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M74HC245RM13TR

STMicroelectronics

M74HC245RM13TR by STMicroelectronics

M74HC245RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 27 ns, ideal for high-speed data transmission. It operates b/w 2V and 6V, supporting bidirectional communication in compact designs. With a military-grade temperature range of -55 °C to 125 °C, it's perfect for demanding applications.

Median Price

$0.325

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 402 parts In-Stock

1+ parts

$0.325

100+ parts

$0.341

1k+ parts

$0.321

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402

$0.325

$0.341

$0.321

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Vyrian

USA . 8,734 parts In-Stock

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LWI Electronics Inc

India . 6,660 parts In-Stock

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6,660

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Pegasus Components GmbH

Germany . 3,000 parts In-Stock

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Digiode

USA . 1,793 parts In-Stock

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Anansix

USA . 1,360 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,297 parts In-Stock

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Rebound Electronics

UK . 1,000 parts In-Stock

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MISTER SPROCKETS

USA . 900 parts In-Stock

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900

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Inventory MP

USA . 652 parts In-Stock

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652

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Bristol Electronics

USA . 652 parts In-Stock

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652

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 620 parts In-Stock

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620

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LIBRA Elektronik GmbH

Germany . 379 parts In-Stock

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379

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ComSIT Distribution GmbH

Germany . 184 parts In-Stock

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PC Components Company LLC

USA . 40 parts In-Stock

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40

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Prism Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,374 parts In-Stock

1+ parts

$7.986

100+ parts

-

1k+ parts

$7.667

10k+ parts

$7.667

2,374

$7.986

-

$7.667

$7.667

AZTECH Wire

Italy . 219 parts In-Stock

1+ parts

$9.000

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219

$9.000

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IDEA Electronic Components Group

UK . 950 parts In-Stock

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$19.763

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$17.786

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950

$19.763

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$17.786

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MKK Technologies

India . 2,160 parts In-Stock

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$37.162

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2,160

$37.162

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DigiPath Technology Company

USA . 2,160 parts In-Stock

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$37.162

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2,160

$37.162

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,738 parts In-Stock

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Perfect Parts

USA . 15,399 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Microchip USA

USA . 8,114 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,295 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,000 parts In-Stock

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Corphita

USA . 2,532 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,270 parts In-Stock

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2,270

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Parana Technologies

USA . 2,160 parts In-Stock

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$23.629

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$23.629

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Formix International (Excess)

India . 2,150 parts In-Stock

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Assy Fe

Spain . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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S.R.D Solutions

India . 512 parts In-Stock

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512

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Overview

Unlock seamless communication in your electronic designs with the M74HC245RM13TR from STMicroelectronics. Renowned for quality and innovation, STMicroelectronics delivers a robust bus driver that enhances data transfer efficiency while ensuring reliability across diverse applications—from automotive to industrial electronics. Experience optimized performance, reduced delays, and exceptional durability, bringing unmatched value to your projects. Elevate your designs and trust in a leader committed to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental stressors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 27 ns

A fast propagation delay of 27 ns allows for quick signal transmission, enhancing the performance of high-speed applications.

Surface Mount: YES

Surface mount technology facilitates easier assembly and allows for more compact circuit designs.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of PCB space, which is beneficial for tight layouts.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data communication tasks, making it versatile for multiple applications.

Nominal Supply Voltage / Vsup (V): 4.5

A nominal supply voltage of 4.5 V ensures compatibility with a broad range of devices, contributing to design flexibility.

Power Supplies (V): 2/6

The capability to operate at power supplies between 2V and 6V allows for versatile usage in various circuit designs.

No. of Terminals: 20

Having 20 terminals provides ample connection options, accommodating more complex device configurations.

Package Style (Meter): SMALL OUTLINE

The small outline of the package style is optimized for space-saving designs, making it ideal for compact electronics.

Maximum I (ol): 6 Amp

A maximum output current of 6 Amps enables the driver to manage substantial loads, suitable for power-intensive applications.

Propagation Delay (tpd): 180 ns

Though slightly higher than the nominal, a propagation delay of 180 ns is still favorable for timing-critical applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is capable of functioning in extreme conditions, enhancing reliability.

Output Characteristics: 3-STATE

The 3-state output capability enhances communication flexibility, allowing for better control in multiplexed environments.

Minimum Operating Temperature: -55 °C

A wide operational temperature range starting from -55 °C ensures robust functionality in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish guarantees excellent durability and reliability in electrical connectivity.

Terminal Position: DUAL

Dual terminal positions enable increased layout flexibility on PCB designs, catering to various practical applications.

No. of Ports: 2

The presence of 2 ports allows for bidirectional communication, enhancing data transfer capabilities.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm aids in minimizing the overall profile of the assembly, ideal for space-constrained designs.

Width: 7.5 mm

At 7.5 mm wide, this product fits comfortably into narrow PCB layouts while maintaining performance.

Output Polarity: TRUE

True output polarity ensures consistent signal integrity across different circuit configurations.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V allows for operation in low-power applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Supports soldering processes, with a maximum peak reflow temperature time of 30 seconds, contributing to reliable assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature tolerance of 260 °C facilitates compatibility with standard soldering processes, ensuring robust PCB assembly.

Length: 12.8 mm

At 12.8 mm long, it is compact and easily fits within standard PCB dimensions for various applications.

Temperature Grade: MILITARY

MILITARY temperature grading guarantees high reliability and performance in demanding applications.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high-speed operation, making it ideal for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and enhance mechanical stability, ensuring long-lasting performance.

Packing Method: TR

The TR packing method offers convenience in handling and storage, therefore streamlining the manufacturing process.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard for many PCB layouts, simplifying design integration.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability contributes to enhanced communication efficiency in digital circuits.

Control Type: COMMON CONTROL

Common control type simplifies circuit design and implementation, enabling easier system integration.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates moderate sensitivity to moisture, guiding proper handling and storage practices.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V provides flexibility in applications requiring higher operational voltage.

Technical Specifications

Bus Driver & Transceivers M74HC245RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

M74HC245RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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