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M74HCT540RM13TR

STMicroelectronics

M74HCT540RM13TR by STMicroelectronics

M74HCT540RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 30 ns and operates at a nominal voltage of 5V. Its compact SO package features dual terminals and supports military-grade temperatures from -55 °C to 125 °C. Ideal for high-speed data transmission in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,015 parts In-Stock

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7,015

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Anansix

USA . 1,906 parts In-Stock

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1,906

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Digiode

USA . 657 parts In-Stock

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657

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Distributors (Availability)

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Andel Nordic

Denmark . 3,657 parts In-Stock

1+ parts

$5.675

100+ parts

-

1k+ parts

$5.448

10k+ parts

$5.448

3,657

$5.675

-

$5.448

$5.448

AZTECH Wire

Italy . 1,046 parts In-Stock

1+ parts

$8.850

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-

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1,046

$8.850

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Microchip USA

USA . 383 parts In-Stock

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$9.704

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383

$9.704

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IDEA Electronic Components Group

UK . 1,537 parts In-Stock

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$21.223

100+ parts

-

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$19.101

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1,537

$21.223

-

$19.101

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$28.783

100+ parts

$26.193

1k+ parts

$23.602

10k+ parts

-

3,000

$28.783

$26.193

$23.602

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MKK Technologies

India . 1,460 parts In-Stock

1+ parts

$39.909

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1,460

$39.909

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DigiPath Technology Company

USA . 1,460 parts In-Stock

1+ parts

$39.909

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1,460

$39.909

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Perfect Parts

USA . 17,432 parts In-Stock

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17,432

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,122 parts In-Stock

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3,122

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Parana Technologies

USA . 238 parts In-Stock

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$25.376

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238

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$25.376

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Overview

Unlock seamless connectivity with the M74HCT540RM13TR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust 8-bit bus driver ensures superior performance and reliability, making it ideal for a variety of applications—from automotive to industrial automation. Its compact design and high efficiency empower engineers to optimize their systems while benefiting from reduced power consumption and enhanced signal integrity. Experience quality you can rely on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package protects the internal components, ensuring reliability and longevity in various applications.

Propagation Delay At Nominal Supply: 30 ns

Fast propagation delay enhances performance in high-speed applications, allowing for quick signal processing.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making it ideal for modern electronics.

Package Shape: RECTANGULAR

Rectangular form factor provides better layout flexibility on PCBs, facilitating efficient design integration.

No. of Bits: 8

An 8-bit architecture enables effective data transmission and communication, suitable for various digital systems.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage simplifies compatibility with common electronics, ensuring broader usability.

Power Supplies (V): 5

Consistent power supply requirements enhance product reliability and integration into existing systems.

No. of Terminals: 20

Twenty terminals provide ample connections for versatile applications, accommodating numerous configurations.

Package Style (Meter): SMALL OUTLINE

The small outline packaging contributes to space-saving designs, ideal for compact electronic devices.

Maximum I (ol): 6 Amp

A high output current capability ensures robust performance in load driving applications, enhancing overall product efficiency.

Propagation Delay (tpd): 38 ns

A low propagation delay of 38 ns means the device can handle faster clock speeds, suitable for high-performance computing.

Maximum Operating Temperature: 125 °C

A high operating temperature range makes this product suitable for harsh environments, ensuring reliability in extreme conditions.

Output Characteristics: 3-STATE

3-state output allows for versatile signaling options, making it an ideal choice for bus systems where multiple devices share the line.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product is suitable for military and aerospace applications where extreme conditions may be encountered.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing reliability and performance.

Terminal Position: DUAL

Dual terminal position facilitates easier connections in PCB layout, improving assembly efficiency.

No. of Ports: 2

Having two ports allows for versatile communication and data transfer between multiple devices.

Maximum Seated Height: 2.65 mm

A low seated height allows for compact stack designs, making it suitable for space-constrained applications.

Width: 7.5 mm

Compact width enhances the product's adaptability for various PCB layouts without compromising performance.

Output Polarity: INVERTED

Inverted output polarity is useful for specific logic designs, providing flexibility in circuit design.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V allows for operation in slightly lower voltage environments, enhancing its usability range.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with modern assembly processes, enhancing manufacturing efficiency.

Peak Reflow Temperature °C: 260

High reflow temperature supports compatibility with various soldering processes, ensuring durability of solder joints.

Length: 12.8 mm

Compact length provides advantages in tight spaces while maintaining performance integrity.

Temperature Grade: MILITARY

MIL grade designation indicates high reliability and performance in demanding environments, making it suitable for military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated and portable devices.

Terminal Form: GULL WING

Gull wing terminals facilitate a secure and reliable connection, supporting easier soldering during the manufacturing process.

Packing Method: TR

Tape and reel (TR) packing method allows for automated assembly, streamlining the manufacturing process.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports a compact layout while maintaining adequate spacing for assembly and soldering.

Control Type: ENABLE LOW

Low-enable control type allows for ease of integration into control logic, optimizing design flexibility.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates appropriate handling and storage requirements, conveying reliability in supply chain management.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V permits extended compatibility while safeguarding against overvoltage situations.

Technical Specifications

Bus Driver & Transceivers M74HCT540RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

M74HCT540RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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