s): 30

A manageable peak reflow time ensures compatibility with modern surface mount soldering processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature facilitates effective soldering processes, ensuring robust connections.

Length: 12.8 mm

Compact length enhances design efficiency by optimizing the available PCB area.

Temperature Grade: MILITARY

Rated for military applications, ensuring reliability and performance under extreme conditions.

Technology: CMOS

CMOS technology offers lower power consumption, making the device efficient for various applications.

Terminal Form: GULL WING

Gull wing terminal form provides excellent mounting stability and ease of soldering.

Packing Method: TR

Tape and reel packing method simplifies handling and automated assembly processes.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with various PCB designs and enhances soldering reliability.

Count Direction: BIDIRECTIONAL

Bidirectional data flow capability improves flexibility and performance in multi-device systems.

Control Type: COMMON CONTROL

Common control type simplifies system design and integration for effective data management.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates reasonable handling precautions, allowing for ease of manufacturing and assembly.

Maximum Supply Voltage (Vsup): 5.5 V

A slightly higher maximum supply voltage provides added flexibility in power supply options.

Technical Specifications

Bus Driver & Transceivers M74HCT640RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

M74HCT640RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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