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M74HCT125RM13TR

STMicroelectronics

M74HCT125RM13TR by STMicroelectronics

M74HCT125RM13TR by STMicroelectronics is a 4-channel bus driver with a 32 ns propagation delay and operates at a nominal voltage of 5V. It features a compact SO package, ideal for space-constrained applications. This CMOS device supports 3-state outputs and is suitable for military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 5,950 parts In-Stock

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Digiode

USA . 2,986 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,773 parts In-Stock

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Anansix

USA . 873 parts In-Stock

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Cogito LLC

Ukraine . 2 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 1,403 parts In-Stock

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$4.162

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$3.996

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$3.996

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$3.996

Microchip USA

USA . 487 parts In-Stock

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$7.682

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AZTECH Wire

Italy . 118 parts In-Stock

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$12.160

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IDEA Electronic Components Group

UK . 1,959 parts In-Stock

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$22.562

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$20.306

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MKK Technologies

India . 963 parts In-Stock

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$42.427

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DigiPath Technology Company

USA . 963 parts In-Stock

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$42.427

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,078 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 3,385 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Assy Fe

Spain . 2,480 parts In-Stock

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Corphita

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Parana Technologies

USA . 1,451 parts In-Stock

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$26.976

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Overview

Elevate your designs with the M74HCT125RM13TR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile bus driver & transceiver offers exceptional performance and reliability, ensuring seamless integration into your high-speed applications. With its compact size and robust functionality, you gain enhanced efficiency while reducing board space. Experience the quality and reliability that only ST can deliver—perfect for automotive, industrial, and communication systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances the reliability and longevity of the product, making it suitable for various applications.

Propagation Delay At Nominal Supply: 32 ns

A low propagation delay ensures fast switching and high-speed performance, ideal for applications that require rapid data transmission.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern circuit boards.

No. of Functions: 4

Multi-functional capability enables versatile applications, providing flexibility in design and functionality.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient use of board space, making it easier to fit into tight layouts.

Nominal Supply Voltage / Vsup (V): 5

Standard nominal supply voltage makes it compatible with a wide range of electronic circuits and devices.

Load Capacitance (CL): 50 pF

A low load capacitance contributes to higher speed operations and minimizes signal degradation.

Power Supplies (V): 5

Operating on a common power supply of 5V simplifies power management across various components in the circuit.

No. of Terminals: 14

A sufficient number of terminals allows for multiple connections and makes the device versatile in its applications.

Package Style (Meter): SMALL OUTLINE

Small outline packaging reduces footprint on PCBs, enabling more efficient use of space in compact designs.

Maximum I (ol): 6 Amp

A high output current capability of 6 Amps supports robust performance in demanding applications.

Propagation Delay (tpd): 41 ns

The propagation delay ensures consistent and reliable data transfer in high-speed digital circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating ensures reliability and performance in a wide range of environments.

Output Characteristics: 3-STATE

3-state output capability allows for greater control in data transmission, reducing bus congestion.

Minimum Operating Temperature: -55 °C

The wide temperature range makes this product suitable for extreme conditions, enhancing versatility in applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishing ensures excellent conductivity and resistance to corrosion, improving reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible layout options during PCB design.

No. of Ports: 2

Having two ports enhances the device's ability to interface with multiple systems or channels.

Maximum Seated Height: 1.75 mm

A low seated height contributes to sleek, low-profile designs that are advantageous in modern electronics.

Width: 3.9 mm

Compact width enables efficient layout design, particularly in space-constrained applications.

Output Polarity: TRUE

True output polarity is essential for certain applications, ensuring correct logic level interfacing.

Minimum Supply Voltage (Vsup): 4.5 V

Allows for flexibility in operating voltages in various applications, accommodating different system requirements.

Length: 8.65 mm

A compact length aids in minimal board space usage while providing essential functionality.

Temperature Grade: MILITARY

Designed for military specifications, ensuring robustness and reliability in mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull-wing terminal form facilitates easy soldering and ensures reliable connections in surface mount applications.

Packing Method: TR

Tape and reel packing method simplifies automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

Standard terminal pitch supports compatibility with various PCB designs and assembly methods.

Control Type: ENABLE LOW

Low enable control simplifies integration and helps in power saving by allowing selective disabling of the device.

Maximum Supply Voltage (Vsup): 5.5 V

The flexibility of a maximum supply voltage enhances compatibility with a variety of electronic systems.

Technical Specifications

Bus Driver & Transceivers M74HCT125RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

41 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

M74HCT125RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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