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M74HCT244TTR

STMicroelectronics

M74HCT244TTR by STMicroelectronics

M74HCT244TTR by STMicroelectronics is a 4-bit bus driver with a propagation delay of 38 ns and operates at a nominal voltage of 5V. It features a compact SOIC package, ideal for space-constrained applications. This CMOS device supports 3-state outputs, making it suitable for data transmission in digital circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,512 parts In-Stock

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3,512

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Digiode

USA . 2,662 parts In-Stock

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2,662

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Anansix

USA . 2,327 parts In-Stock

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2,327

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LWI Electronics Inc

India . 30 parts In-Stock

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30

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Distributors (Availability)

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Andel Nordic

Denmark . 549 parts In-Stock

1+ parts

$5.024

100+ parts

-

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$4.823

10k+ parts

$4.823

549

$5.024

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$4.823

$4.823

IDEA Electronic Components Group

UK . 1,365 parts In-Stock

1+ parts

$15.067

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$13.560

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1,365

$15.067

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$13.560

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Microchip USA

USA . 319 parts In-Stock

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$15.862

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319

$15.862

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AZTECH Wire

Italy . 620 parts In-Stock

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$20.130

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620

$20.130

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MKK Technologies

India . 2,265 parts In-Stock

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$28.332

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$28.332

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DigiPath Technology Company

USA . 2,265 parts In-Stock

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$28.332

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2,265

$28.332

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Corphita

USA . 3,107 parts In-Stock

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3,107

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Parana Technologies

USA . 1,124 parts In-Stock

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$18.015

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1,124

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$18.015

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Overview

Elevate your designs with the M74HCT244TTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance bus driver ensures seamless data transmission, ideal for automotive and industrial applications where reliability is paramount. With its compact design and efficient power management, enjoy enhanced productivity and reduced costs while benefiting from ST's commitment to quality and excellence. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various environmental conditions.

Propagation Delay At Nominal Supply: 38 ns

A low propagation delay allows for faster signal transmission, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount technology enables compact designs and easy integration into modern electronics.

No. of Functions: 2

Dual functionality increases versatility and efficiency in design, allowing for multiple applications.

Package Shape: RECTANGULAR

The rectangular shape is suitable for a range of circuit board designs, optimizing space utilization.

No. of Bits: 4

With 4 bits, this device supports a wide range of communication protocols, enhancing its utility in various applications.

Nominal Supply Voltage / Vsup: 5 V

Standard nominal voltage of 5V ensures compatibility with most electronic systems.

Load Capacitance (CL): 50 pF

A low load capacitance reduces signal degradation, thereby improving overall system performance.

Power Supplies (V): 5

Operating at a consistent voltage allows for straightforward power management in circuit designs.

No. of Terminals: 20

A higher number of terminals enables more connections and functionalities within the same package.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact, thin profile allows for more efficient use of space in densely packed boards.

Maximum I (ol): 6 Amp

A high output current capability makes this device suitable for driving larger loads.

Propagation Delay (tpd): 50 ns

A propagation delay of 50 ns is suitable for applications requiring moderate speed without significant delays.

Maximum Operating Temperature: 125 °C

High temperature rating allows for reliable operation in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output enables improved control in bus applications, allowing devices to share the same communication lines.

Minimum Operating Temperature: -55 °C

Wide operational temperature range ensures functionality in extreme temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality terminal finish enhances conductivity and resistance to corrosion, ensuring a stable connection.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout, accommodating various design needs.

No. of Ports: 2

Two ports facilitate communication between multiple devices, improving system performance.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2 mm is advantageous for low-profile devices and compact PCB designs.

Width: 4.4 mm

Narrow width allows for higher density designs, fitting more components into limited spaces.

Output Polarity: TRUE

True output polarity simplifies design and integration with standard components.

Minimum Supply Voltage (Vsup): 4.5 V

Lower minimum voltage ensures flexibility in power supply integration.

Maximum Time At Peak Reflow Temperature: 40 s

The reflow specification is suitable for standard soldering processes in production.

Peak Reflow Temperature: 260 °C

High peak temperature allows for compatibility with modern soldering techniques.

Length: 6.5 mm

Compact length supports space-efficient designs on circuit boards.

Temperature Grade: MILITARY

Military-grade specifications ensure higher reliability and performance standards for critical applications.

Technology: CMOS

CMOS technology delivers low power consumption and high-speed performance, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form provides excellent mechanical support and solder joint reliability.

Packing Method: TR

Tape and reel packaging improves ease of handling and automated assembly processes.

Terminal Pitch: 0.65 mm

Fine terminal pitch facilitates tighter placements in compact designs.

Control Type: ENABLE LOW

Low enable control simplifies design and enhances signal integrity by reducing noise.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the product is suitable for standard handling and assembly processes.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum voltage of 5.5 V allows for flexibility in power supply options while preventing overvoltage damage.

Technical Specifications

Bus Driver & Transceivers M74HCT244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

M74HCT244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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